Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
View Patent ↗A device, method, and system for a fluid cooled micro-scaled heat exchanger is disclosed. The fluid cooled micro-scaled heat exchanger utilizes a micro-scaled region and a spreader region with a highly thermally conductive material and sized to yield high heat dissipation and transfer area per unit volume from a heat source. The micro-scaled region preferably comprises microchannels.
1. A device for fluid cooled micro-scaled heat exchange, the device comprising:
a plurality of substantially parallel micro-scaled regions having a fluid inlet side and a fluid outlet side configured to permit flow of fluid therethrough;
a plurality of inlet channels, interleaved between the micro-scaled regions and coupled to the fluid inlet side of each micro-scaled region, wherein a direction of fluid flow at the inlet side in adjacent micro-scaled regions is in substantially opposite directions;
a plurality of outlet channels, interleaved between the micro-scaled regions and coupled to the fluid outlet side of each micro-scaled region, wherein the direction of fluid flow at the outlet side in adjacent micro-scaled regions is in substantially opposite directions; and
a spreader region, wherein the spreader region comprises a first side and a second side, wherein the first side is positioned on and coupled to a heat source, and wherein the second side is coupled to the plurality of micro-scaled regions.
2. The device in claim 1 , wherein the spreader region comprises a thickness dimension within the range of and including 0.3 millimeter to 1.0 millimeters.
3. The device in claim 1 , wherein the spreader region and the micro-scaled regions are both wider than the heat source defining an overhang of the heat source, and wherein the plurality of micro-scaled regions overlay the heat source.
4. The device in claim 3 , wherein the overhang of the micro-scaled regions is in the range of and including 0.0 millimeters to 15.0 millimeters.
5. The device in claim 1 , wherein the micro-scaled regions comprise microchannels, wherein the microchannels comprise walls.
6. The device in claim 5 , wherein at least one of the microchannel walls has a width dimension within a range of and, including 10 microns to 100 microns.
7. The device in claim 5 , wherein at least one of the microchannel walls has a height dimension within a range of and including 50 microns and 2.0 millimeters.
8. The device in claim 5 , wherein at least two of the microchannel walls are separated from each other by a spacing dimension within a range of and including 10 microns to 150 microns.
9. The device in claim 1 , wherein the micro-scaled regions comprise a micro-porous structure.
10. The device in claim 9 , wherein the micro-porous structure comprises a porous material with a porosity within a range of and including 50 to 80 percent.
11. The device in claim 9 , wherein the micro-porous structure has an average pore size within a range of and including 10 microns to 200 microns.
12. The device in claim 9 , wherein the micro-porous structure comprises a height within a range of and including 0.25 millimeter to 2.0 millimeters.
13. The device in claim 1 , wherein the micro-scaled regions comprise micro-pillars.
14. The device in claim 13 , wherein the micro-pillars comprise a plurality of pins, wherein at least one of the plurality of pins has a Cross sectional area within a range of and including 10 (micron) 2 and 100 (micron) 2 .
15. The device in claim 14 , wherein at least one of the plurality of pins has a height dimension within a range of and including 50 microns and2.0 millimeters.
16. The device in claim 14 , wherein at least two of the plurality of pins are separated from each other by a spacing dimension within a range of and including 10 microns to 150 microns.
17. The device in claim 1 , wherein the micro-scaled regions comprise any one of microchannels, a micro-porous structure, and micro-pillars.
18. The device in claim 1 , wherein the micro-scaled regions comprise silicon.
19. The device in claim 1 , wherein the micro-scaled regions comprise a material with thermal conductivity larger than 25 W/m-K.
20. The device in claim 1 , wherein the micro-scaled regions comprise a high aspect ratio micro-machined material.
21. The device in claim 1 , wherein the micro-scaled regions comprise semiconducting material.
22. The device in claim 1 , wherein the micro-scaled regions comprise precision machined metals.
23. The device in claim 1 , wherein the micro-scaled regions comprise precision machined alloys.
24. The device in claim 1 , wherein the spreader region comprises a material with a thermal conductivity value larger than 120 W/m-K.
25. The device in claim 1 , wherein the spreader region is interposed between the micro-scaled regions and the heat source.
