Method of producing a light-emitting diode
View Patent ↗A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip 40 mounted on plate-shaped wiring means 60 inside a light-emitting diode. Wiring means 60 comprises conductive paths 61 and 62 that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths 61, 62 are connected electrically to LED chip 40 , extending from the position where the LED is mounted to leads 21 and 22 , to which they are connected by soldering. LED chip 40 is supported by being held inside concave part 23 in one lead 21 at this time.
1. A method of producing a light-emitting diode, comprising the steps of:
mounting at least one LED chip having a pair of electrodes on a plate-shaped wiring means, and electrically connected to a pair of electrical leads by said plate-shaped wiring means,
wherein said plate-shaped wiring means comprises at least a first electrical line and a second electrical line, said first electrical line connecting said pair of leads to each other and said second electrical line electrically connected to one of said pair of leads.
2. A method of producing a light-emitting diode according to claim 1 wherein said step of mounting at least one LED chip comprises a step of mounting several LED chip on a single substrate, where said substrate includes a plurality of wiring means.
3. A method of producing a light-emitting diode according to claim 2 , further comprising a step of cutting said substrate to have specific dimensions such that said plurality of wiring means are separated after said step of mounting several LED chips.
4. A method of producing a light-emitting diode according to claim 3 , further comprising a step of testing said LED chips using said wiring means after said step of separating said plurality of wiring means.
5. A method of producing a light emitting diode according to claim 1 wherein said wiring means is flexible.