Package for optical semiconductor

1. A package for an optical semiconductor comprising

a wiring board on which a light-emitting device and a light-receiving device are mounted and which has a circuit pattern for wiring of said devices;

a surrounding member layer made of a resin material having a light transmittance property so as to cover outer surfaces of the light-emitting device and the light-receiving device;

a substrate member layer made of a transparent material covering the outer surface of the surrounding member layer; and

a straight groove formed in said surrounding member and said substrate member between the light-emitting device and the light-receiving device,

wherein said straight groove is filled with a material having light shielding property and, has a depth which extends from a side from which light beam emitted from the light-emitting device emerges outside and which does not reach said wiring board so that at least a conducting portion of the circuit pattern on said wiring board exists below said straight groove such that the light-emitting device and light-receiving device are connected electrically passing under the groove.

2. A package for an optical semiconductor according to claim 1 , wherein a glass substrate layer having a light transmittance property is provided on the surrounding member layer.

3. A package for an optical semiconductor according to claim 2 , wherein the glass substrate layer is a light diffraction member.

4. A package for an optical semiconductor according to claim 1 , wherein a sheet member having a light-shielding property is inserted into the groove.

5. A package for an optical semiconductor according to claim 1 , wherein surfaces of the groove are subjected to mirror surface finishing.