Circuit board and method for fabricating the same, and electronic device
The circuit board for mounting semiconductor elements comprises a core substrate 10 formed of a fiber reinforced metal, an insulating layer 14 formed on the core substrate 10 , and an interconnection layer 20 formed on the insulating layer 14 , whereby the circuit board for mounting semiconductor elements can have a thermal expansion coefficient approximate to that of silicon, and light and thin but has high rigidity.
1. An electronic device comprising:
a motherboard;
a circuit board mounted on and electrically connected to the motherboard and including a core substrate formed of a fiber reinforced material;
electronic parts mounted on the circuit board,
a thermal expansion coefficient of the core substrate of the circuit board being set to be between a thermal expansion coefficient of the motherboard and a thermal expansion coefficient of the electronic parts.
2. An electronic device according to claim 1 , wherein
the fiber reinforced material is a composite material composed of a metal material selected from a group consisting of magnesium alloy, aluminum alloy, titanium and titanium alloy, and a fiber material selected from a group consisting of carbon fiber and SiC fiber.
3. An electronic device according to claim 2 , wherein a thermal expansion coefficient of the circuit board is 6–17 ppm/° C. at room temperature.
4. An electronic device according to claim 2 , further comprising:
an insulating layer formed on the core substrate; and
an interconnection layer having a prescribed pattern of a interconnection formed on the insulating layer,
the interconnection layer being electrically connected to a ground line or a power source line via the core substrate as a ground plane or a power source.
5. An electronic device according to claim 1 , wherein
the fiber reinforced material is a composite material composed of a resin material and a fiber material selected from a group consisting of carbon fiber and SiC fiber.
6. An electronic device according to claim 5 , wherein
a content of the carbon fibers is within a range of 30–80 vol. %.
7. An electronic device according to claim 5 , wherein
the carbon fibers are a first carbon fiber group of a plurality of carbon fibers arranged in one direction, and a second carbon fiber group of a plurality of carbon fibers arranged in a direction intersecting said one direction.
8. An electronic device according to claim 7 , wherein
the carbon fibers are arranged in one form selected out of a mesh, a cloth or a non-woven fabric of the first carbon fiber group and the second carbon fiber group.
9. An electronic device according to claim 5 , wherein
the insulating resin is formed of a material selected from a group consisting of polysulfone, polyethersulfone, polyphenylsulfone, polyphthalamide, polyamide imide, polyketone, polyacetal, polyimide, polycarbonate, modified polyphenylene ether, polybutylene terephthalate, polyallylate, polyphenylene sulfide, polyether etherketone, tetrafluoroethylene, epoxy, and bismaleimide based resin.
10. An electronic device according to claim 1 , further comprising:
an insulating layer formed on the core substrate; and
an interconnection layer having a prescribed pattern of a interconnection formed on the insulating layer.
11. An electronic device according to claim 10 , wherein
a through-hole electrode is formed in the core substrate and the insulating layer,
the interconnection layer includes a first interconnection formed on the insulating layer on one side of the core substrate and a second interconnection formed on the insulating layer on the other side of the core substrate,
the first interconnection and the second interconnection are interconnected by the through-hole electrode.
12. An electronic device according to claim 1 , wherein
the fiber material is formed of fibers laid in a mesh, a cloth or a non-woven fabric.