26. The device in claim 1 , wherein the spreader region comprises copper.
27. The device in Claim 1 , wherein the spreader region comprises diamond.
28. The device in claim 1 , wherein the spreader region comprises silicon carbide.
29. The device in claim 1 , wherein the heat source is a microprocessor.
30. The device in claim 1 , further comprising a plurality of manifolding layers coupled to the spreader region.
31. The device in claim 30 , wherein the plurality of manifolding layers comprise interwoven manifolds.
32. The device in claim 31 , wherein the plurality of manifolding layers further comprise a plurality of individualized holes for channeling fluid into and out of the device.
33. The device in claim 1 , further comprising a plurality of manifolding layers coupled to the micro-scaled regions.
34. The device in claim 33 , wherein the plurality of manifolding layers comprise interwoven manifolds.
35. The device in claim 33 , wherein the plurality of manifolding layers further comprise a plurality of individualized holes for channeling fluid into and out of the device.
36. The device in claim 1 , further comprising a plurality of fluid paths coupled to the micro-scaled regions, wherein the plurality of fluid paths are configured to receive fluid and permit the flow of fluid therethrough.
37. The device in claim 1 , wherein the heat source, the spreader region, and the micro-scaled regions are in a monolithic configuration.
38. The device in claim 1 , wherein the micro-scaled regions and the spreader region are coupled by an anodic bonding method.
39. The device in claim 1 , wherein the micro-scaled regions and the spreader region are coupled by a fusion bonding method.
40. The device in claim 1 , wherein the micro-scaled regions and the spreader region are coupled by a eutectic bonding method.
41. The device in claim 1 , wherein the micro-scaled regions and the spreader region are coupled by an adhesive bonding method.
42. The device in claim 1 , wherein the micro-scaled regions and the spreader region are coupled by a brazing method.
43. The device in claim 1 , wherein the micro-scaled regions and the spreader region are coupled by a welding method.
44. The device in claim 1 , wherein the micro-scaled regions and the spreader region are coupled by a soldering method.
45. The device in claim 1 , wherein the micro-scaled regions and the spreader region are coupled by an epoxy method.
46. The device in claim 1 , wherein the fluid comprises water.
47. The device in claim 1 , wherein the fluid comprises any one of water, ethylene glycol, isopropyl alcohol, ethanol, methanol, and hydrogen peroxide.
48. A device for fluid cooled micro-scaled heat exchange comprising:
a plurality of substantially parallel micro-scaled regions having a fluid inlet side and a fluid outlet side configured to permit flow of fluid therethrough, wherein each of the micro-scaled regions has a first width, and a thickness;
a plurality of inlet channels, interleaved between the micro-scaled regions and coupled to the fluid inlet side of each micro-scaled region, wherein a direction of fluid flow at the inlet side in adjacent micro-scaled regions is in substantially opposite directions;
a plurality of outlet channels, interleaved between the micro-scaled regions and coupled to the fluid outlet side of each micro-scaled region, wherein the direction of fluid flow at the outlet side in adjacent micro-scaled regions is in substantially opposite directions; and
a spreader region with a second width and a thickness, wherein the spreader region comprises a first side coupled to a heat source having a heat source width and a second side coupled to the plurality of micro-scaled regions.
49. The device in claim 48 , wherein the heat source, the spreader region, and the micro-scaled regions are in a monolithic configuration.
50. The device in claim 48 , wherein the spreader region and the micro-scaled regions are both wider than the heat source defining an overhang of the heat source, and wherein the plurality of micro-scaled regions overlay the heat source.
51. The device in claim 50 , wherein the overhang of the micro-scaled regions is in a range of and including 0.0 millimeters to 15.0 millimeters.
52. The device in claim 48 , wherein the micro-scaled regions comprise microchannels, wherein the microchannels comprise walls.
53. The device in claim 52 , wherein at least one of the microchannel walls has a width dimension within a range of and including 10 microns to 100 microns.
54. The device in claim 52 , wherein at least one of the microchannel walls has a height dimension within a range of and including 50 microns and 2.0 millimeters.
55. The device in claim 52 , wherein at least two of the microchannel walls are separated from each other by a spacing dimension within a range of and including 10 microns to 150 microns.
56. The device in claim 48 , wherein the micro-scaled regions comprise a micro-porous structure.
57. The device in claim 56 , wherein the micro-porous structure comprises a porous material with a porosity within a range of and including 50 to 80 percent.
58. The device in claim 56 , wherein the micro-porous structure has an average pore size within a range of and including 10 microns to 200 microns.
59. The device in claim 56 , wherein the micro-porous structure comprises a height within a range of and including 0.25 millimeter to 2.0 millimeters.
