Semiconductor chip for optoelectronics
View Patent ↗An optoelectronic semiconductor chip has an active layer containing a photon-emitting zone. The active layer is attached to a carrier member at a bonding side of the active layer. The active layer has at least one recess therein with a cross-sectional area that decreases with increasing depth into said active layer proceeding from said bonding side.
1. A method for simultaneous manufacture of a plurality of semiconductor chips for optoelectronics having an active thin-film layer wherein a photon-emitting active zone is formed, comprising the steps of:
epitaxially growing a layer sequence containing a photon-emitting zone on a growth substrate wafer;
forming at least one cavity in the layer sequence such that a plurality of mesas are formed in the layer sequence, said mesas being connected by connecting portions including at least a portion of said photon-emitting zone;
applying at least one insulating layer onto a surface of the layer sequence provided with cavities;
producing at least one through-contacting on the mesas;
applying a wafer composite including the growth substrate wafer and the layer sequence onto a carrier substrate wafer such that the mesas face toward the carrier substrate wafer;
uniting the wafer composite with the carrier substrate wafer;
at least partially removing the growth substrate wafer;
applying an electrical contact onto a side of the layer sequence lying opposite the mesas; and
dividing a wafer composite of the carrier substrate wafer and the structured layer sequence along parting tracks to form semiconductor chips, each of the semiconductor chips including a light emitting diode having a plurality of the mesas.
2. The method as claimed in claim 1 , wherein the uniting step includes bonding.
3. The method according to claim 1 , further comprising:
dividing the layer sequence along the parting tracks before connecting the layer sequence to the carrier substrate wafer.
4. The method according to claim 3 , further comprising:
dividing the layer sequence along the parting tracks in a separate step before the connecting step, before removal of the growth substrate wafer and before the parting step of the carrier substrate wafer.
5. A method for simultaneous manufacture of a plurality of semiconductor chips for optoelectronics having an active thin-film layer wherein a photon-emitting active zone is formed, comprising the steps of:
epitaxially growing a layer sequence containing a photon-emitting active zone on a growth substrate wafer;
forming at least one cavity in said layer sequence such that a plurality of mesas are formed in said layer sequence, said mesas being connected with each other via a connecting layer of said layer sequence and said photon-emitting active zone being arranged in said connecting layer;
applying a reflective layer onto a surface of said layer sequence provided with said at least one cavity;
applying said layer sequence onto a carrier substrate wafer such that said mesas face toward said carrier substrate water;
at least partially removing said growth substrate wafer from said layer sequence;
applying an electrical contact onto a side of said layer sequence lying opposite a side of said surface provided with said at least one cavity;
dividing said carrier substrate wafer and said layer sequence to form semiconductor chips, each of said semiconductor chips including a light emitting diode having a plurality of said mesas.
6. The method as claimed in claim 5 , wherein said layer sequence is secured to said carrier member by eutectic bonding.
7. The method as claimed in claim 5 , wherein said layer sequence is divided according to an intended number of said semiconductor chips before applying said layer sequence to said carrier substrate.
8. The method as claimed in claim 7 , wherein said step of dividing said carrier substrate wafer and said layer sequence includes the sub-steps of:
dividing said layer sequence; and
dividing said carrier substrate in a separate step from said step of dividing said layer sequence and after said step of dividing said layer sequence.
9. The method as claimed in claim 8 , wherein said growth substrate wafer is at least partially removed before said step of dividing said carrier substrate wafer.
10. The method as claimed in claim 5 , wherein said step of applying said reflective layer comprises:
applying at least one insulating layer onto the surface of said layer sequence,
producing at least one through-contacting on said mesas, and
applying a metallization layer onto said at least one insulation layer.
11. A method for simultaneous manufacture of a plurality of semiconductor chips for optoelectronics having an active thin-film layer wherein a photon-emitting active zone is formed, comprising the steps of:
epitaxially growing a layer sequence containing a photon-emitting active zone on a growth substrate wafer;
forming at least one cavity in said layer sequence such that a plurality of mesas are formed in said layer sequence;
forming a reflective layer on a surface of said layer sequence, the surface being provided with said at least one cavity, including:
applying at least one insulating layer onto the surface of said layer sequence,
producing at least one through-contacting on said mesas, and
applying a metallization layer onto said insulation layer;
applying said layer sequence onto a carrier substrate wafer such that said mesas face toward said carrier substrate wafer;
at least partially removing said growth substrate wafer from said layer sequence;
applying an electrical contact onto a side of said layer sequence lying opposite a side of said surface provided with said at least one cavity; and
dividing said carrier substrate wafer and said layer sequence to form semiconductor chips, each of said semiconductor chips including a light emitting diode having a plurality of said mesas.
12. The method as claimed in claim 11 , wherein said layer sequence is secured at said carrier member by eutectic bonding.
13. The method as claimed in claim 11 , wherein said layer sequence is divided according to an intended number of said semiconductor chips before applying said layer sequence to said carrier substrate.
14. The method as claimed in claim 13 , wherein said step of dividing includes said layer sequence being divided in a divide step before a dividing step of dividing said carrier substrate.
15. The method as claimed in claim 14 , wherein said growth substrate wafer is at least partially removed before said dividing step of the carrier substrate wafer.
16. The method as claimed in claim 11 , wherein said at least one cavity is formed such that said mesas are connected with each other via a connecting layer of said layer sequence and that said active zone is arranged in said connecting layer.