Assignment of Assignor's Interest

Recorded: 2013-07-11 Pages: 4

Assignors

LIN, MOU-SHIUNG

Executed: 2000-02-23

PENG, BRYAN

Executed: 2000-02-23

Assignee

MEGIC CORPORATION

21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN

Covered Properties (3)

Multiple Chips Bonded to Packaging Structure with Low Noise and Multiple Selectable Functions

Patent: 7,045,901 →

Application: 10/371,505 →

Publication: US 2003/0127749

Electronic Device and Chip Package

Patent: 7,205,646 →

Application: 10/420,595 →

Publication: US 2003/0205826

Multiple Chips Bonded to Packaging Structure with Low Noise and Multiple Selectable Functions

Patent: 7,468,551 →

Application: 10/437,333 →

Publication: US 2003/0201545

Related Assignments (2)

Other recorded transfers of the patents in this record — the chain of ownership.