Power supply packaging system
View Patent ↗A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment made to the drain electrode metallization on the back side of the FETs. The source electrode and gate electrode of each FET are coupled to the circuitry on an overhanging printed circuit board, using CSP solder balls affixed to the front side of the FET die. The heat generated by the FETs is effectively dissipated by the close coupling of the FETs to the thermally conductive underlying substrate.
1. A power supply package comprising:
a semiconductor die including at least one power switch having at least a first electrical terminal disposed on a first surface of the die and at least a second electrical terminal on a second surface of the die;
a thermally conductive substrate operatively coupled directly to the first electrical terminal of the semiconductor die; and
a printed circuit board operatively coupled to the second electrical terminal of the semiconductor die, wherein the thermally conductive substrate is attached to the printed circuit board.
2. The power supply package of claim 1 , wherein the printed circuit board and thermally conductive substrate lie in a plane parallel to those respectively defined by the opposing and first surfaces of the semiconductor die, the semiconductor die interposed therebetween.
3. The power supply package of claim 1 , wherein the thermally conductive substrate further comprises an electrically insulating, thermally conducting layer provided on a surface of the thermally conductive substrate.
4. The power supply package of claim 3 , wherein the thermally conductive substrate further comprises a conductive trace attached to the electrically insulating, thermally conductive layer provided on the surface of the thermally conductive substrate.
5. The power supply package of claim 4 , wherein the coupling of the first electrical terminal to the thermally conductive substrate comprises solder or a conductive adhesive attachment between the first electrical terminal and the conductive trace attached to the electrically insulating, thermally conductive layer formed on the surface of the thermally conductive substrate.
6. The power supply package of claim 1 , further comprising a metallic strap coupling the second electrical terminal of the semiconductor die to the printed circuit board.
7. The power supply package of claim 1 , further comprising solder balls coupling the second electrical terminal of the semiconductor die to the printed circuit board.
8. The power supply package of claim 1 , wherein the thermally conductive substrate is comprised of copper, aluminum or ceramic.
9. The power supply package of claim 8 , wherein the ceramic is selected from a group consisting of boron nitride, aluminum nitride, or alumina.
10. The power supply package of claim 1 , wherein the thermally conductive substrate comprises bismaleimide triazine or a ceramic-filled epoxy polymer.
11. The power supply package of claim 1 , wherein the thermally conductive substrate defines an exterior surface of the power supply package.
12. The power supply package of claim 1 , wherein the printed circuit board defines an exterior surface of the power supply package.
13. The power supply package of claim 1 , wherein the power switch comprises a field effect transistor.
14. The power supply package of claim 13 , wherein said first electrical terminal comprises a drain terminal of the field effect transistor.
15. The power supply package of claim 13 , wherein said second electrical terminal comprises a gate terminal of the field effect transistor.
16. The power supply package of claim 13 , wherein said second electrical terminal comprises a source terminal of the field effect transistor.