IP Library Granted Patent US 7,090,001
Granted Patent B2
US 7,090,001 · App. 10/440,363 · Granted Aug 15, 2006

Optimized multiple heat pipe blocks for electronics cooling

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Quick Facts
Patent No.
US 7,090,001
App. No.
10/440,363
Granted
Aug 15, 2006
Kind
B2
Abstract

A plate is thermally coupled to a heat generating device and thermally coupled to two heat pipes. Each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria. One or more additional heat pipes can be coupled to the plate. A heat spreader can be in thermal contact with the heat generating device and with at least one of the heat pipes. The heat pipes can differ in outer cross-sectional dimensions depending on thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.

Claims (41)

1. An apparatus for removing heat from a heat generating device comprising a plate thermally coupled to the heat generating device and thermally coupled to two heat pipes wherein the thermal distances relative to the heat generating device are not the same and wherein each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria and thermal distance position relative to the heat generating device whereby the boiling point temperatures are not the same, to achieve substantially simultaneous onset of boiling within the two heat pipes in response to heat energy from the heat generating device.

2. The apparatus of claim 1 , further including one or more additional heat pipes coupled to the plate.

3. The apparatus of claim 1 , further including a heat spreader, wherein the heat spreader is in thermal contact with the heat generating device and with at least one of the heat pipes.

4. The apparatus of claim 1 , wherein the heat pipes differing in boiling point temperature by at least 1 degree Celsius.

5. The apparatus of claim 1 , wherein the heat pipes differing in outer cross-sectional dimensions depending on the thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.

6. The apparatus of claim 3 , wherein the heat spreader is made of copper.

7. An apparatus for removing heat from a heat generating device by optimizing boiling points of heat pipes in an enclosure, the enclosure being coupled to a heat spreader, the apparatus comprising:

a first heat pipe positioned at a first thermal distance from the heat generating device; and

a second heat pipe positioned at a second thermal distance from the heat generating device, wherein the first heat pipe has a first boiling point corresponding to the first thermal distance and the second heat pipe has a second boiling point different from the first boiling point and corresponding to the second thermal distance to achieve substantially simultaneous onset of boiling of the heat pipes, wherein the first thermal distance and the second thermal distance are not the same.

8. The apparatus of claim 7 , further including one or more additional heat pipes, each additional heat pipe located a thermal distance from the heat generating device.

9. The apparatus of claim 7 , wherein the heat spreader is in thermal contact with the heat generating device and with at least one of the heat pipes.

10. The apparatus of claim 7 , wherein the heat pipes differing in boiling point temperature by at least 1 degree Celsius.

11. The apparatus of claim 7 , wherein the heat pipes differing in outer cross-sectional dimensions depending on thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.

12. The apparatus of claim 7 , wherein the second heat pipe is separated by a predetermined distance from the first heat pipe.

13. The apparatus of claim 7 , wherein the boiling points of heat pipes are predetermined.

14. The apparatus of claim 7 , wherein the heat spreader is made of copper.

15. An apparatus for removing heat from a heat generating device by optimizing boiling points of heat pipes in an enclosure, comprising:

a first heat pipe positioned at a first thermal distance from a heat generating device;

a second heat pipe positioned at a second thermal distance from the heat generating device; and

means for achieving substantially simultaneous onset of boiling of the heat pipes according to thermal distance positions relative to the heat generating device.

16. The apparatus of claim 15 , further including one or more additional heat pipes.

17. The apparatus of claim 15 , further including a heat spreader, wherein the heat spreader is in thermal contact with the heat generating device and with at least one of the heat pipes.

18. The apparatus of claim 15 , wherein the heat pipes differing in boiling point temperature by at least 1 degree Celsius.

19. The apparatus of claim 15 , wherein the heat pipes differing in outer cross-sectional dimensions depending on the thermal distance positions relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.

20. The apparatus of claim 15 , wherein the second heat pipe is separated by a predetermined distance from the first heat pipe.

