Method of polishing a lanthanide substrate
View Patent ↗The invention provides a method of polishing a substrate comprising a lanthanide-containing metal oxide material. The method comprises the steps of (i) providing a polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an acid, and (c) a liquid carrier, (ii) providing a substrate comprising a metal oxide layer, wherein the metal oxide layer comprises at least one lanthanide series element, and (iii) abrading at least a portion of the metal oxide layer with the polishing system to polish the substrate. The lanthanide-containing metal oxide material can be a lanthanide oxide, a doped lanthanide oxide, a lanthanide-doped metal oxide, a lanthanide perovskite, or any other suitable lanthanide-containing mixed metal oxide material, in particular those used as solid electrode and solid electrolyte materials in gas sensor and fuel cell devices.
1. A method of polishing a substrate, said method comprising the steps of:
(i) providing a polishing system comprising:
(a) an abrasive, a polishing pad, or a combination thereof,
(b) an acid, and
(c) a liquid carrier,
(ii) providing a substrate comprising a metal oxide layer, wherein the metal oxide layer comprises at least one lanthanide series element and is selected from:
(a) ceria further comprising a dopant,
(b) a lanthanide oxide selected from Y 2 O 3 , La 2 O 3 , Nd 2 O 3 , Sm 2 O 3 , Eu 2 O 3 , Gd 2 O 3 , Dy 2 O 3 , Ho 2 O 3 , Er 2 O 3 , Tm 2 O 3 , Yb 2 O 3 , Lu 2 O 3 , Pr 6 O 11 , or Tb 4 O 7 ,
(c) a metal oxide of the formula LnMO 3 , wherein Ln is Y, La, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb, or Lu, and M is Sc, Ti, V, Cr, Mn, Fe, Co, Ni, or Al,
(d) zirconia further comprising a lanthanide metal dopant, or
(e) a metal oxide as in (b) or (c) further comprising a dopant, and
(iii) abrading at least a portion of the metal oxide layer with the polishing system to polish the substrate.
2. The method of claim 1 , wherein the metal oxide layer comprises ceria and the dopant is a lanthanide series dopant selected from the group consisting of yttrium, lanthanum, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, and combinations thereof.
3. The method of claim 1 , wherein the metal oxide layer comprises ceria and the dopant is a non-lanthanide series dopant selected from the group consisting of calcium, barium, strontium, scandium, zirconium, bismuth, cobalt, nickel, iron, copper, and combinations thereof.
4. The method of claim 1 , wherein the metal oxide layer is a samarium-doped ceria, a gadolinium-doped ceria, or an yttrium-doped ceria.
5. The method of claim 1 , wherein the polishing system comprises an abrasive, and the abrasive is present in an amount of about 10 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein.
6. The method of claim 1 , wherein the polishing system comprises an abrasive, and the abrasive is a metal oxide abrasive.
7. The method of claim 6 , wherein the metal oxide abrasive comprises ceria, alumina, zirconia, or combinations thereof.
8. The method of claim 7 , wherein the metal oxide abrasive comprises ceria.
9. The method of claim 8 , wherein the amount of the metal oxide abrasive is about 5 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein.
10. The method of claim 1 , wherein the acid is an inorganic acid.
11. The method of claim 10 , wherein the acid is an inorganic acid selected from the group consisting of nitric acid, phosphoric acid, sulfuric acid, salts thereof, and combinations thereof.
12. The method of claim 1 , wherein the acid is an organic acid.
13. The method of claim 12 , wherein the acid is an organic acid selected from the group consisting of oxalic acid, malonic acid, tartaric acid, acetic acid, lactic acid, propionic acid, phthalic acid, benzoic acid, salicylic acid, citric acid, succinic acid, salts thereof, and combinations thereof.
14. The method of claim 1 , where the polishing system has a pH of about 2 to about 6.
15. The method of claim 14 , where the polishing system has a pH of about 3 to about 5.5.
16. The method of claim 6 , wherein the abrasive has an average particle size of about 10 nm to about 800 nm.
17. The method of claim 16 , wherein the abrasive has an average particle size of about 50 nm about 200 nm.
18. The method of claim 1 , wherein the polishing system further comprises a component selected from the group consisting of surfactants, chemical oxidizing agents, pH adjustors, pH buffers, antifoaming agents, biocides, and combinations thereof.
