Pattern writing and forming method
View Patent ↗A pattern forming method is proposed for easy correction of a pattern-size variation occurring in an etching process. An energy beam is radiated onto a resist-applied target while the energy beam is adjusted to correct the pattern-size variation occurring in the etching process. The resist on the target is developed to form a resist pattern. The target is etched with the resist pattern as a mask, thus forming patterns thereon.
1. A pattern writing method for radiating an energy beam on a resist that is applied to a target to write patterns thereon comprising:
storing pattern data for writing the patterns, the pattern data including a reference radiation amount D 0 for radiating the energy beam, a distribution of a pattern dependency of a pattern-size variation Δ due to a loading effect, and an energy distribution “s” applied to the resist by the energy beam;
dividing writing regions of the target into grids to provide sub-writing regions in the grids;
obtaining a distribution of a pattern-area density per sub-writing region based on the pattern data;
calculating a radiation amount DC f (x) for correcting a long-range fogging exposure in each sub-writing region based on the pattern-area density and the reference radiation amount D 0 ;
calculating a radiation amount DC p (x) for correcting a proximity effect applied to those of the patterns in each sub-writing region based on the pattern data and the reference radiation amount D 0 ;
calculating a radiation amount D(x) based on the radiation amount DC f (x), the radiation amount DC p (x), the distribution of a pattern dependency, and the energy distribution “s”;
deciding a radiation locations and a radiation shape of the energy beam based on data on a pattern location and a pattern shape for each of the patterns in the sub-writing regions; and
radiating the energy beam on the radiation location on the target with the radiation shape for a period in which a radiated energy level from the energy beam reaches the radiation amount D(x).
2. The pattern writing method according to claim 1 further comprising:
obtaining a distribution of a pattern-size variation Δ(x) per sub-writing region based on the distribution of the pattern-area density and the distribution of the pattern dependency of the pattern-size variation Δ due to the loading effect;
wherein the step of calculating the radiation amount DC f (x) is calculated based on the distribution of the pattern-area density, the reference radiation amount D 0 , and the distribution of the pattern-size variation Δ(x);
wherein the step of calculating the radiation amount DC p (x) is calculated based on the data on the pattern location and the pattern shape in the sub-writing regions, the reference radiation amount D 0 , the distribution of the pattern-size variation Δ(x), and the energy distribution “s” of the energy beam.
3. The pattern writing method according to claim 1 , wherein the step of calculating the radiation amount D(x) includes generating a product of the radiation amount DC f (x) and the radiation amount DC p (x).
4. The pattern writing method according to claim 3 , wherein the step of calculating the radiation amount D(x) uses the radiation amount DC f (x) set to the reference radiation amount D 0 .
5. The pattern writing method according to claim 1 , wherein the step of calculating the radiation amount D(x) uses an equation D(x)=DC p (x)×DC f (x)/(1+(2s(Δ)−1)×(DC p (x)×DC f (x)/C 0 )).
6. The pattern writing method according to claim 5 , wherein the pattern-size variation Δ involves a non-uniform etching in addition to the loading effect.
7. The pattern writing method according to claim 5 , wherein the step of calculating the radiation amount D(x) uses the radiation amount DC f (x) set to the reference radiation amount D 0 .
8. A pattern forming method comprising:
storing pattern data for writing patterns, the pattern data including a reference radiation amount D 0 for radiating an energy beam on a resist-applied target, a distribution of a pattern dependency of a pattern-size variation Δ due to a loading effect, and an energy distribution “s” applied to the resist by the energy beam;
dividing writing regions of the target into grids to provide sub-writing regions in the grids;
obtaining a distribution of a pattern-area density per sub-writing region based on the pattern data;
calculating a radiation amount DC f (x) for correcting a long-range fogging exposure in each sub-writing region based on the pattern-area density and the reference radiation amount D 0 ;
calculating a radiation amount DC p (x) for correcting a proximity effect applied to those of the patterns in each sub-writing region based on the pattern data and the reference radiation amount D 0 ;
calculating a radiation amount D(x) based on the radiation amount DC f (x), the radiation amount DC p (x), the distribution of a pattern dependency, and the energy distribution “s”;
deciding radiation locations and radiation shapes of the energy beam based on data on pattern locations and pattern shapes of the patterns in the sub-writing regions and radiating the energy beam on the radiation locations on the target with the radiation shapes for a period in which a radiated energy level from the energy beam reaches the radiation amount D(x), thus writing the patterns on the resist;
developing the pattern-written resist to form a resist pattern; and
etching the target with the resist pattern as a mask, thus forming the patterns on the target.
9. The pattern forming method according to claim 8 further comprising:
obtaining a distribution of pattern-size variation Δ(x) per sub-writing region based on the distribution of the pattern-area density and the distribution of the pattern dependency of pattern-size variation Δ due to the loading effect;
wherein the step of calculating the radiation amount DC f (x) is calculated based on the distribution of the pattern-area density, the reference radiation amount D 0 , and the distribution of the pattern-size variation Δ(x);
wherein the step of calculating the radiation amount DC p (x) is calculated based on the data on the pattern locations and the pattern shapes in the sub-writing regions, the reference radiation amount D 0 , the distribution of the pattern-size variation Δ(x), and the energy distribution “s” of the energy beam.
10. The pattern forming method according to claim 8 , wherein the step of calculating the radiation amount D(x) includes generating a product of the radiation amount DC f (x) and the radiation amount DC p (x).
11. The pattern forming method according to claim 10 , wherein the step of the radiation amount D(x) uses the radiation amount DC f (x) set to the reference radiation amount D.
12. The pattern forming method according to claim 8 , wherein the step of calculating the radiation amount D(x) uses an equation D(x)=DC p (x)×DC f (x)/(1+(2s(Δ)−1)×(DC p (x)×DC f (x)/C 0 )).
13. The pattern forming method according to claim 12 , wherein the pattern-size variation Δ involves a non-uniform etching in addition to the loading effect.
14. The pattern forming method according to claim 12 , wherein the step of calculating the radiation amount D(x) uses the radiation amount DC f (x) set to the reference radiation amount D 0 .