Multiple chips bonded to packaging structure with low noise and multiple selectable functions
View Patent ↗A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.
1. A chip package comprising:
a circuit component;
a first chip connected to said circuit component, wherein said first chip has multiple first bit-width options, wherein said multiple first bit-width options comprise a x8 option;
multiple first metal bumps connecting said first chip to said circuit component, wherein said first chip is connected to said circuit component in a flip-chip assembly; and
a second chip connected to said circuit component, wherein said second chip has multiple second bit-width options.
2. The chip package of claim 1 , wherein said circuit component comprises a substrate.
3. The chip package of claim 1 further comprising multiple second metal bumps connecting said second chip to said circuit component, wherein said second chip is connected to said circuit component in a flip-chip assembly.
4. The chip package of claim 1 , wherein said multiple first bit-width options further comprise a x4 option.
5. The chip package of claim 1 , wherein said multiple second bit-width options comprise a x4 option.
6. The chip package of claim 1 , wherein said multiple second bit-width options comprise a x8 option.
7. The chip package of claim 1 , wherein said multiple first bit-width options further comprise a x16 option.
8. The chip package of claim 1 wherein said multiple second bit-width options comprise a x16 option.
9. The chip package of claim 1 further comprising a capacitor over said circuit component.
10. The chip package of claim 9 , wherein said capacitor comprises a first terminal connected to a power plane of said circuit component and a second terminal connected to a ground plane of said circuit component.
11. The chip package of claim 1 , wherein said circuit component comprises a control terminal connecting said first and second chips.
12. The chip package of claim 11 , wherein said control terminal comprises solder.
13. The chip package of claim 1 , wherein said circuit component comprises a selection terminal connecting said first and second chips.
14. The chip package of claim 13 , wherein said selection terminal comprises solder.