IP Library › Granted Patent US 6,914,326
Granted Patent B2
US 6,914,326 · App. 10/421,132 · Granted Jul 5, 2005

Solder ball landpad design to improve laminate performance

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,914,326
App. No.
10/421,132
Granted
Jul 5, 2005
Kind
B2
Abstract

A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.

Claims (40)

1. A system comprising:

a processor; and

an integrated circuit package operatively coupled to the processor, the integrated circuit package comprising an integrated circuit die coupled to a substrate, the substrate comprising a first surface and a second surface, the second surface having a plurality of pads, each pad having one or more conductive traces extending on the second surface therefrom and configured to increase the shear strength of the pad as compared to the pad alone.

2. The system, as set forth in claim 1 , wherein the integrated circuit die comprises a memory die.

3. The system, as set forth in claim 1 , wherein the substrate comprises a slot.

4. The system, as set forth in claim 1 , wherein the integrated circuit die is mounted on the substrate in a board-on-chip fashion.

5. The system, as set forth in claim 1 , wherein the second surface of the substrate comprises one or more pads having a first conductive trace extending therefrom at an angle of approximately 180° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads and a second conductive trace extending therefrom at an angle of approximately 315° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads.

6. The system, as set forth in claim 1 , wherein the second surface of the substrate comprises one or more pads having a conductive trace extending therefrom at an angle of approximately 270° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads.

7. The system, as set forth in claim 1 , wherein the second surface of the substrate comprises one or more pads having a first conductive trace extending therefrom at an angle of approximately 225° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads and a second conductive trace extending therefrom at an angle of approximately 315° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads.

8. The system, as set forth in claim 1 , wherein the second surface of the substrate comprises one or more pads having a first conductive trace extending therefrom at an angle of approximately 180° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads and a second conductive trace extending an angle of approximately 225° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads.

9. The system, as set forth in claim 1 , wherein the second surface of the substrate comprises one or more pads having a conductive trace extending therefrom at an angle of approximately 0° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads.

10. The system, as set forth in claim 1 , wherein the second surface of the substrate comprises one or more pads having a conductive trace extending therefrom at an angle of approximately 315° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads.

11. The system, as set forth in claim 1 , wherein the second surface of the substrate comprises one or more pads having a conductive trace extending therefrom at an angle of approximately 225° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads.

12. The system, as set forth in claim 1 , wherein the second surface of the substrate comprises one or more pads having a conductive trace extending therefrom at an angle of approximately 180° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads.

13. The system, as set forth in claim 1 , wherein the second surface of the substrate comprises one or more pads having one of:

a first conductive trace extending therefrom at an angle of approximately 180° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads and a second conductive trace extending therefrom at an angle of approximately 315° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads;

a conductive trace extending therefrom at an angle of approximately 270° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads;

a first conductive trace extending therefrom at an angle of approximately 225° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads and a second conductive trace extending therefrom at an angle of approximately 315° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads;

a first conductive trace extending therefrom at an angle of approximately 180° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads and a second conductive trace extending an angle of approximately 225° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads;

a conductive trace extending therefrom at an angle of approximately 0° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads;

a conductive trace extending therefrom at an angle of approximately 315° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads;

a conductive trace extending therefrom at an angle of approximately 225° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads; and

a conductive trace extending therefrom at an angle of approximately 180° relative to the direction of a force which may be applied to a solderball disposed on the one or more pads.

14. A system comprising:

a processor; and

an integrated circuit package operatively coupled to the processor, the integrated circuit package comprising an integrated circuit die coupled to a substrate, each substrate comprising a first surface and a second surface, the second surface having an array of landpads, the array comprising four corner landpads, each of the four corner landpads having one or more conductive traces extending planarly therefrom and configured to increase the shear strength of the pad.

15. The system, as set forth in claim 14 , wherein the integrated circuit die comprises a memory die.

16. The system, as set forth in claim 14 , wherein the substrate comprises a slot.

17. The system, as set forth in claim 14 , wherein the integrated circuit die is mounted on the substrate in a board-on-chip fashion.

18. The system, as set forth in claim 14 , wherein the second surface of the substrate comprises four corner landpads, each corner landpad having a conductive trace extending therefrom at an angle of approximately 180° and a conductive trace extending therefrom at an angle of approximately 315° to increase the shear strength of the pad, the angles being relative to a shear force applied in a direction perpendicular to an edge of the substrate.

19. The system, as set forth in claim 14 , wherein the second surface of the substrate comprises four corner landpads, each corner landpad having a conductive trace extending therefrom at an angle of approximately 180°, a conductive trace extending therefrom at an angle of approximately 90°, and a conductive trace extending therefrom at an angle of approximately 315° to increase the shear strength of the pad, the angles being relative to a shear force applied in a direction perpendicular to an edge of the substrate.

20. A system comprising:

a processor; and

an integrated circuit package comprising:

a substrate comprising a first surface, wherein the first surface comprises a plurality of pads configured to receive a conductive connection and wherein at least one of the plurality of pads has one or more terminated traces extending therefrom; and

integrated circuit die coupled to a second surface of the substrate.

21. The system, as set forth in claim 20 , wherein the plurality of pads comprise corner pads each having one or more terminated traces extending therefrom.

22. The system, as set forth in claim 21 , wherein each of the corner pads has a first terminated trace extending therefrom, each first terminated trace being perpendicular to each of a first and second peripheral edge of the substrate.

23. The system, as set forth in claim 22 , wherein each of the corner pads has a second terminated trace extending therefrom, each second terminated trace being perpendicular to each of a third and fourth peripheral edge of the substrate.

24. The system, as set forth in claim 21 , wherein the integrated circuit die comprises a memory device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →