Interconnection designs and materials having improved strength and fatigue life
View Patent ↗Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.
1. A device comprising:
a passivation layer on a surface of a substrate having at least one opening;
a contact pad on the surface of the substrate in the opening of the passivation layer; and
an interconnect bump in electrical connection with the contact pad and extending beyond a surface of the contact pad to contact the passivation layer.
2. The device of claim 1 , the substrate further comprising an integrated circuit die.
3. The device of claim 1 , the substrate further comprising an integrated circuit package.
4. The device of claim 1 , the interconnect bump further comprising an electrically conductive polymer.
5. The device of claim 1 , the interconnect bump further comprising a silver-filled epoxy.
6. The device of claim 1 , the interconnect bump further comprising an interconnect bump formed from a material having a modulus in the approximate range of 0.5 to 6 GigaPascals.