Wireless communications system employing a chip carrier
View Patent ↗A wireless communication system comprising a carrier having a top and a bottom surface, and a plurality of integrated circuit components for transmitting and receiving communication signals located on the top and bottom surfaces of the carrier. At least one passageway extends through the carrier, and conductive material extends through the passageway for electrically interconnecting the integrated circuit components located on the top and bottom surfaces of the carrier.
1. A communications system, comprising:
a carrier having a first side and a second side, said first side being electrically integrated with said second side by at least one conductive passageway forming a coaxial interconnect through said carrier;
a GaAs chip on one of said first and second sides of said carrier; and
at least one second chip on one of said first and second sides of said carrier, wherein said GaAs chip and said at least one second chip are electrically interconnected by circuit components of said carrier.
2. The communications system of claim 1 , wherein said at least one second chip is a silicon chip.
3. The communications system of claim 1 , wherein said carrier comprises silicon.
4. The communications system of claim 1 , wherein said GaAs chip and said at least one second chip are both on said first side of said carrier.
5. The communications system of claim 4 , wherein said carrier is connected with a board at said second side.
6. The communications system of claim 1 , wherein said GaAs chip is a microwave chip and said at least one second chip is a radio frequency chip.
7. The communications system of claim 1 , further comprising a plurality of other electrical components on said first and second sides of said carrier.
8. The communications system of claim 1 , further comprising a plurality of said conductive passageways.
9. The communications system of claim 1 , wherein said system is a portion of a wireless voice and data system.
10. The communications system of claim 1 , wherein said system is a multi-layer TAB tape assembly.
11. A wireless communication device, comprising:
a carrier having a first surface and a second surface opposite said first surface;
a plurality of integrated circuit components on said first and second surfaces of said carrier and electrically interconnected by at least one conductive passageway forming a coaxial interconnect line through said carrier;
a microwave chip mounted on one of the first and second surfaces of said carrier; and
a radio frequency chip mounted on one of the first and second surfaces of said carrier.
12. The wireless communication device of claim 11 , wherein one of said microwave chip and said radio frequency chip is GaAs and the other is Si.
13. The wireless communication device of claim 11 , wherein said carrier comprises silicon.
14. The wireless communication device of claim 11 , wherein said carrier is mounted on a circuit board.
15. The wireless communication device of claim 11 , further comprising a plurality of said conductive passageways.
16. The wireless communication device of claim 11 , wherein said microwave chip and said radio frequency chip are electrically interconnected to a circuit board through said at least one conductive passageway, said carrier being between the microwave and said radio frequency chips and said circuit board.
17. The wireless communication device of claim 11 , wherein said microwave chip and said radio frequency chip are both on the same first or second surface of said carrier.
18. A communications system, comprising:
a carrier having a first side and a second side, said first side being electrically integrated with said second side by at least one conductive passageway through said carrier;
a GaAs microwave chip on one of said first and second sides of said carrier; and
at least one second radio frequency chip on one of said first and second sides of said carrier, wherein said GaAs microwave chip and said at least one second radio frequency chip are electrically interconnected by circuit components of said carrier.
19. The communications system of claim 18 , wherein said GaAs microwave chip and said at least one second radio frequency chip are on said first side of said carrier.
20. The communications system of claim 18 , wherein said GaAs microwave chip is on said first side of said carrier and said at least one second radio frequency chip is on said second side of said carrier.
21. The communications system of claim 18 , wherein said system is a portion of a wireless voice and data system.
22. The communications system of claim 18 , wherein said system is a multi-layer TAB tape assembly.
23. The communications system of claim 18 , wherein said carrier is mounted on a circuit board.