Substrate treating method and substrate treating apparatus
View Patent ↗In a substrate treating unit, a removal liquid supplying mechanism supplies a removal liquid to the surface of a substrate. In order to retain the removal liquid on the surface of the substrate for a fixed time, a spin chuck is operated to spin the substrate at such a low speed as to retain the removal liquid on the substrate, or spins the substrate intermittently, or temporarily stops spinning of the substrate. Thus, treatment with the removal liquid progresses without a further supply of the removal liquid, thereby restraining consumption of the removal liquid.
1. A substrate treating method for removing, by using a removal liquid, a reaction product from a surface of a substrate having a film formed on the surface and patterned by dry etching with a resist film acting as a mask, said method comprising:
a removal liquid supplying step for supplying the removal liquid to the surface of the substrate while spinning the substrate; and
a removal liquid retaining step for retaining the removal liquid on the surface of the substrate for a fixed time;
wherein said removal liquid supplying step is executed for supplying the removal liquid to the substrate while spinning the substrate at a first speed, and thereafter supplying the removal liquid to the substrate while spinning the substrate at a second speed lower than the first speed.
2. A substrate treating method as defined in claim 1 , wherein said removal liquid retaining step is executed, after the removal liquid is supplied to the surface of the substrate, for spinning the substrate at such a low speed as to retain the removal liquid on the substrate.
3. A substrate treating method as defined in claim 1 , wherein said removal liquid retaining step is executed, after the removal liquid is supplied to the surface of the substrate, for spinning the substrate intermittently.
4. A substrate treating method as defined in claim 1 , wherein said removal liquid retaining step is executed, after the removal liquid is supplied to the surface of the substrate, for temporarily stopping spinning of the substrate.
5. A substrate treating method as defined in claim 1 , wherein said removal liquid retaining step is followed by:
a removal liquid scattering step for scattering the removal liquid from the surface of the substrate by spinning the substrate at high speed; and
a substrate cleaning step for cleaning the substrate.
6. A substrate treating method as defined in claim 5 , wherein said removal liquid supplying step, said removal liquid retaining step, said removal liquid scattering step and said substrate cleaning step are executed while the substrate is placed in a cup being exhausted, said cup being less exhausted during said removal liquid retaining step.
7. A substrate treating method for removing organic substance from a substrate by using a removal liquid, said method comprising:
a removal liquid supplying step for supplying the removal liquid to a surface of the substrate; and
a removal liquid retaining step for retaining the removal liquid on the surface of the substrate for a fixed time;
wherein said removal liquid supplying step is executed for supplying the removal liquid to the substrate while spinning the substrate; and
wherein said removal liquid retaining step is executed, after the removal liquid is supplied to the surface of the substrate, for spinning the substrate at such a low speed as to retain the removal liquid on the substrate.
8. A substrate treating method as defined in claim 7 , wherein said removal liquid retaining step is followed by:
a removal liquid scattering step for scattering the removal liquid from the surface of the substrate by spinning the substrate at high speed; and
a substrate cleaning step for cleaning the substrate.
9. A substrate treating method as defined in claim 7 , wherein said organic substance is a reaction product resulting from a dry etching with a resist film used as a mask.
10. A substrate treating method as defined in claim 7 , wherein said organic substance is a polymer.
11. A substrate treating method as defined in claim 7 , wherein said organic substance is a reaction product resulting from a change in property of a resist.
12. A substrate treating method for removing organic substance from a substrate by using a removal liquid, said method comprising:
a removal liquid supplying step for supplying the removal liquid to a surface of the substrate; and
a removal liquid retaining step for retaining the removal liquid on the surface of the substrate for a fixed time;
wherein said removal liquid supplying step is executed for supplying the removal liquid to the substrate while spinning the substrate; and
wherein said removal liquid supplying step is executed for supplying the removal liquid to the substrate while spinning the substrate at a first speed, and thereafter supplying the removal liquid to the substrate while spinning the substrate at a second speed lower than the first speed.
13. A substrate treating method as defined in claim 12 , wherein said removal liquid retaining step is executed, after the removal liquid is supplied to the surface of the substrate, for spinning the substrate intermittently.
14. A substrate treating method as defined in claim 12 , wherein said removal liquid retaining step is executed, after the removal liquid is supplied to the surface of the substrate, for temporarily stopping spinning of the substrate.
15. A substrate treating method as defined in claim 12 , wherein said removal liquid retaining step is followed by:
a removal liquid scattering step for scattering the removal liquid from the surface of the substrate by spinning the substrate at high speed; and
a substrate cleaning step for cleaning the substrate.
16. A substrate treating method for removing organic substance from a substrate by using a removal liquid, said method comprising:
a removal liquid supplying step for supplying the removal liquid to a surface of the substrate; and
a removal liquid retaining step for retaining the removal liquid on the surface of the substrate for a fixed time;
wherein said removal liquid supplying step is executed for supplying the removal liquid to the substrate while spinning the substrate; and
wherein said removal liquid supplying step, said removal liquid retaining step, said removal liquid scattering step and said substrate cleaning step are executed while the substrate is placed in a cup being exhausted, said cup being less exhausted during said removal liquid retaining step.
17. A substrate treating method as defined in claim 16 , wherein said removal liquid retaining step is followed by:
a removal liquid scattering step for scattering the removal liquid from the surface of the substrate by spinning the substrate at high speed; and
a substrate cleaning step for cleaning the substrate.