Integrated circuit chip module
View Patent ↗On the circuit surfaces of integrated circuit chips, there are adjacently laid out a power source pad for a power source wire at a plus voltage side and a power source pad for a power source wire at a minus voltage side. On a single-surface printed wiring board, a first set of two power source wires and a second set of two power source wires respectively are flip-chip mounted to two power source pads of the integrated circuit chips. The first and second sets of the power source wires are substantially parallel to each other, with substantially constant wire widths and with a substantially constant wire interval. Near the outer periphery of the printed wiring board, the first and second sets of the power source wires are bent smoothly and follow the periphery of the printed wiring board.
1. An integrated circuit chip module comprising:
a first integrated circuit chip including a first power source pad for a plus voltage and a second power source pad for a minus voltage, the first and second power source pads being adjacent to each other; and
a printed wiring board including a first power source wire and a second power source wire substantially to each other parallel, wherein
the first power source wire has a substantially constant width and contacts the first power source pad,
the second power source wire has a substantially constant width and contacts the second power source pad, and
the first and second power source wires are separated from each other by a substantially constant interval.
2. The integrated circuit chip module according to claim 1 , wherein the first and second power source wires are located along an outer periphery of the printed wiring board.
3. The integrated circuit chip module according to claim 1 , wherein each of the first and second power source wires includes a curved portion.
4. The integrated circuit chip module according to claim 1 , wherein the width on each of the first and second power source wires is larger than wire widths of other wires of the printed wiring board.
5. The integrated circuit chip module according to claim 1 , wherein the distance between the first and second power source wires is not larger than 0.1 millimeter.
6. The integrated circuit chip module according to claim 1 , wherein the printed wiring board includes:
a first via-hole having a diameter not larger than the width of the first power source wire and through which the first power source wire is led from a front surface of the printed wiring board to a rear surface of the printed wiring board, and
a second via-hole having a diameter not larger than the width of the second power source wire and through which the second power source wire is led from the front surface to the rear surface.
7. The integrated circuit chip module according to claim 1 , further comprising a capacitor connected between the first and second power source wires at a position within 3 millimeters of the first and second power source pads.
8. The integrated circuit chip module according to claim 1 , wherein the printed wiring board includes an external terminal and a capacitor connected between the first and second power source wires at a position within 5 millimeters of the external terminal.
9. The integrated circuit chip module according to claim 1 , wherein
the first integrated circuit chip further includes a third power source pad for a plus voltage and a fourth power source pad for a minus voltage,
the third and fourth power source pads are adjacent to each other,
the printed wiring board further includes a third power source wire and a fourth power source wire substantially parallel to each other,
the third power source wire has a substantially constant width and contacts the third power source pad,
the fourth power source wire has a substantially constant width and contacts the fourth power source pad, and
the third and fourth power source wires are separated from each other by a substantially constant interval.
10. The integrated circuit chip module according to claim 9 , wherein the first integrated circuit chip includes an analog circuit and a digital circuit, the first and second power source pads being connected to the analog circuit and the third and fourth power source pads being connected to the digital circuit.
11. The integrated circuit chip module according to claim 9 , wherein the first and second power source wires are connected to a first power source and the third and fourth power source wires are connected to a second power source.
12. The integrated circuit chip module according to claim 11 , wherein
the first integrated circuit chip includes a first circuit and a second circuit,
the first and second power source pads are connected to the first circuit,
the third and fourth power source pads are connected to the second circuit, and
current flowing through the first power source wire and current flowing through the second power source wire are substantially the same in a dynamic operating state.
13. The integrated circuit chip module according to claim 9 , wherein
the printed wiring board includes a first external terminal, a second external terminal, and a third external terminal,
the first power source wire is connected to the first external terminal,
the third power source wire is connected to the third external terminal, and
the second and fourth source wires are between the first and third power source wires and connected to the second external terminal.
14. The integrated circuit chip module according to claim 9 , wherein distance between a set including the first and second power source wires and a set including the third and fourth power source wires is at least twice the interval between the first and second power source wires.
15. The integrated circuit chip module according to claim 1 , further comprising a second integrated circuit chip that includes a third power source pad for a plus voltage and a fourth power source pad for a minus voltage, the third and fourth power source pads being adjacent to each other,
the printed wiring board further includes a third power source wire and a fourth power source wire substantially parallel to each other,
the third power source wire has a substantially constant width and contacts the third power source pad,
the fourth power source wire has a substantially constant width and contacts the fourth power source pad, and
the third and fourth power source wires are separated from each other by a substantially constant interval.
16. The integrated circuit chip module according to claim 15 , wherein the first and second power source wires are connected to a first power source, and the third and fourth power source wires are connected to a second power source.
17. The integrated circuit chip module according to claim 16 , wherein
the first integrated circuit chip includes a first circuit and a second circuit,
the first and second power source pads being connected to the first circuit,
the third and fourth power source pads are connected to the second circuit, and
current flowing through the first power source wire and current flowing through the second power source wire are substantially the same in a dynamic operating state.
18. The integrated circuit chip module according to claim 15 , wherein
the printed wiring board includes a first external terminal, a second external terminal, and a third external terminal,
the first power source wire is connected to the first external terminal,
the third power source wire is connected to the third external terminal, and
the second and fourth source wires are between the first and third power source wires and connected to the second external terminal.
19. The integrated circuit chip module according to claim 15 , wherein a distance between a set including the first and second power source wires and a set including the third and fourth power source wires is at least twice the interval between the first and second power source wires.
20. The integrated circuit chip module according to claim 1 , wherein the printed wiring board is a flexible printed wiring board.