Carrier-attached copper foil and printed board using the copper foil
View Patent ↗The present invention relates to a carrier-added copper foil and a print substrate using such copper foil characterized in comprising a resin layer and a functional material layer at least on a part of the copper foil. A carrier-added copper foil and a print substrate using such copper foil are obtained by forming an insulating layer and functional material layer having an area smaller than the area of the copper foil on the surface of the carrier-added copper foil with the screen printing method, thereby improving the handling of such copper foil, preventing the adhesion of contaminants such as resin powder on the copper foil surface during the cutting procedure, preventing scratches and dimples caused by foreign matter, and effectively preventing the generation of scratches, wrinkles and creases during the cutting, packaging and transportation procedures.
1. A carrier-added copper foil, comprising:
a copper foil laminated to a carrier, said carrier being selected from a group consisting of a metal plate, a metal foil, and a resin film, and said carrier-added copper foil being cut to a prescribed size; and
a resin layer and a functional material layer formed adjacent to each other on a face of said copper foil opposite said carrier, said resin layer having an area smaller than an area of said face of said copper foil excluding a peripheral edge of said copper foil, and said functional material layer being of a material selected from a group consisting of an insulating material, a resistance material, a conductive material, and a magnetic material.
2. A carrier-added copper foil according to claim 1 , wherein at least a part of said resin layer is an insulating layer.
3. A carrier-added copper foil according to claim 2 , wherein said functional material layer has ferroelectrics dispersed therein.
4. A carrier-added copper foil according to claim 3 , wherein at least one of said resin layer and said functional material layer is a printed layer.
5. A carrier-added copper foil according to claim 4 , wherein said copper foil has a shining surface face (S surface) that is laminated to said carrier.
6. A carrier-added copper foil, comprising:
a copper foil laminated to a carrier; and
a resin layer and a functional material layer formed adjacent to each other on a face of said copper foil opposite said carrier;
said functional material layer having ferroelectrics dispersed therein.
7. A carrier-added copper foil according to claim 6 , wherein at least one of said resin layer and said functional material layer is a printed layer.
8. A carrier-added copper foil according to claim 6 , wherein said carrier is selected from a group consisting of a metal plate, a metal foil, and a resin film.
9. A carrier-added copper foil according to claim 6 , wherein the copper foil has a shining surface face (S surface) that is laminated to said carrier.
10. A printed substrate, comprising:
a carrier-added copper foil formed by a copper foil laminated to a carrier selected from a group consisting of a metal plate, a metal foil, and a resin film, said carrier-added copper foil being cut to a prescribed size; and
a resin layer and a functional material layer formed adjacent to each other on a face of said copper foil opposite said carrier, said resin layer having an area smaller than an area of said face of said copper foil excluding a peripheral edge of said copper foil, and said functional material layer being of a material selected from a group consisting of an insulating material, a resistance material, a conductive material, and a magnetic material.
11. A printed substrate according to claim 10 , wherein at least a part of said resin layer is an insulating layer.
12. A printed substrate according to claim 10 , wherein said functional material layer has ferroelectrics dispersed therein.
13. A printed substrate according to claim 10 , wherein at least one of said resin layer and said functional material layer is a printed layer.
14. A printed substrate according to claim 10 , wherein said copper foil has a shining surface face (S surface) that is laminated to said carrier.