Test system including a test circuit board including resistive devices
View Patent ↗A test system includes a device under test and a test circuit board. The device under test includes a plurality of contacts configured to provide output signals. The test circuit board may convey the output signals from the device under test to an analyzer. The test circuit board may include a dielectric layer, a via extending through the dielectric layer, a conductor formed on the dielectric layer and a resistive annular ring having a predetermined resistance value. The resistive annular ring may be formed around the via and may be electrically coupled between the via and the conductor.
1. A test system comprising:
a device under test including a plurality of contacts configured to provide output signals;
a test circuit board coupled to convey said output signals from said device under test to an analyzer unit, said test circuit board comprising:
a dielectric layer;
a via extending through said dielectric layer;
a conductor formed on said dielectric layer; and
a resistive annular ring having a predetermined resistance value formed around said via and electrically coupled between said via and said conductor, wherein said resistive annular ring provides a termination resistance between a given output signal contact and a circuit ground.
2. The test system as recited in claim 1 , wherein said resistive annular ring is made of a resistive material.
3. The test system as recited in claim 2 , wherein said resistive annular ring further includes additional resistive material coupled between said resistive annular ring and said conductor, wherein said additional resistive material forms a resistive stub having a predetermined length.
4. The test system as recited in claim 3 , wherein said predetermined resistance value is adjustable by varying said predetermined length of said resistive stub during manufacturing.
5. The test system as recited in claim 1 , wherein said conductor is a signal trace.
6. The test system as recited in claim 1 , wherein said conductor is a plane.
7. The test system as recited in claim 1 , wherein said test circuit board further comprising a conductor forming an annular ring between said resistive annular ring and said via and formed on said dielectric layer.
8. A method of testing a device including a plurality of contacts, said method comprising:
providing output signals from said plurality of contacts of said device;
conveying said output signals from said device to an analyzer using a test circuit board, said test circuit board comprising:
a dielectric layer;
a via extending through said dielectric layer;
a conductor formed on said dielectric layer; and
a resistive annular ring having a predetermined resistance value formed around said via and electrically coupled between said via and said conductor, wherein said resistive annular ring provides a termination resistance between a given output signal contact and a circuit ground.
9. The method as recited in claim 8 , wherein said resistive annular ring is made of a resistive material.
10. The method as recited in claim 9 , wherein said resistive annular ring further includes additional resistive material coupled between said resistive annular ring and said conductor, wherein said additional resistive material forms a resistive stub having a predetermined length.
11. The method as recited in claim 10 further comprising adjusting said predetermined resistance value by varying said predetermined length of said resistive stub during manufacturing.
12. The method as recited in claim 8 , wherein said conductor is a signal trace.
13. The method as recited in claim 8 , wherein said conductor is a plane.
14. The method as recited in claim 8 , wherein said test circuit board further comprising a conductor forming an annular ring between said resistive annular ring and said via and formed on said dielectric layer.
15. A circuit board comprising:
a dielectric layer;
a via extending through said dielectric layer;
a conductor formed on said dielectric layer; and
a resistive annular ring having a predetermined resistance value formed around said via and electrically coupled to said via; and
additional resistive material having an additional resistance value formed between and electrically coupling said resistive annular ring and said conductor;
wherein said additional resistive material forms a resistive stub, wherein said additional resistance value is determined by its length.
16. A test system comprising:
a device under test including a plurality of contacts configured to provide output signals;
a test circuit board coupled to convey said output signals from said device under test to an analyzer unit, said test circuit board comprising:
a dielectric layer;
a via extending through said dielectric layer;
a conductor formed on said dielectric layer; and
a resistive annular ring having a predetermined resistance value formed around said via and electrically coupled between said via and said conductor, wherein said resistive annular ring provides a series resistance between a given output signal contact and a corresponding one of said plurality of input signal contacts.
17. A test system comprising:
a device under test including a plurality of contacts configured to provide output signals;
a test circuit board coupled to convey said output signals from said device under test to an analyzer unit, said test circuit board comprising:
a dielectric layer;
a via extending through said dielectric layer;
a conductor formed on said dielectric layer; and
a resistive annular ring having a predetermined resistance value formed around said via and electrically coupled between said via and said conductor, wherein said resistive annular ring is made of a resistive material, and wherein said resistive annular ring further includes additional resistive material coupled between said resistive annular ring and said conductor, wherein said additional resistive material forms a resistive stub having a predetermined length.