Patent Assignment
Reel/Frame 017223/0611
Assignment of Assignor's Interest
Recorded: 2006-02-13
Received: 2006-02-13
Pages: 34
Assignor
TERADYNE, INC.
Executed: 2005-11-30
Assignee
AMPHENOL CORPORATION
358 HALL AVENUE, WALLINGFORD, CT, 06492, UNITED STATES
Covered Properties
(65)
Connector with Reference Conductor Contact
Application:
11/220,382 →
High Speed High Density Electrical Connector
Application:
11/183,564 →
Differential Electrical Connector Assembly
Application:
11/173,926 →
Midplane Especially Applicable to an Orthogonal Architecture Electronic System
Application:
11/173,927 →
Connector with improved shielding in mating contact region
Application:
60/695,264 →
High speed, high density electrical connector
Application:
60/695,705 →
Connector with offset differential signal conductors
Application:
60/695,308 →
Reduced cost printed circuit board
Application:
11/115,874 →
Environmentally sealed chip socket
Application:
11/059,492 →
Bare die socket
Application:
11/053,448 →
Midplane especially applicable to an orthogonal architecture electronic system
Application:
60/638,973 →
Differential electrical connector assembly
Application:
60/638,971 →
Bare die socket
Application:
60/639,064 →
Air Cooling Architecture for Orthogonal Board Architectures
Application:
11/011,838 →
High density midplane
Application:
10/959,652 →
High Speed, High Density Electrical Connector
Application:
10/955,571 →
Electronic System with Non-Parallel Arrays of Circuit Card Assemblies
Application:
10/954,865 →
Modular Liquid Cooling of Electronic Assemblies
Application:
10/954,441 →
Backplane with Routing to Reduce Layer Count
Application:
10/952,103 →
Apparatus and Method for Calibrating Equipment for High Frequency Measurements
Application:
10/897,638 →
Thermally Enhanced Pressure Regulation of Electronics Cooling Systems
Application:
10/886,449 →
Flexible Optical Interconnection System
Application:
10/882,598 →
Optical Waveguide Assembly
Application:
10/881,248 →
Electrical Connector Incorporating Passive Circuit Elements
Application:
10/874,837 →
Methods of manufacturing an electrical connector incorporating passive circuit elements
Application:
10/874,669 →
High Speed Connector Assembly
Application:
10/744,328 →
Optical Connector Assembly with Features for Ease of Use
Application:
10/745,475 →
Modular Rackmount Chiller
Application:
10/741,542 →
High Speed, High Density Electrical Connector Assembly
Application:
10/675,087 →
Protective Covers for Fiber Optic Connector to Modular Protective Covers for Fiber Optic Connector Assembly.
Application:
10/672,779 →
High Speed, High Density Electrical Connector and Connector Assembly
Application:
10/606,681 →
High Speed, High Density Electrical Connector
Application:
10/606,865 →
High Speed, High Density Electrical Connector
Application:
10/606,680 →
Printed Circuit Board for High Speed, High Density Electrical Connector with Improved Cross-Talk Minimization, Attenuation and Impedance Mismatch Characteristics
Application:
10/603,048 →
Electrical Connector with Multi-Beam Contact
Application:
10/464,166 →
Method of Making an Electrical Connection to a Conductor on an Inner Layer of a Multi-Layer Printed Circuit Board
Application:
10/422,515 →
Systems and Methods for Inspecting an Optical Interface
Application:
10/329,881 →
Latch and Release System for a Connector
Application:
10/326,480 →
Interconnection System with Improved High Frequency Performance
Application:
10/325,222 →
Ferrule Assembly and Methods Therefor
Application:
10/324,816 →
Electrical Connector with Conductive Plastic Features
Application:
10/320,886 →
Methods and Apparatus for Forming a Fiber Optic Connection
Application:
10/261,713 →
Techniques for Forming Fiber Optic Connections in a Modularized Manner
Application:
10/243,458 →
Signal Launch Connecting Techniques
Application:
10/200,788 →
Modular Fiber Optic Connection System
Application:
10/195,960 →
Optical Connector Ferrule Designed to Minimize Manufacturing Imperfections and Mating Misalignments by Incorporating Exact Constraint Principles
Application:
10/195,951 →
Waferized Fiber Optic Connector
Application:
10/196,075 →
Techniques for Connecting a Set of Connecting Elements Using an Improved Latching Apparatus
Application:
10/195,288 →
Methods and Apparatus for Cleaning Optical Connectors
Application:
10/156,905 →
Shielded Waferized Connector
Application:
10/131,055 →
Printed Circuit Board for Differential Signal Electrical Connectors
Application:
10/118,302 →
Matrix Connector with Intergrated Power Contacts
Application:
10/113,203 →
Self-Aligning Electrical Connector
Application:
10/061,120 →
Matrix Connector
Application:
10/062,392 →
Electrical Connector
Application:
10/056,881 →
High Speed Multi-Layer Printed Circuit Board Via
Application:
10/007,689 →
Direct Inner Layer Interconnect for a High Speed Printed Circuit Board
Application:
09/892,045 →
High Speed Pressure Mount Connector
Application:
09/878,549 →
Electrical Solder Ball Contact
Application:
09/877,920 →
High-Density Fiber Optic Backplane
Application:
09/777,412 →
Connector with Egg-Crate Shielding
Application:
09/774,763 →
Techniques for Selectively Exposing and Protecting an Optical Interface Using Film
Application:
09/774,734 →
Techniques for Cleaning an Optical Interface of an Optical Connection System
Application:
09/773,347 →
Connector Molding Method and Shielded Waferized Connector Made Therefrom
Application:
09/769,868 →
Waferized Power Connector
Application:
09/769,867 →