Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methods

1. An electrical apparatus comprising:

RFID circuitry on a first substrate;

sensor circuitry on a second substrate;

a receiving structure associated with one of the RFID circuitry and the sensor circuitry;

at least one connecting structure associated with the other of the RFID circuitry and the sensor circuitry and removably received within the receiving structure; and

wherein the sensor circuitry comprises a loop of conductive material removable by termites and is thereby configured to sense the presence of termites; the conductive material including one or both of carbon particles and metal particles.

2. The apparatus of claim 1 wherein the conductive material comprises a carbon-particle-containing ink.

3. The apparatus of claim 1 wherein the conductive material comprises silver particles.

4. An electrical apparatus comprising:

RFID circuitry on a first substrate;

sensor circuitry on a second substrate;

a receptacle associated with one of the RFID circuitry and the sensor circuitry, the receptacle having at least one orifice extending therein;

at least one extension associated with the other of the RFID circuitry and the sensor circuitry and removably inserted within the receptacle; and

wherein the second substrate comprises foam, wherein the circuitry on the second substrate comprises a conductive carbon-containing material which can be removed by termites, and wherein the RFID circuitry is configured to send a different signal to an interrogator if at least some of the conductive material has been removed than if none of the conductive material is removed.

5. A method of forming an electrical apparatus, comprising:

providing a first substrate having RFID circuitry thereon;

providing a second substrate having sensing circuitry thereon;

joining a receptacle with one of the RFID circuitry and the sensor circuitry, the receptacle having at least one orifice extending therein; and

joining at least one prong with the other of the RFID circuitry and the sensor circuitry;

removably inserting the prong within the receptacle to electrically connect the RFID circuitry with the sensing circuitry; and

wherein the second substrate comprises foam, wherein the circuitry on the second substrate comprises a conductive material which can be removed by termites, the conductive material comprising one or both of carbon particles and metal particles; and wherein the RFID circuitry is configured to send a different signal to an interrogator if at least some of the conductive material has been removed than if none of the conductive material is removed.

6. The method of claim 5 wherein the receptacle is joined to the first substrate and the prong is joined to the second substrate; and if the RFID circuitry is sending a signal indicative of at least some of the conductive material having been removed, further comprising:

removing the RFID circuitry from the sensing circuitry by detaching the prong from the receptacle, and

inserting an other prong into the receptacle, said other prong being joined to an other second substrate having an other sensing circuitry thereon.

7. The method of claim 5 wherein the prong is joined to the first substrate and the receptacle is joined to the second substrate; and if the RFID circuitry is sending a signal indicative of at least some of the conductive material having been removed, further comprising:

removing the RFID circuitry from the sensing circuitry by detaching the prong from the receptacle, and

inserting the prong into an other receptacle, said other receptacle being joined to an other second substrate having an other sensing circuitry thereon.

8. The method of claim 5 wherein the conductive material comprises carbon particles.

9. The method of claim 5 wherein the conductive material comprises silver particles.