Enhanced design and process for a conductive adhesive
View Patent ↗The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.
1. A method for manufacturing an electrical component comprising:
applying an electrically conductive thermoset adhesive paste onto essentially an entire bonding surface of a metal substrate;
thereafter partially curing said adhesive;
attaching a circuit board to said adhesive to form a substrate/adhesive/circuit board assembly;
laminating said assembly in a lamination press to form an electrical component; and
wherein said adhesive is about 20% to about 60% fully cured.
2. The method of claim 1 wherein said bondline between the substrate and circuit board assembly funned by the adhesive has a thickness of at least about 0.5 mil.
3. The method of claim 1 wherein said bondline between the substrate and circuit board assembly formed by the adhesive has a thickness of no greater than about 2 mils.
4. The method of claim 1 wherein said bondline between the substrate and circuit board assembly formed by the adhesive has a thickness of at least about 0.5 mil and no greater than about 2 mils.
5. The method of claim 1 wherein said metal substrate is aluminum.
6. The invention as defined in claim 1 wherein the adhesive paste is applied by screen coating.
7. The invention as defined in claim 1 wherein the lamination pressure is from about 50 psi to about 200 psi.
8. The invention as defined in claim 1 wherein the lamination temperature is from about 100° C. to 150° C.
9. A method of manufacturing an electrical component comprising:
applying an electrically conductive thermoset adhesive onto essentially an entire bonding surface of a metal substrate;
thereafter partially curing said adhesive;
attaching a circuit board to said adhesive to form a substrate/adhesive/circuit board assembly;
laminating said assembly in a lamination press to form an electrical component; and
wherein said partially cured adhesive has a viscosity of at least about 100 Pa-S to no more than about 1000 Pa-S.
10. The method of claim 9 wherein said bondline between the substrate and circuit board assembly formed by the adhesive has a thickness of at least about 0.5 mil.
11. The method of claim 9 wherein said bondline between the substrate and circuit board assembly formed by the adhesive has a thickness of no greater than about 2 mils.
12. The method of claim 9 wherein said bondline between the substrate and circuit board assembly formed by the adhesive has a thickness of at least about 0.5 mil and no greater than about 2 mils.
13. The method of claim 9 wherein said metal substrate is aluminum.
14. The method of claim 9 wherein said bondline between the substrate and circuit board assembly formed by the adhesive has a thickness of at least about 0.5 mil.
15. The method of claim 9 wherein said bondline between the substrate and circuit board assembly formed byte adhesive has a thickness of no greater than about 2 mils.
16. The method of claim 9 wherein said bondline between the substrate and circuit board assembly formed by the adhesive has a thickness of at least about 0.5 mil and no greater than about 2 mils.
17. The method of claim 9 wherein said metal substrate is aluminum.