Patent Assignment
Reel/Frame 047749/0820
Change of Name
Recorded: 2018-12-07
Pages: 7
Assignor
LIEBERT CORPORATION
Executed: 2018-08-30
Assignee
VERTIV CORPORATION
1050 DEARBORN DRIVE, COLUMBUS, OHIO, 43085
Covered Properties
(38)
Micro-Fabricated Electrokinetic Pump
Vapor Escape Microchannel Heat Exchanger
Method and Apparatus for Flexible Fluid Delivery for Cooling Desired Hot Spots in a Heat Producing Device
Interwoven Manifolds for Pressure Drop Reduction in Microchannel Heat Exchangers
Optimized Multiple Heat Pipe Blocks for Electronics Cooling
Multi-Level Microchannel Heat Exchangers
Remedies to Prevent Cracking in a Liquid System
Apparatus and Method of Forming Channels in a Heat-Exchanging Device
Micro-Fabricated Electrokinetic Pump with on-Frit Electrode
Decoupled Spring-Loaded Mounting Apparatus and Method of Manufacturing Thereof
Method and Apparatus for Efficient Vertical Fluid Delivery for Cooling a Heat Producing Device
Optimal Spreader System, Device and Method for Fluid Cooled Micro-Scaled Heat Exchange
Method and Apparatus for Achieving Temperature Uniformity and Hot Spot Cooling in a Heat Producing Device
Channeled Flat Plate Fin Heat Exchange System, Device and Method
Hermetic Closed Loop Fluid System
Apparatus for Conditioning Power and Managing Thermal Energy in an Electronic Device
Apparatus for conditioning power and managing thermal energy in an electronic device
Semi-Compliant Joining Mechanism for Semiconductor Cooling Applications
Micro-Fabricated Electrokinetic Pump
Method and Apparatus for Controlling Freezing Nucleation and Propagation
Apparatus and Method of Efficient Fluid Delivery for Cooling a Heat Producing Device
Remedies to Prevent Cracking in a Liquid System
Remedies to Prevent Cracking in a Liquid System
Remedies to Prevent Cracking in a Liquid System
Remedies to Prevent Cracking in a Liquid System
Method of Fabricating High Surface to Volume Ratio Structures and Their Integration in Microheat Exchangers for Liquid Cooling System
Pump and Fan Control Concepts in a Cooling System
Cooling systems incorporating heat exchangers and thermoelectric layers
Tape-Wrapped Multilayer Tubing and Methods for Making the Same
Liquid Cooling Loops for Server Applications
Integrated Liquid to Air Conduction Module
Methodology of Cooling Multiple Heat Sources in a Personal Computer Through the Use of Multiple Fluid-Based Heat Exchanging Loops Coupled via Modular Bus-Type Heat Exchangers
Gimballed Attachment for Multiple Heat Exchangers
Deformable Duct Guides That Accommodate Electronic Connection Lines
Internal Access Mechanism for a Server Rack
Device and Methodology for the Removal of Heat from an Equipment Rack by Means of Heat Exchangers Mounted to a Door
Microheat Exchanger for Laser Diode Cooling
Bonded Metal and Ceramic Plates for Thermal Management of Optical and Electronic Devices
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 7, 2016
From: COOLIGY, INC.
To: LIEBERT CORPORATION
Reel/Frame 040593/0364 →
Security Agreement
Mar 2, 2017
From: ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 041944/0892 →
Abl Security Agreement
Mar 6, 2017
From: ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 041941/0363 →
Second Lien Security Agreement
Jun 10, 2019
From: VERTIV IT SYSTEMS, INC.; VERTIV CORPORATION; VERTIV NORTH AMERICA, INC.; ELECTRICAL RELIABILITY SERVICES, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049415/0262 →
Release of Security Interest
Mar 2, 2020
From: JPMORGAN CHASE BANK, N.A.
To: VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT CORPORATION); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT HUNTSVILLE, LLC); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT REDMOND CORP.); VERTIV CORPORATION (F/K/A EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.)
Reel/Frame 052065/0757 →
Release of Security Interest
Mar 2, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY N.A.
To: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.
Reel/Frame 052071/0913 →
Security Agreement
Mar 3, 2020
From: ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.; VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.
To: CITIBANK, N.A.
Reel/Frame 052076/0874 →
Security Interest
Oct 26, 2021
From: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.
To: UMB BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 057923/0782 →