Patent Assignment
Reel/Frame 016800/0574
Assignment of Assignor's Interest
Recorded: 2005-07-28
Pages: 13
Assignor
REFLECTIVITY, INC.
Executed: 2005-06-16
Assignee
VENTURE LENDING & LEASING IV, INC.
2010 NORTH FIRST STREET, SAN JOSE, CALIFORNIA, 95131
Covered Properties
(164)
Reflective Spatial Light Modulator with Encapsulated Micro-Mechanical Elements
Patent:
5,835,256 →
Application:
08/665,380 →
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Patent:
6,046,840 →
Application:
09/160,361 →
Fluoride Gas Etching of Silicon with Improved Selectivity
Patent:
6,290,864 →
Application:
09/427,841 →
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Patent:
6,172,797 →
Application:
09/437,586 →
Monochrome and Color Digital Display Systems and Methods
Patent:
6,388,661 →
Application:
09/564,069 →
Encapsulated multi-directional light beam steering device
Patent:
6,337,760 →
Application:
09/617,149 →
Double substrate reflective spatial light modulator
Patent:
6,356,378 →
Application:
09/624,591 →
Deflectable Spatial Light Modulator Having Superimposed Hinge and Deflectable Element
Patent:
6,529,310 →
Application:
09/631,536 →
Deflectable Spatial Light Modulator Having Stopping Mechanisms
Patent:
6,396,619 →
Application:
09/637,479 →
Apparatus and Method for Flow of Process Gas in an Ultra-Clean Environment
Patent:
6,949,202 →
Application:
09/649,569 →
Projection System and Mirror Elements for Improved Contrast Ratio in Spatial Light Modulators
Method for forming a micromechanical device
Application:
09/767,632 →
Publication:
US 2001/0040675
Transition Metal Dielectric Alloy Materials for Mems
Method for Achieving Improved Selectivity in an Etching Process
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Reflective Spatial Light Modulator with Deflectable Elements Formed on a Light Transmissive Substrate
Projection Display with Full Color Saturation and Variable Luminosity
Projection Display with Multiply Filtered Light
Method for Making a Micromechanical Device by Using a Sacrificial Substrate
Method for Vapor Phase Etching of Silicon
Monochrome and Color Digital Display Systems and Methods for Implementing the Same
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Method for Making a Micromechanical Device by Removing a Sacrificial Layer with Multiple Sequential Etchants
Deflectable Micromirrors with Stopping Mechanisms
Method for Removing a Sacrificial Material with a Compressed Fluid
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Mems with Flexible Portions Made of Novel Materials
Mems Device Made of Transition Metal-Dielectric Oxide Materials
Apparatus and Method for Detecting an Endpoint in a Vapor Phase Etch
Methods for formation of air gap interconnects
Application:
10/270,465 →
Publication:
US 2003/0073302
Spatial Light Modulators with Light Absorbing Areas
Spatial Light Modulators with Light Absorbing Areas
Spatial Light Modulators with Light Blocking/Absorbing Areas
Spatial Light Modulators with Light Blocking and Absorbing Areas
Method for Adjusting a Micro-Mechanical Device
Spatial Light Modulator with Charge-Pump Pixel Cell
Micromirror Elements, Package for the Micromirror Elements, and Projection System Therefor
Multiple Hinge Mems Device
Hinge Structures for Micro-Mirror Arrays
High Angle Micro-Mirrors and Processes
Micromirrors and Off-Diagonal Hinge Structures for Micromirror Arrays in Projection Displays
Methods for Forming and Releasing Microelectromechanical Structures
Barrier Layers for Microelectromechanical Systems
Novel Sacrificial Layers for Use in Fabrications of Microelectromechanical Devices
Optical Materials in Packaging Micromirror Devices
Method for Reading and Writing Memory Cells of Spatial Light Modulators Used in Display Systems
Methods and Apparatus for Selectively Updating Memory Cell Arrays
Micromirrors with Off-Angle Electrodes and Stops
Microelectromechanical device packages with integral heaters
Application:
10/443,318 →
Publication:
US 2004/0232535
Light recapture projection system
Application:
10/444,716 →
Publication:
US 2003/0218726
Prevention of Charge Accumulation in Micromirror Devices Through Bias Inversion
Micromirrors with Mechanisms for Enhancing Coupling of the Micromirrors with Electrostatic Fields
Micromirror Array Device with a Small Pitch Size
Micromirror Array Having Reduced Gap Between Adjacent Micromirrors of the Micromirror Array
Micromirror Having Reduced Space Between Hinge and Mirror Plate of the Micromirror
Data Processing Methods and Apparatus in Digital Display Systems
Deinterleaving Transpose Circuits in Digital Display Systems
