Optical materials in packaging micromirror devices
View Patent ↗A method for packaging micromirror array devices is disclosed herein. The method enhances illumination on micromirror array devices by applying a selected optical material between a package lid and glass substrate of the micromirror array device, the selected optical material having a refraction index that matches the refraction indices of the package lid and the glass substrate.
1. A device, comprising:
a package with a first substrate that is transmissive to ultra-violet or visible light;
a micromirror array device placed within the package, wherein the micromirror array device further comprises a second substrate that is transmissive to visible light; and
a light-transmissive optical material that fills the space between and in contact with the first and second substrates, wherein the optical material is in liquid or solid state.
2. The device of claim 1 , wherein the package further comprises: a packaging substrate.
3. The device of claim 2 , wherein the packaging substrate is a concave substrate having a cavity, in which the micromirror array device is disposed; and wherein the opening of the concave substrate is covered and sealed by the package lid.
4. The device of claim 2 , wherein the packaging substrate is a ceramic.
5. The device of claim 2 , wherein the packaging substrate is glass.
6. The device of claim 1 , wherein the first substrate is glass.
7. The device of claim 1 , wherein the micromirror array device comprises a number of micromirrors; and wherein the number of the micromirrors is at least half million.
8. The device of claim 7 , wherein the micromirrors are formed on the glass substrate of the micromirror array device.
9. The method of claim 7 , wherein each micromirror is associated with an electrode of an electrode array so that the micromirror is controlled electrostatically by the electrode, each electrode being connected to a circuitry of a circuitry array so that the electrostatic state of the electrode is controlled by the circuitry; and wherein the circuitry array and the electrode array are formed on a semiconductor substrate that is placed proximate to the glass substrate.
10. The method of claim 7 , wherein the micromirrors are formed on a semiconductor substrate that further comprises an electrode array and a circuitry array for electrostatically controlling the micromirrors of the micromirror array; and wherein the semiconductor substrate and the package lid are placed on separate sides of the glass substrate of the micromirror array device.
11. The method of claim 1 , wherein the optical material is an optical gel.
12. The method of claim 11 , wherein the refraction index of the optical gel to the visible light is substantially the geometrical average of the refraction indices of the package lid and the glass substrate of the micromirror array device to the visible light.
13. The method of claim 11 , wherein the refraction index of the optical gel to the visible light is substantially the arithmetic average of the refraction indices of the package lid and the glass substrate of the micromirror array device to the visible light.
14. The method of claim 11 , wherein the refraction index of the optical gel to the visible light is from 1.3 to 1.7.
15. A method, comprising:
providing a micromirror array device that comprises a glass substrate and a number of micromirrors;
attaching the micromirror array device to a packaging substrate of a package;
providing a packaging lid;
filling a light-transmissive optical material in the space between the glass substrate of the micromirror array device and the packaging lid, wherein the optical material is in liquid or solid state; and
bonding the packaging lid and the packaging substrate.
16. The method of claim 15 , wherein the number of micromirrors of the micromirror array device is at least one million.
17. The method of claim 15 , wherein the micromirrors are formed on the glass substrate; and wherein the micromirrors being electrostatically controlled by an array of electrode, the electrode and circuitry array being formed on a semiconductor substrate that is placed proximate to the glass substrate of the micromirror array device.
18. The method of claim 15 , wherein the micromirrors are formed on a semiconductor substrate that further comprises an array of electrodes and circuitry for electrostatically controlling the micromirrors; and wherein the semiconductor substrate and the packaging lid are placed on separate sides of the glass substrate of the micromirror array device.
19. The method of claim 15 , wherein the packaging substrate is a concave substrate that has a cavity, in which the micromirror array device is attached.
20. The method of claim 15 , wherein the packaging substrate is a ceramic.
21. The method of claim 15 , wherein the packaging substrate is glass.
22. The method of claim 15 , wherein the optical material is an optical gel.
23. The method of claim 22 , wherein the refraction index of the optical gel to the visible light is substantially the geometrical average of the refraction indices of the glass substrate of the micromirror array device and the packaging lid to the visible light.
24. The method of claim 22 , wherein the refraction index of the optical gel to the visible light is substantially the arithmetic average of the refraction indices of the glass substrate of the micromirror array device and the packaging lid to the visible light.
25. The method of claim 22 , wherein the refraction index of the optical gel is from 1.3 to 1.7.