19. The method of claim 1 , wherein the polishing system comprises an abrasive comprising ceria and an inorganic acid, and wherein the polishing system has a pH of about 2 to about 6.
20. The method of claim 1 , wherein the metal oxide layer comprises LaCrO 3 , CeCrO 3 , PrCrO 3 , (LaCa)CrO 3 , (SmSr)CoO 3 , (LaCa)(CrCo)O 3 , (LaSr)(CrCo)O 3 , (LaCa)(CrNi)O 3 , (LaSr)(CrNi) 3 , (LaSr)MnO 3 , (PrSr)MnO 3 , (CeSr)MnO 3 , (GdSr)MnO 3 , (LaCa)MnO 3 , (PrCa)MnO 3 , (CeCa)MnO 3 , (GdCa)MnO 3 , ((LaY)Sr)MnO 3 , (LaSr)CoO 3 , (GdSr)CoO 3 , (LaSr)(CoFe)O 3 , YFeO 3 , La 4 Ti 9 O 24 , La 2 Ti 2 O 7 , La 2 TiO 5 , BaO—TiO 2 —La 2 O 3 , Nd 4 Ti 9 O 24 , Nd 2 Ti 2 O 7 , Nd 2 TiO 5 , BaO—TiO 2 —Nd 2 O 3 , Sm 4 Ti 9 O 24 , Sm 2 Ti 2 O 7 , Sm 2 , TiO 5 , BaO—TiO 2 —Sm 2 O 3 , LnAl 11 O 18 , Ln 3 Al 5 O 12 , or Ln 4 Al 2 O 9 .
21. The method of claim 1 , wherein the metal oxide layer is yttrium-stabilized zirconia (YSZ), Ni—YSZ, Ni—MgO—YSZ, Ni—TiO 2 —YSZ, Ru—YSZ, or TiO 2 —YSZ.
22. The method of claim 6 , wherein the metal oxide abrasive comprises a doped metal oxide abrasive.
23. The method of claim 22 , wherein the doped metal oxide abrasive is present in an amount of about 10 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein.
24. The method of claim 24 , wherein the doped metal oxide abrasive is a doped lanthanide metal oxide abrasive, a lanthanide metal-doped metal oxide abrasive, or a combination thereof.
25. The method of claim 22 , wherein the doped metal oxide abrasive comprises ceria, alumina, zirconia, or combinations thereof.
26. The method of claim 25 , wherein the doped metal oxide abrasive comprises ceria.
27. The method of claim 26 , wherein the amount of the doped metal oxide abrasive is about 5 wt. % or less based on the weight of the liquid carrier and any components dissolved or suspended therein.
28. The method of claim 22 , wherein the metal oxide layer comprises a lanthanide series element selected from the group consisting of yttrium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium thulium, ytterbium, lutetium, and combinations thereof.
29. The method of claim 29 , wherein the metal oxide layer comprises about 0.01 wt. % or more lanthanide series element based on the total weight of the metal oxide layer.
30. The method of claim 29 , wherein the dopant is a lanthanide series dopant selected from the group consisting of yttrium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, and combinations thereof.
31. The method of claim 29 , wherein the dopant is a metal selected from the group consisting of calcium, barium, strontium, scandium, zirconium, bismuth, cobalt, nickel, iron, copper, and combinations thereof.
32. The method of claim 22 , wherein the acid is an inorganic acid.
33. The method of claim 22 , wherein the acid is an organic acid.
34. The method of claim 22 , wherein the polishing system has a pH of about 2 to about 6.
35. The method of claim 22 , wherein the abrasive has an average particle size of about 10 nm to about 800 nm.
36. The method of claim 35 , wherein the abrasive has an average particle size of about 50 nm to about 200 nm.
37. The method of claim 22 , wherein the polishing system further comprises a component selected from the group consisting of surfactants, chemical oxidizing agents, pH adjustors, pH buffers, antifoaming agents, biocides, and combinations thereof.