Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board
View Patent ↗What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to intersect the conductor. A conductive body in an activated state is introduced into the non-conductive via, and upon contacting the conductor, the activated state conductive body adheres to the conductor. The activated state conductive body is then effected to a deactivated state, wherein the conductive body is affixed to the conductor to provide an electrical connection thereto.
1. A method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board having a non-conductive via through at least a portion of the multi-layer printed circuit board, the non-conductive via intersecting the conductor on the inner layer, the method comprising:
introducing a conductive body at one end of the non-conductive via, the conductive body having an activated state within the non-conductive via;
causing the conductive body in the activated state to migrate in the direction of the conductor whereby the conductive body is spaced from the end and adheres to the conductor upon contact thereto; and
deactivating the conductive body from the activated state whereby the conductive body affixes to the conductor to provide an electrical connection to the conductor.
2. The method of claim 1 , further comprising introducing a conductive material into the non-conductive via after the conductive body is affixed to the conductor, the conductive material providing an electrical connection to the conductive body.
3. The method of claim 2 , wherein introducing a conductive material comprises introducing a contact of an electrical component into the non-conductive via, the contact electrically connecting to the conductive material.
4. The method of claim 1 , wherein:
the multi-layer printed circuit board comprises a second conductor on a second inner layer;
causing the conductive body to migrate further comprises causing the conductive body to adhere to the second conductor; and
deactivating the conductive body forms an electrical connection between the conductor and the second conductor.
5. The method of claim 1 , wherein the conductive body in the activated state migrates down the non-conductive via.
6. The method of claim 1 , wherein the conductive body is spaced apart from two ends of the non-conductive via.