Etching Method in Fabrications of Microstructures
Etching Method Used in Fabrications of Microstructures
Multilayer Hinge Structures for Micro-Mirror Arrays in Projection Displays
Patent:
6,804,039 →
Application:
10/692,386 →
Integrated Driver for Use in Display Systems Having Micromirrors
Micromirror and Post Arrangements on Substrates
Device packages with low stress assembly process
Application:
10/698,656 →
Publication:
US 2005/0093134
Micromirrors with Asymmetric Stopping Mechanisms
Patent:
6,876,485 →
Application:
10/703,678 →
Surface processes in fabrications of microstructures
Application:
10/713,671 →
Publication:
US 2005/0106774
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Spatial Light Modulators Having Photo-Detectors for Use in Display Systems
Pre-Oxidization of Deformable Elements of Microstructures
Sequential color illumination in display systems employing light modulators
Application:
10/771,231 →
Publication:
US 2004/0155856
Micromirror Modulation Method and Digital Apparatus with Improved Grayscale
Microelectromechanical Structure and a Method for Making the Same
Microelectromechanical devices with lubricants and getters formed thereon
Application:
10/810,076 →
Publication:
US 2005/0212067
Packaged Microelectromechanical Device with Lubricant
Method of Improving the Performance of Microstructures
Novel Packaging Method for Microstructure and Semiconductor Devices
Projection Tv with Improved Micromirror Array
Packaged Micromirror Array for a Projection Display
Micromirror Array for Projection Tv
Micromirror Array
Projection Display
Packaged Micromirror Array for a Projection Display
Projection Tv with Improved Micromirror Array
Projection Display
Asymmetrical Switching Delay Compensation in Display Systems
Micromirror Array Assembly with in-Array Pillars
Method and Apparatus for Characterizing Microelectromechanical Devices on Wafers
Method and apparatus for qualitatively analyzing uniformity in microelectromechanical devices
Application:
10/875,602 →
Publication:
US 2005/0286044
Performance Analyses of Micromirror Devices
Wafer Matching Methods for Use in Assembling Micromirror Array Devices
Surface lubrication in microstructures
Application:
10/890,352 →
Publication:
US 2006/0007515
Multi-Step Turn Off Mode for Projection Display
Color Rendering of Illumination Light in Display Systems
Color Rendering of Illumination Light in Display Systems
Rear Projection Tv with Improved Micromirror Array
Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
Application:
10/922,565 →
Publication:
US 2005/0045276
Micromirrors and Hinge Structures for Micromirror Arrays in Projection Displays
Micromirrors with Novel Mirror Plates
Patent:
6,980,349 →
Application:
10/927,560 →
Micromirrors and Hinge Structures for Micromirror Arrays in Projection Displays
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
Application:
10/930,450 →
Publication:
US 2005/0048688
Micromirror Having Offset Addressing Electrode
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Micromirror Array Device and a Method for Making the Same
Light Blocking Layers in Mems Packages
Asymmetric Spatial Light Modulator in a Package
Barrier Layers for Microelectromechanical Systems
Display Apparatus with Improved Contrast Ratio
Spatial Light Modulators with Non-Uniform Pixels
Deflection Mechanisms in Micromirror Devices
Methods and Apparatus for Selectively Updating Memory Cell Arrays
Methods and Apparatus for Selectively Updating Memory Cell Arrays
High Angle Micro-Mirrors and Processes
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Micromirror Having Reduced Space Between Hinge and Mirror Plate of the Micromirror
Micromirror Array Having Reduced Gap Between Adjacent Micromirrors of the Micromirror Array
Micromirror Array Having Reduced Gap Between Adjacent Micromirrors of the Micromirror Array
Micromirror Having Reduced Space Between Hinge and Mirror Plate of the Micromirror
Method for removing a sacrificial material with a compressed fluid
Application:
11/041,834 →
Publication:
US 2005/0164127
Microelectromechanical Device Packages with Integral Heaters
Microelectromechanical Device Packages with Integral Heaters
Illumination system with improved optical efficiency
Application:
11/055,334 →
Publication:
US 2005/0219845
Illumination system with improved optical efficiency
Application:
11/055,654 →
Publication:
US 2005/0231958
Micromirror Device and Method for Making the Same
Micromirror Devices with in-Plane Deformable Hinge
Micromirror Device and Method for Making the Same
