IP Library Granted Patent US 6,897,488
Granted Patent B2
US 6,897,488 · App. 10/415,810 · Granted May 24, 2005

Radiation-emitting chip

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Quick Facts
Patent No.
US 6,897,488
App. No.
10/415,810
Granted
May 24, 2005
Kind
B2
Abstract

A light-emitting chip ( 3 ) has a lens-type coupling-out window ( 4 ), whose base area ( 5 ) is provided with a mirror area ( 6 ). Arranged on a coupling-out area ( 7 ) of the coupling-out window ( 4 ) is a layer sequence ( 9 ), with a photon-emitting pn junction ( 10 ). The photons emitted by the pn junction are reflected at the mirror area ( 6 ) and can leave the coupling-out window ( 4 ) through the coupling-out area ( 7 ).

Claims (97)

1. A chip for optoelectronics, in particular an LED chip, having a photon-emitting active region and a coupling-out window having at least one coupling-out area,

wherein

the active region is arranged downstream of the coupling-out window relative to a main radiation direction of the chip, wherein a mirror area is formed on that side of the coupling-out window which is opposite to the active region wherein the coupling-out areas project laterally beyond the side areas of the active region, and wherein a contact layer is formed between the active region and the coupling-out window.

2. The chip as claimed in claim 1 ,

wherein

the active region is a layer sequence formed on the coupling-out window.

3. The chip as claimed in claim 1 ,

wherein

the chip has a chip axis running through the active region.

4. The chip as claimed in claim 1 ,

wherein

the coupling-out window has a dome-like, in particular spherical-cap-like form, the coupling-out window tapering toward the active region.

5. The chip as claimed in claim 4 ,

wherein

a radius of curvature of a coupling-out area R 2 is greater than or equal

2

H

-

R

2

n

A

n

i

and less than or equal to

2

H

+

R

2

n

A

n

i

,

where H is equal to the to height of the chip.

6. The chip as claimed in claim 5 ,

wherein

the following holds true for half the maximum dimension R 1 of the layer sequence along the coupling-out area:

R 1 <R 2 n A /n i .

7. The chip as claimed in claim 1 ,

wherein

the coupling-out window is formed in the shape of a truncated pyramid at least in sections.

8. The chip as claimed in claim 7 ,

wherein

the coupling-out window formed in the shape of a truncated pyramid at least in sections envelopes a spherical segment.

9. The chip as claimed in claim 7 ,

wherein

the coupling-out window which is in the shape of a truncated pyramid at least in sections envelopes a rotational ellipsoid with a longitudinal axis running through the active region.

10. The chip as claimed in claim 1 ,

wherein

the coupling-out window is formed as a Fresnel lens.

11. The chip as claimed in claim 1 ,

wherein

the mirror area has, below the active region, elevations which direct the photons in a lateral direction.

12. The chip as claimed in claim 1 ,

wherein

the minor area is curved.

13. The chip as claimed in claim 12 ,

wherein

the mirror area is formed in concave fashion as seen from the active region.

14. The chip as claimed in claim 13 ,

wherein

the mirror area is formed as a paraboloid.

15. The chip as claimed in claim 1 ,

wherein

the mirror area is formed as a Fresnel mirror.

16. The chip as claimed in claim 1 ,

wherein

the mirror area serves as a contact area.

17. The chip as claimed in claim 1 ,

wherein

the mirror area is formed besides contact areas.

18. The chip as claimed in claim 17 ,

wherein

the contacts are formed in strip-type fashion.

19. The chip as claimed in claim 17 ,

wherein

the contacts are formed in reticulated fashion.

20. The chip as claimed in claim 17 ,

wherein

the contact area is opposite the active region.

21. The chip as claimed in claim 1 ,

wherein

a nitride-based active region is provided and the coupling-out window has SiC or SiC-based material.

22. The chip as claimed in claim 21 ,

wherein

a radiation-emitting layer of the active region has GaN, InGaN, AlGaN and/or InGaAlN.

23. The chip as claimed in claim 1 ,

wherein

the active region is grown on the coupling-out window.

24. A chip for optoelectronics, in particular an LED chip, having a photon-emitting active region and a coupling-out window having at least one coupling-out area,

wherein the active region is arranged downstream of the coupling window relative to a main radiation direction of the chip, wherein a mirror area is formed on that side of the coupling-out window which is opposite to the active region, wherein the coupling-out areas project laterally beyond the side areas of the active region, and wherein the material of the coupling-out window has a larger refractive index than the material of the active region.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2019
From: OSRAM GMBH
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 051381/0694 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2003
From: BAUR, JOHANNES; EISERT, DOMINIK; FEHRER, MICHAEL; HAHN, BERTHOLD; HARLE, VOLKER; JACOB, ULRICH; OBERSCHMID, RAIMUND; PLASS, WERNER; STRAUSS, UWE; VOLKL, JOHANNES; ZEHNDER, ULRICH
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 014554/0439 →