21. The apparatus of claim 15 , wherein the boiling points of heat pipes are predetermined.

22. The apparatus of claim 17 , wherein the heat spreader is made of copper.

23. A method of removing heat from a heat generating device by optimizing boiling points of heat pipes in an enclosure, the method comprising the steps of:

positioning a first heat pipe having a first boiling point at a first thermal distance from the heat generating device; and

positioning a second heat pipe having a second boiling point different from the first boiling point at a second thermal distance from the heat generating device, wherein the first thermal distance and the second thermal distance are not the same for achieving substantially simultaneous onset of boiling of the heat pipes according to thermal distance positions relative to the heat generating device.

24. The method of claim 23 , further including one or more additional heat pipes.

25. The method of claim 23 , further including a heat spreader, wherein the heat spreader is in thermal contact with the heat generating device and with at least one of the heat pipes.

26. The method of claim 23 , wherein the heat pipes differing in boiling point temperature by at least 1 degree Celsius.

27. The method of claim 23 , wherein the heat pipes differing in outer cross-sectional dimensions depending on the thermal distance positions relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.

28. The method of claim 23 , wherein the second heat pipe is separated by a predetermined distance from the first heat pipe.

29. The method of claim 23 , wherein the boiling points of heat pipes are predetermined.

30. The method of claim 23 , wherein the heat spreader is made of copper.

31. An apparatus for removing heat from a heat generating device by optimizing boiling points of heat pipes in an enclosure, comprising:

a plurality of heat pipes each having a predetermined thermal distance from the heat generating device wherein the thermal distances of the heat pipes from the heat generating device are not all the same and wherein a boiling point for each of the plurality of heat pipes is selected in accordance with the thermal distance whereby the boiling points are not all the same to achieve substantially simultaneous onset of boiling within the plurality of heat pipes in response to heat energy from the heat generating device.

32. An apparatus for removing heat from a heat generating device by optimizing boiling points of heat pipes in an enclosure, comprising:

a plurality of heat pipes each having a predetermined thermal distance from the heat generating device wherein the thermal distances of the heat pipes from the heat generating device are not all the same and wherein a boiling point for each of the plurality of heat pipes is selected in accordance with the thermal distance whereby the boiling points are not all the same, such that each of the plurality of heat pipes begins to boils at substantially the same time in response to heat generated by the heat generating device.

Assignments (10)
SECURITY INTEREST Recorded Oct 26, 2021
From: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.
To: UMB BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 057923/0782 →
SECURITY AGREEMENT Recorded Mar 3, 2020
From: ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.; VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.
To: CITIBANK, N.A.
Reel/Frame 052076/0874 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: JPMORGAN CHASE BANK, N.A.
To: VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT CORPORATION); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT HUNTSVILLE, LLC); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT REDMOND CORP.); VERTIV CORPORATION (F/K/A EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.); VERTIV CORPORATION (F/K/A LIEBERT CORPORATION); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT FREMONT, LLC)
Reel/Frame 052065/0757 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY N.A.
To: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.
Reel/Frame 052071/0913 →
SECOND LIEN SECURITY AGREEMENT Recorded Jun 10, 2019
From: VERTIV IT SYSTEMS, INC.; VERTIV CORPORATION; VERTIV NORTH AMERICA, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; VERTIV ENERGY SYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049415/0262 →
CHANGE OF NAME Recorded Dec 7, 2018
From: LIEBERT CORPORATION
To: VERTIV CORPORATION
Reel/Frame 047749/0820 →
ABL SECURITY AGREEMENT Recorded Mar 6, 2017
From: ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC; AVOCENT REDMOND CORP.; EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.; LIEBERT CORPORATION; LIEBERT NORTH AMERICA, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 041941/0363 →
SECURITY AGREEMENT Recorded Mar 2, 2017
From: ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC; AVOCENT REDMOND CORP.; EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.; LIEBERT CORPORATION; LIEBERT NORTH AMERICA, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 041944/0892 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2016
From: COOLIGY, INC.
To: LIEBERT CORPORATION
Reel/Frame 040593/0364 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2003
From: VAN DE HEIDE, DOLF
To: COOLIGY, INC.
Reel/Frame 014406/0773 →