Integrated Driver for Use in Display Systems Having Micromirrors
Micromirrors with Mechanisms for Enhancing Coupling of the Micromirrors with Electrostatic Fields
Method of repairing micromirrors in spatial light modulators
Application:
11/069,317 →
Publication:
US 2006/0193028
Method of Repairing Micromirrors in Spatial Light Modulators
Methods for Depositing, Releasing and Packaging Microelectromechanical Devices on Wafer Substrates
Application:
11/070,036 →
Publication:
US 2005/0139940
Spatial Light Modulators with Light Blocking/Absorbing Areas
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Double Substrate Reflective Spatial Light Modulator with Self-Limiting Micro-Mechanical Elements
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Application:
11/093,942 →
Publication:
US 2005/0170557
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Method for Making a Micromechanical Device by Using a Sacrificial Substrate
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Low Cost Hermetically Sealed Package
Micromirror Array Device with Compliant Adhesive
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Electrical Contacts in Microelectromechanical Devices with Multiple Substrates
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Application:
11/102,108 →
Publication:
US 2005/0214976
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
Application:
11/102,187 →
Publication:
US 2005/0179982
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
Application:
11/102,214 →
Publication:
US 2005/0260793
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Application:
11/102,291 →
Publication:
US 2005/0191789
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
Application:
11/102,295 →
Publication:
US 2005/0191790
Optical Coating on Light Transmissive Substrates of Micromirror Devices
Interferometers of high resolutions
Application:
11/109,994 →
Publication:
US 2006/0232784
Micromirror Array Device with Electrostatically Deflectable Mirror Plates
Characterization of Micromirror Array Devices Using Interferometers
Interferometers of High Resolutions
Sequential color modulation method in display systems
Application:
11/120,457 →
Publication:
US 2005/0195137
Micromirror Array Devices with Light Blocking Areas
Signal synchronization in display systems
Application:
11/128,607 →
Publication:
US 2006/0256821
Microelectromechanical Devices with Low Inertia Movable Elements
Protection Layers in Micromirror Array Devices
Micromirror Projection of Polarized Light
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 20, 2001
From: REID, JASON S.
To: REFLECTIVITY, INC.
Reel/Frame 012079/0807 →
Assignment of Assignor's Interest
Nov 16, 2001
From: HUIBERS, ANDREW G.
To: REFLECTIVITY, INC.
Reel/Frame 012318/0426 →
Assignment of Assignor's Interest
Jan 9, 2002
From: HUIBERS, ANDREW G.
To: REFLECTIVITY, INC.
Reel/Frame 012485/0295 →
Assignment of Assignor's Interest
Jan 11, 2002
From: RICHARDS, PETER W.; HUIBERS, ANDREW G.; MUIR, GREGORY R.
To: REFLECTIVITY, INC.
Reel/Frame 012485/0338 →
Assignment of Assignor's Interest
Jan 16, 2002
From: HUIBERS, ANDREW G.; RICHARDS, PETER W.
To: REFLECTIVITY, INC.
Reel/Frame 012511/0614 →
Assignment of Assignor's Interest
Jun 21, 2004
From: HUIBERS, ANDREW G.; HEUREUX, PETER; REID, JASON
To: REFLECTIVITY, INC.
Reel/Frame 015487/0736 →
Assignment of Assignor's Interest
Jun 21, 2004
From: HUIBERS, ANDREW; HEUREUX, PETER; REID, JASON
To: REFLECTIVITY, INC.
Reel/Frame 015530/0446 →
Assignment of Assignor's Interest
Jun 24, 2004
From: TRUE, RANDALL J.; HULBERS, ANDREW G.; REID, JASON
To: REFLECTIVITY, INC.
Reel/Frame 015534/0882 →
Assignment of Assignor's Interest
Feb 14, 2005
From: HUIBERS, ANDREW G.
To: REFLECTIVITY, INC.
Reel/Frame 015712/0886 →
Assignment of Assignor's Interest
Feb 24, 2005
From: HUIBERS, ANDREW G.
To: REFLECTIVITY, INC.
Reel/Frame 015787/0211 →
Assignment of Assignor's Interest
Mar 25, 2005
From: PATEL, SATYADEV R.; SCHAADT, GREGORY P.; MACDONALD, DOUGLAS B.; SHI, HONGQIN
To: REFLECTIVITY, INC.
Reel/Frame 015963/0141 →
Assignment of Assignor's Interest
Jul 10, 2006
From: REFLECTIVITY, INC.
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 017897/0553 →
Assignment of Assignor's Interest
Jul 10, 2006
From: REFLECTIVITY, INC.
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 017897/0648 →
Release of Security Interest
Jul 11, 2006
From: VENTURE LENDING & LEASING IV, INC.
To: REFLECTIVITY, INC.
Reel/Frame 017906/0940 →
Release of Security Interest
Jul 11, 2006
From: VENTURE LENDING & LEASING IV, INC.
To: REFLECTIVITY, INC.
Reel/Frame 017906/0887 →