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App. No. 10/417,086 · Confirmation No. 6517

Apparatus and method for electrolytically depositing copper on a semiconductor workpiece

Expressly Abandoned -- During Examination View Publication ↗
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2005-09-13 ABN.EXPRESS Internal document noting that an Express Abandonment request has been processed 2 View
2005-09-02 EABN Letter Express Abandonment of the application 2 View
2004-04-17 WFEE Fee Worksheet (SB06) 1 View
2003-10-01 DRW Drawings-only black and white line drawings 9 View
2003-09-12 OATH Oath or Declaration filed 6 View
2003-09-11 IDS Information Disclosure Statement (IDS) Form (SB08) 11 View
2003-08-22 C.AD Change of Address 2 View
2003-07-29 PEFN Pre-Exam Formalities Notice 2 View
2003-04-17 TRNA Transmittal of New Application 4 View
2003-04-17 ADS Application Data Sheet 3 View
2003-04-17 A.PE Preliminary Amendment 16 View
2003-04-17 SPEC Specification 21 View
2003-04-17 CLM Claims 10 View
2003-04-17 ABST Abstract 1 View
2003-04-17 DRW Drawings-only black and white line drawings 8 View
2003-04-17 OATH Oath or Declaration filed 4 View
2003-04-17 IMIS Miscellaneous Internal Document 1 View
2003-04-17 WFEE Fee Worksheet (SB06) 1 View
2003-04-17 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/417,086
Filed
2003-04-17
Pub. No.
US20040035708A1
Art Unit
1753