Granted Patent B2

US 6,849,495 · App. 10/376,461 · Granted Feb 1, 2005

Abstract

Claims (43)

1. A method of manufacturing a semiconductor device, comprising:

providing a workpiece, the workpiece comprising a semiconductor material;

forming at least one memory cell within the workpiece;

forming at least one first conductive line proximate the at least one memory cell, wherein the first conductive line provides access to the at least one memory cell;

depositing a first insulating layer over the at least one memory cell and first conductive line;

depositing a second insulating layer over the first insulating layer;

depositing a photoresist over the second insulating layer;

removing a portion of the photoresist;

etching the second insulating layer and first insulating layer, exposing at least an active region of the memory cell, wherein etching the second insulating layer and first insulating layer comprises a two-step etch process, wherein one of the steps comprises an anisotropic etch and the other step comprises an isotropic etch; and

forming a silicide material on the exposed active region top surface.

2. The method according to claim 1 , wherein etching the second insulating layer and first insulating layer further comprises exposing a top surface of the first conductive line, and wherein forming a silicide material further comprises forming a silicide material on the first conductive line top surface.

3. The method according to claim 1 , wherein the first insulating layer comprises boro-phosphosilicate glass (BPSG), wherein the second insulating layer comprises silicon nitride.

4. The method according to claim 1 , wherein etching the second insulating layer and first insulating layer comprises leaving a portion of the first insulating layer on the sidewalls of the at least one first conductive line.

5. The method according to claim 1 , wherein forming a silicide material comprises exposing the workpiece to cobalt.

6. The method according to claim 1 , wherein depositing a photoresist and removing a portion of the photoresist comprises a deep-ultraviolet (DUV) process.

7. The method according to claim 1 , wherein the anisotropic etch is performed before the isotropic etch.

8. The method according to claim 1 , further comprising:

depositing an insulative material over at least the silicide material;

opening the insulative material over the silicided active region;

filling the opening over the silicided active region with a conductive material; and

forming at least one second conductive line over the conductive material.

9. The method according to claim 1 , wherein the memory cell comprises a dynamic random access memory (DRAM) device.

10. A method of manufacturing a memory device, comprising:

providing a workpiece, the workpiece comprising a semiconductor material;

forming at least one memory cell within the workpiece, the at least one memory cell comprising an active region;

forming at least one first conductive line proximate the at least one memory cell, wherein the at least one first conductive line provides access to the at least one memory cell;

depositing a first insulating layer over the at least one memory cell and the at least one first conductive line;

depositing a second insulating layer over the first insulating layer;

depositing a photoresist over the second insulating layer;

removing a portion of the photoresist;

etching the second insulating layer and first insulating layer, exposing at least a top surface of the at least one first conductive line, leaving a portion of the first insulating layer on the sidewalls of the at least one first conductive line, wherein etching the second insulating layer and first insulating layer comprises a two-step process, wherein one of the steps comprises an anisotropic etch and the other step comprises an isotropic etch;

forming a silicide material on at least the first conductive line top surface;

depositing an insulative material over at least the silicide material;

opening the insulative material over the active region;

filling the opening over the active region with a conductive material; and

forming at least one second conductive line over the conductive material.

11. The method according to claim 10 , wherein etching the second insulating layer and first insulating layer further comprises exposing the active region of the memory cell, wherein forming a silicide material further comprises forming a silicide material on the exposed active region, wherein the conductive material abuts the silicide material on the active region.

12. The method according to claim 10 , wherein the first insulating layer and insulative material comprise boro-phosphosilicate glass (BPSG), wherein the second insulating layer comprises silicon nitride.

13. The method according to claim 10 , wherein forming a silicide material comprises exposing the workpiece to cobalt.

14. The method according to claim 10 , wherein depositing a photoresist and removing a portion of the photoresist comprises a deep-ultraviolet (DUV) process.

15. The method according to claim 10 , wherein the anisotropic etch is performed before the isotropic etch.

16. The method according to claim 10 , further comprising forming at least one third conductive line proximate the at least one memory cell; wherein the photoresist protects the area between the first conductive line and third conductive line while forming the silicide material.

17. The method according to claim 16 , wherein the at least one first conductive line comprises an active wordline, at least one second conductive line comprises a bitline, and the at least one third conductive line comprises a passing wordline, wherein the at least one memory cell comprises a dynamic random access memory (DRAM) device.

Assignments (9)