Inorganic solid electrolyte and lithium cell component
A sulfide-based inorganic solid electrolyte that suppresses the reaction between silicon sulfide and metallic lithium even when the electrolyte is in contact with metallic lithium, a method of forming the electrolyte, and a lithium battery's member and lithium secondary battery both incorporating the electrolyte. The electrolyte comprises Li, P, and S without containing Si. It is desirable that the oxygen content vary gradually from the electrolyte to the lithium-containing material at the boundary zone between the two members when analyzed by using an XPS having an analyzing chamber capable of maintaining a super-high vacuum less than 1.33×10 −9 h Pa and that the oxygen-containing layer on the surface of the lithium-containing material be removed nearly completely. The electrolyte can be formed such that at least part of the forming step is performed concurrently with the step for etching the surface of the substrate by irradiating the surface with inert-gas ions.
1. A method of forming an inorganic solid electrolyte by forming a thin inorganic solid electrolytic layer on a substrate, the method comprising the step of forming a thin inorganic solid electrolytic layer comprising Li, P, and S without containing Si while the substrate is heated at a temperature of at lowest 40° C. and at highest 180° C.
2. A method as defined by claim 1 , wherein the inorganic solid electrolyte comprises:
(a) at least 20 atom. % and at most 60 atom. % Li; and
(b) the remainder comprising P and S.
3. A method as defined by claim 1 , wherein the inorganic solid electrolytic layer is formed by a method selected from the group consisting of the sputtering method, the vacuum evaporation method, the laser abrasion method, and the ion plating method.
4. A method as defined by claim 1 , the method comprising the steps of:
(a) etching the surface of the substrate by irradiating the surface with inert-gas ions; and
(b) forming the thin inorganic solid electrolytic layer such that at least part of the forming step is performed concurrently with the etching step.
5. A method as defined by claim 1 , comprising forming the thin inorganic solid electrolyte layer directly on the substrate.
6. A method of forming an inorganic solid electrolyte by forming a thin inorganic solid electrolytic layer on a substrate, the method comprising the steps of:
(a) forming a thin inorganic solid electrolytic layer comprising Li, P, and S without containing Si while the substrate is maintained at a temperature lower than 40° C.; and
(b) heating the substrate having the formed electrolytic layer at a temperature of at lowest 40° C. and at highest 180° C.
7. A method as defined by claim 6 , wherein the inorganic solid electrolyte comprises:
(a) at least 20 atom. % and at most 60 atom. % Li; and
(b) the remainder comprising P and S.
8. A method as defined by claim 6 , wherein the inorganic solid electrolytic layer is formed by a method selected from the group consisting of the sputtering method, the vacuum evaporation method, the laser abrasion method, and the ion plating method.
9. A method as defined by claim 6 , the method comprising the steps of:
(a) etching the surface of the substrate by irradiating the surface with inert-gas ions; and
(b) forming the thin inorganic solid electrolytic layer such that at least part of the forming step is performed concurrently with the etching step.