Granted Patent
Utility
US 6,835,600
· Confirmation No. 6471
LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
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Code | Description | Pages | ||
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| 2020-06-11 | OATH |
Oath or Declaration filed | 262 | View | |
| 2004-08-24 | CTMS |
Miscellaneous Action with shortened statutory period (SSP) | 2 | View | |
| 2004-08-24 | 1449 |
List of References cited by applicant and considered by examiner | 1 | View | |
| 2004-03-29 | IFEE |
Issue Fee Payment (PTO-85B) | 1 | View | |
| 2004-03-29 | LET. |
Miscellaneous Incoming Letter | 2 | View | |
| 2004-03-17 | IDS |
Information Disclosure Statement (IDS) Form (SB08) | 3 | View | |
| 2004-03-17 | FOR |
Foreign Reference | 6 | View | |
| 2004-03-17 | FOR |
Foreign Reference | 8 | View | |
| 2004-03-17 | FOR |
Foreign Reference | 17 | View | |
| 2004-03-17 | FOR |
Foreign Reference | 9 | View | |
| 2004-03-17 | FOR |
Foreign Reference | 7 | View | |
| 2004-03-17 | FOR |
Foreign Reference | 18 | View | |
| 2004-03-17 | FOR |
Foreign Reference | 20 | View | |
| 2004-01-27 | NOA |
Notice of Allowance and Fees Due (PTOL-85) | 3 | View | |
| 2004-01-27 | NOA |
Notice of Allowance and Fees Due (PTOL-85) | 4 | View | |
| 2004-01-27 | 1449 |
List of References cited by applicant and considered by examiner | 1 | View | |
| 2004-01-27 | 892 |
List of references cited by examiner | 1 | View | |
| 2004-01-27 | IIFW |
Issue Information including classification, examiner, name, claim, renumbering, etc. | 1 | View | |
| 2004-01-27 | SRFW |
Search information including classification, databases and other search related notes | 1 | View | |
| 2004-01-22 | IRFND |
Processed Request for Refund | 1 | View | |
| 2004-01-12 | SRNT |
Examiner's search strategy and results | 3 | View | |
| 2003-07-16 | LET. |
Miscellaneous Incoming Letter | 4 | View | |
| 2003-07-07 | CFILE |
Request for Corrected Filing Receipt | 2 | View | |
| 2003-07-07 | ADS |
Application Data Sheet | 1 | View | |
| 2003-05-16 | DRW |
Drawings-only black and white line drawings | 11 | View | |
| 2003-05-16 | TRNA |
Transmittal of New Application | 2 | View | |
| 2003-05-16 | TRNA |
Transmittal of New Application | 3 | View | |
| 2003-05-16 | ADS |
Application Data Sheet | 2 | View | |
| 2003-05-16 | ADS |
Application Data Sheet | 2 | View | |
| 2003-05-16 | SPEC |
Specification | 25 | View | |
| 2003-05-16 | CLM |
Claims | 3 | View | |
| 2003-05-16 | SPEC |
Specification | 25 | View | |
| 2003-05-16 | ABST |
Abstract | 1 | View | |
| 2003-05-16 | CLM |
Claims | 3 | View | |
| 2003-05-16 | DRW |
Drawings-only black and white line drawings | 11 | View | |
| 2003-05-16 | ABST |
Abstract | 1 | View | |
| 2003-05-16 | OATH |
Oath or Declaration filed | 3 | View | |
| 2003-05-16 | OATH |
Oath or Declaration filed | 3 | View | |
| 2003-05-16 | IDS |
Information Disclosure Statement (IDS) Form (SB08) | 2 | View | |
| 2003-05-16 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2003-05-16 | IRFND |
Processed Request for Refund | 5 | View |
Inventors
Masaki Utsumi
Osaka, JAPAN
Masashi Funakoshi
Osaka, JAPAN
Tsuyoshi Hamatani
Shiga, JAPAN
Takeshi Morikawa
Shiga, JAPAN
Yukio Nakabayashi
Osaka, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/112
H10W74/00
H10W74/014
H10W74/019
H10W72/552
H10W72/951
H10W72/075
H10W70/424
H10W90/756
H10W72/0198
H10W74/111
H10W74/016
Prosecution
- Examiner
- THAI, DAVIS
- Art Unit
- 2827
- Customer No.
- 22204
- Docket No.
- 740819-999
- Confirmation No.
- 6471
Foreign Priority
2001-038220
·
2001-02-15
·
JAPAN
Publication
- Pub. No.
- US20030203541A1
- Pub. Date
- 2003-10-30
Patent Term Adjustment
-120days
TESSERA, INC.,
INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.),
FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS),
INVENSAS CORPORATION,
TESSERA ADVANCED TECHNOLOGIES, INC,
DTS, INC.,
DTS LLC,
PHORUS, INC.,
IBIQUITY DIGITAL CORPORATION
from
ROYAL BANK OF CANADA
RELEASE OF SECURITY INTEREST
Recorded 2020-06-11
from
DTS, INC.,
IBIQUITY DIGITAL CORPORATION,
INVENSAS BONDING TECHNOLOGIES, INC.,
INVENSAS CORPORATION,
PHORUS, INC.,
ROVI GUIDES, INC.,
ROVI SOLUTIONS CORPORATION,
ROVI TECHNOLOGIES CORPORATION,
TESSERA ADVANCED TECHNOLOGIES, INC.,
TESSERA, INC.,
TIVO SOLUTIONS INC.,
VEVEO, INC.
SECURITY INTEREST
Recorded 2020-06-01
from
DIGITALOPTICS CORPORATION,
DIGITALOPTICS CORPORATION MEMS,
DTS, INC.,
DTS, LLC,
IBIQUITY DIGITAL CORPORATION,
INVENSAS CORPORATION,
PHORUS, INC.,
TESSERA ADVANCED TECHNOLOGIES, INC.,
TESSERA, INC.,
ZIPTRONIX, INC.
SECURITY INTEREST
Recorded 2016-12-02
from
PANNOVA SEMIC, LLC
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2016-01-25
CHANGE OF NAME
Recorded 2014-09-19
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Quick Facts
- Patent No.
- US 6,835,600
- App. No.
- 10/438,847
- Filed
- 2003-05-16
- Granted
- 2004-12-28
- Pub. No.
- US20030203541A1
- Examiner
- THAI, DAVIS
- Art Unit
- 2827
- PTA
- -120 days
External Links