Ingan-based light-emitting diode chip and a method for the production thereof
View Patent ↗A light-emitting diode chip ( 1 ), in which over a substrate ( 2 ), a series of epitaxial layers ( 3 ) with a radiation-emitting active structure ( 4 ) based on InGaN is disposed. Between the substrate ( 2 ) and the active structure ( 4 ), a buffer layer ( 20 ) is provided. The material or materials of the buffer layer ( 20 ) are selected such that their epitaxial surface ( 6 ) for the epitaxy of the active structure ( 4 ) is unstressed or slightly stressed at their epitaxial temperature. The active structure ( 4 ) has In-rich zones ( 5 ), disposed laterally side by side relative to the epitaxial plane, in which zones the In content is higher than in other regions of the active structure ( 4 ). A preferred method for producing the chip is disclosed.
1. A light-emitting diode chip, comprising:
a series of epitaxial layers including a radiation-emitting, InGaN-based active structure disposed over a substrate, and a buffer layer having at least one layer, the buffer layer being disposed between the substrate and the active structure,
wherein material forming the buffer layer is such that an epitaxial surface thereof for epitaxy of the active structure is unstressed or slightly stressed at their epitaxial temperature, the epitaxial surface for epitaxy of the active structure being on the buffer layer, and
wherein the active structure has In-rich zones disposed laterally side by side in a plane which is parallel to said epitaxial surface, and wherein an In content in the In-rich zones is higher than in other regions of the active structure.
2. The light-emitting diode chip of claim 1 , wherein the substrate substantially comprises SiC.
3. The light-emitting diode chip of claim 1 , wherein the active structure has a single-quantum-well structure or a multiple-quantum-well structure that contains the In-rich zones.
4. The light-emitting diode chip of claim 1 , wherein the buffer layer comprises a series of buffer layers including an AlGaN:Si layer and a GaN:Si layer located downstream thereof in a direction of growth, the GaN:Si layer having a thickness of between 1 μm and 3 μm and a surface that forms the epitaxial surface for epitaxy of the active structure.
5. A method for producing an InGaN-based light-emitting component by depositing on a substrate a series of epitaxial layers which include a radiation-emitting InGaN-based active structure and a buffer layer, wherein the method comprises the steps of:
selecting material forming the buffer layer such that an epitaxial surface of the buffer layer for epitaxy of the radiation-emitting active structure is unstressed or slightly stressed at their epitaxial temperatures;
epitaxially growing the buffer layer over the substrate from said selected material; and
epitaxially growing the active structure over said epitaxial surface of the buffer layer,
wherein said active structure has In-rich zones disposed laterally side by side in a plane which is parallel to said epitaxial surface, and wherein an In content in the In-rich zones is higher than in other regions of the active structure.
6. The method of claim 5 , wherein the active structure comprises a multiple-quantum-well structure having an InGaN quantum well.
7. The method of claim 5 , wherein the substrate comprises SiC.
8. The method of claim 5 , wherein the method comprises the steps of:
forming the buffer layer by
a. forming an AlGaN:Si layer having a thickness of a few hundred nanometers over the substrate, and
b. forming a GaN:Si layer having a thickness of between 1 μm and 3 μm over the AlGaN:Si layer; and
in said step of forming the radiation-emitting active structure, said active structure is formed on a surface of the GaN:Si layer.
9. The method of claim 6 , wherein the method comprises the steps of:
forming the buffer layer by
a. forming an AlGaN:Si layer having a thickness of a few hundred nanometers over the substrate, and
b. forming a GaN:Si layer having a thickness of between 1 μm and 3 μm over the AlGaN:Si layer; and
in said step of forming the radiation-emitting active structure, said active structure is formed on a surface of the GaN:Si layer.
10. The method of claim 7 , wherein the method comprises the steps of:
forming the buffer layer by
a. forming an AlGaN:Si layer having a thickness of a few hundred nanometers over the substrate, and
b. forming a GaN:Si layer having a thickness of between 1 μm and 3 μm over the AlGaN:Si layer; and
in said step of forming the radiation-emitting active structure, said active structure is formed on a surface of the GaN:Si layer.
11. The light-emitting diode chip of claim 2 , wherein the buffer layer comprises a series of buffer layers including an AlGaN:Si layer and a GaN:Si layer located downstream thereof in a direction of growth, the GaN:Si layer having a thickness of between 1 μm and 3 μm and a surface that forms the epitaxial surface for epitaxy of the active structure.
12. The light-emitting diode chip of claim 3 , wherein the buffer layer comprises a series of buffer layers including an AlGaN:Si layer and a GaN:Si layer located downstream thereof in a direction of growth, the GaN:Si layer having a thickness of between 1 m and 3 μm and a surface that forms the epitaxial surface for epitaxy of the active structure.
13. The light-emitting diode chip of claim 2 , wherein the active structure has a single-quantum-well structure or a multiple-quantum-well structure that contains the In-rich zones.
14. The method of claim 6 , wherein the substrate comprises SiC.
15. The light-emitting diode chip of claim 1 , wherein the epitaxial surface of the buffer layer is un-etched.
16. The light-emitting diode chip of claim 1 , wherein the epitaxial surface of the buffer layer is free from grooves.
17. The light-emitting diode chip of claim 1 , wherein the epitaxial surface of the buffer layer is essentially flat.
18. The light-emitting diode chip of claim 1 , wherein the epitaxial surface of the buffer layer is free from etched structures.
19. The light-emitting diode chip of claim 1 , wherein the epitaxial surface of the buffer layer is essentially free from grooves.
20. The light-emitting diode chip of claim 1 , wherein the light-emitting diode is arranged in the following sequence of layers comprising:
the substrate substantiality comprising SiC;
an AlGaN:Si layer which is in direct contact with the substrate;
a GaN:Si layer which is in direct contact with the AlGaN:Si layer; and
the active structure which is in direct contact with the GaN:Si layer.