IP Library Granted Patent US 7,164,447
Granted Patent B2
US 7,164,447 · App. 10/361,598 · Granted Jan 16, 2007

Solid state image pickup device

Assignee: Canon Kabushiki Kaisha
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Quick Facts
Patent No.
US 7,164,447
App. No.
10/361,598
Granted
Jan 16, 2007
Kind
B2
Abstract

A solid state image pickup device is provided which can reduce crosstalks between range finding photoelectric conversion elements (AF sensor) and photometry photoelectric conversion elements (AE sensor). The solid state image pickup device has an n-type epitaxial semiconductor region, a p-type first well region formed in the semiconductor region, a p-type second well region formed in the semiconductor region and electrically separated from the first well, an n-type first impurity doped region formed in the first well region and an n-type second impurity doped region formed in the second well, wherein a photometry photoelectric conversion element is formed by using the p-type first well region and n-type first impurity doped region, and a range finding photoelectric element is formed by using the p-type second well region and n-type impurity doped region.

Claims (21)

1. An AE/AF sensor device comprising:

a first semiconductor region of a first conductivity type;

a second semiconductor region of a second conductivity type opposite to the first conductivity type, said second semiconductor region being disposed in said first semiconductor region;

a third semiconductor region of the second conductivity type formed in said first semiconductor region, said third semiconductor region being electrically isolated from said second semiconductor region;

a fourth semiconductor region of the first conductivity type formed in said second semiconductor region; and

a fifth semiconductor region of the first conductivity type formed in said third semiconductor region,

wherein one photoelectric conversion element is formed by using said second and fourth semiconductor regions, and another photoelectric conversion element is formed by using said third and fifth semiconductor regions,

wherein said one photoelectric conversion element is a photometry photoelectric conversion element, and said another photoelectric conversion element is an automatic focusing photoelectric conversion element, and

wherein a dummy wiring region is disposed in a region other than the region where the photometry photoelectric conversion element and the automatic focusing photoelectric conversion element are formed so that a distance between wiring layers is set to 200 μm or shorter.

2. An AE/AF sensor device comprising:

a first semiconductor region of a first conductivity type;

a second semiconductor region of a second conductivity type opposite to the first conductivity type, said second semiconductor region being disposed in said first semiconductor region;

a third semiconductor region of the second conductivity type formed in said first semiconductor region, said third semiconductor region being electrically isolated from said second semiconductor region;

a fourth semiconductor region of the first conductivity type formed in said second semiconductor region; and

a fifth semiconductor region of the first conductivity type formed in said third semiconductor region,

wherein one photoelectric conversion element is formed by using said second and fourth semiconductor regions, and another photoelectric conversion element is formed by using said third and fifth semiconductor regions,

wherein said one photoelectric conversion element is a photometry photoelectric conversion element, and said another photoelectric conversion element is an automatic focusing photoelectric conversion element,

wherein an output of the automatic focusing photoelectric conversion element is used as an autofocus signal of a phase difference detection type and a photoelectric current output of the photometry photoelectric conversion element is logarithmically compressed and used as a photometry signal,

wherein a potential of said second semiconductor region is higher than a potential of said third semiconductor region.

3. A camera comprising an AE/AF sensor device according to claim 1 , a detecting region for detecting an image of an object, a lens for focusing light onto said detection region, and a signal processing circuit for controlling the automatic focusing and a photometry based on a signal from said AE/AF sensor device.

4. A camera comprising an AE/AF sensor device according to claim 2 , a detecting region for detecting an image of an object, a lens for focusing light onto said detection region, and a signal processing circuit for controlling the automatic focusing and a photometry based on a signal from said AE/AF sensor device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2003
From: TAKAHASHI, HIDEKAZU
To: CANON KABUSHIKI KAISHA
Reel/Frame 013768/0433 →
Priority Claims (2)
JP 2002-046474 · Feb 22, 2002 · national
JP 2003-019006 · Jan 28, 2003 · national
Continuity (1)
Related Publication 20030160887A1 · Aug 28, 2003