IP Library Granted Patent US 6,777,326
Granted Patent Utility
US 6,777,326 · Confirmation No. 1289

METHOD FOR FORMING MULTI-LAYER METAL LINE OF SEMICONDUCTOR DEVICE

Inventor: Jun Ho Yoon
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Code Description Pages PDF
2014-11-25 OATH Oath or Declaration filed 56 View
2004-07-07 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-04-23 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2004-04-23 FOR Foreign Reference 11 View
2004-03-18 WFEE Fee Worksheet (SB06) 1 View
2004-03-18 FWCLM Index of Claims 1 View
2002-12-30 TRNA Transmittal of New Application 1 View
2002-12-30 A.PE Preliminary Amendment 3 View
2002-12-30 SPEC Specification 14 View
2002-12-30 CLM Claims 4 View
2002-12-30 ABST Abstract 1 View
2002-12-30 DRW Drawings-only black and white line drawings 4 View
2002-12-30 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,777,326
App. No.
10/330,060
Filed
2002-12-30
Granted
2004-08-17
Pub. No.
US20030129830A1
Examiner
LEE, CALVIN
Art Unit
2825
PTA
-24 days