Flanged terminal pins for DC/DC converters
A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.
1. A method of mounting a dc/dc power converter on a printed circuit board comprising:
providing a dc/dc converter comprising:
a converter substrate having circuitry thereon; and
at least one rigid terminal pin attached to the converter substrate, the pin being electrically connected to the circuitry, the terminal pin including a flange having a shoulder spaced from the converter substrate;
applying solder to at least one of the shoulder of the flange and the circuit board;
positioning the dc/dc converter to the printed circuit board with the terminal pin extending through a circuit board hole and the shoulder abutting the circuit board to accommodate spacing of the dc/dc converter from the circuit board with solder between the shoulder of the flange and the printed circuit board; and
subjecting the dc/dc converter and printed circuit board to a solder reflow process to join the terminal pin and printed circuit board with the solder.
2. A method as claimed in claim 1 wherein the dc/dc converter comprises a substrate with circuitry thereon in an open frame construction.
3. A method as claimed in claim 1 wherein the solder paste is applied as a paste about the circuit board hole.
4. A method as claimed in claim 3 wherein the hole is left substantially free of solder paste when the paste is applied.
5. A method as claimed in claim 1 wherein the solder flows within the hole of the printed circuit board.
6. A method as claimed in claim 1 wherein the solder flows to form a fillet.
7. A method as claimed in claim 6 wherein the solder flows radially to form a fillet about the flange.
8. A method as claimed in claim 6 wherein the solder flows through the hole in the printed circuit board to form a fillet about a portion of the terminal pin exposed beyond the circuit board hole.
9. A method as claimed in claim 1 wherein the components, materials and solder connections of the converter are not adversely affected by a 210° C. soldering process.
10. A method as claimed in claim 1 wherein solder used on the converter substrate has a melting temperature greater than 210° C.
11. A method as claimed in claim 1 further comprising a second flange on the terminal pins that abuts the converter substrate, and the pin extends from the second flange into the converter substrate.
12. A method as claimed in claim 1 wherein the flange extends along a length of the terminal pin to abut the converter substrate.
13. A method as claimed in claim 1 wherein the terminal pin comprises a second shoulder which abuts the converter substrate.
14. A method as claimed in claim 13 wherein the terminal pin extends into the converter substrate.
15. A method as claimed in claim 14 wherein the terminal pin is swage fit into the converter substrate.
16. A method as claimed in claim 15 wherein the portion of the terminal pin extending into the converter substrate has a pointed cross sectional shape.
17. A method as claimed in claim 16 wherein the portion of the terminal pin extending into the converter substrate is soldered to the converter substrate.
18. A method as claimed in claim 1 wherein the terminal pin extends into the converter substrate.
19. A method as claimed in claim 18 wherein the pin is swage fit into the converter substrate.
20. A method as claimed in claim 19 wherein the portion of the pin extending into the converter substrate has a pointed cross section shape.
21. A method as claimed in claim 20 wherein the portion of the terminal pin extending into the converter substrate is soldered to the converter substrate.
22. A method as claimed in claim 1 further comprising applying solder on the shoulder of the flange prior to positioning the terminal pin in the circuit board hole.
23. A method as claimed in claim 22 wherein the solder is applied in a paste.
24. A method as claimed in claim 22 wherein the solder is applied as a preform.
25. A method as claimed in claim 22 wherein the solder is coated on the shoulder.