60. The device in claim 48 , wherein the micro-scaled regions comprise micro-pillars.
61. The device in claim 60 , wherein the micro-pillars comprise a plurality of pins, wherein at least one of the plurality of pins has a cross sectional area within a range of and including 10 (micron) 2 and 100 (micron) 2 .
62. The device in claim 61 , wherein at least one of the plurality of pins has a height dimension within a range of and including 50 microns and 2.0 millimeters.
63. The device in claim 61 , wherein at least two of the plurality of pins are separated from each other by a spacing dimension within a range of and including 10 microns to 150 microns.
64. The device in claim 48 , wherein the micro-scaled regions comprise any one of microchannels, a micro-porous structure, and micro-pillars.
65. The device in claim 48 , wherein the heat source is a microprocessor.
66. The device in claim 48 , wherein the micro-scaled regions width is greater than the heat source width.
67. The device in claim 48 , wherein the first width is greater than the heat source width and the first width is substantially centered over the heat source width.
68. The device in claim 67 , wherein the difference between the first width and the heat source width is in a range of 0.0 millimeter to 15 millimeters.
69. The device in claim 67 , wherein the difference between the first width and the heat source width is in a range of 0.0 millimeter to 5.0 millimeters on each side of the heat source when the fluid is single phase.
70. The device in claim 67 , wherein the difference between the first width and the heat source width is in a range of 5.0 millimeter -15 millimeters on each side of the heat source when the fluid is two phase.
71. The device in claim 48 , wherein the first side further comprises a higher thermal conductivity region coupled to the heat source.
72. The device in claim 48 , wherein the spreader region is interposed between the heat source and the micro-scaled regions.
73. The device in claim 48 , wherein the spreader region comprises copper.
74. The device in claim 48 , wherein the spreader region comprises diamond.
75. The device in claim 48 , wherein the spreader region comprises silicon carbide.
76. A system for fluid cooled micro-scaled heat exchange comprising:
means for spreading heat having a width and forming a spreader region, wherein the means for spreading heat is coupled to a heat source;
means for supplying fluids; and
means for micro-scaled fluid flow through a plurality of substantially parallel micro-scaled regions configured to receive fluid from the means for supplying fluid, wherein the means for micro-scaled fluid flow produces a fluid flow that is in substantially opposing directions for adjacent micro-scaled regions, and wherein the means for micro-scaled fluid flow is coupled to the means for spreading heat.
77. The device in claim 76 , wherein the spreader region and the micro-scaled regions are both wider than the heat source defining an overhang of the heat source.
78. The device in claim 77 , wherein the overhang of the micro-scaled regions is in a range of and including 0.0 millimeters to 15.0 millimeters.
79. The device in claim 76 , wherein the micro-scaled regions comprise microchannels, wherein the microchannels comprise walls.
80. The device in claim 79 , wherein at least one of the microchannel walls has a width dimension within a range of and including 10 microns to 100 microns.
81. The device in claim 79 , wherein at least one of the microchannel walls has a height dimension within a range of and including 50 microns and 2.0 millimeters.
82. The device in claim 79 , wherein at least two of the microchannel walls are separated from each other by a spacing dimension within a range of and including 10 microns to 150 microns.
83. The device in claim 76 , wherein the micro-scaled regions comprise a micro-porous structure.
84. The device in claim 83 , wherein the micro-porous structure comprises a porous material with a porosity within a range of and including 50 to 80 percent.
85. The device in claim 83 , wherein the micro-porous structure has an average pore size within a range of and including 10 microns to 200 microns.
86. The device in claim 83 , wherein the micro-porous structure comprises a height within a range of and including 0.25 millimeter to 2.0 millimeters.
87. The device in claim 76 , wherein the micro-scaled regions comprise micro-pillars.
88. The device in claim 87 , wherein the micro-pillars comprise a plurality of pins, wherein at least one of the plurality of pins has a cross sectional area within a range of and including 10 (micron) 2 and 100 (micron) 2 .
89. The device in claim 88 , wherein at least one of the plurality of pins has a height dimension within a range of and including 50 microns and 2.0 millimeters.
90. The device in claim 88 , wherein at least two of the plurality of pins are separated from each other by a spacing dimension within a range of and including 10 microns to 150 microns.
91. The device in claim 76 , wherein the micro-scaled regions comprise any one of microchannels, a micro-porous structure, and micro-pillars.