Semi-compliant joining mechanism for semiconductor cooling applications
View Patent ↗A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
1. A joining system comprising:
a. an integrated circuit mounted on a circuit board;
b. a heat exchanger coupled to the integrated circuit; and
c. a gimbal plate including a gimbal joint and a plurality of spring means, wherein the gimbal joint couples the gimbal plate to the heat exchanger and the gimbal joint is configured to be rotationally-compliant such that an application vector of a retaining force applied by the plurality of spring means is adaptively directed to a thermal interface surface of the integrated circuit, and the plurality of spring means couples the gimbal plate to the circuit board thereby coupling the heat exchanger to the integrated circuit.
2. The joining system of claim 1 further comprising a flexible fluid line coupled to the heat exchanger.
3. The joining system of claim 2 further comprising a mounting plate to couple a heat rejector to the gimbal plate.
4. The joining system of claim 3 further comprising the heat rejector and a pump each coupled to the mounting plate and the flexible fluid line, thereby coupling the heat exchanger, the heat rejector, and the pump as an integrated cooling apparatus.
5. The joining system of claim 4 wherein the gimbal plate substantially de-couples the mass of the heat rejector and the pump from the heat exchanger.
6. The joining system of claim 3 further comprising the heat rejector and a pump each remotely coupled to the heat exchanger via the flexible fluid line.
7. The joining system of claim 1 wherein the gimbal joint comprises a single-point contact element directed outward from the gimbal plate.
8. The joining system of claim 7 wherein the single-point contact element comprises a ball adhered to the gimbal plate, and the heat exchanger includes a receiving depression to mate to the ball.
9. The joining system of claim 7 wherein the single-point contact element comprises a ball molded onto the gimbal plate, and the heat exchanger includes a receiving depression to mate to the ball.
10. The joining system of claim 1 wherein the heat exchanger includes a ball adhered to a top surface of the heat exchanger, and the gimbal joint comprises a receiving depression to mate to the ball.
11. The joining system of claim 1 wherein the heat exchanger includes a ball molded onto a top surface of the heat exchanger, and the gimbal joint comprises a receiving depression to mate to the ball.
12. The joining system of claim 1 wherein the heat exchanger is configured to move independently from the gimbal plate.
13. The joining system of claim 1 wherein the heat exchanger is coupled to the integrated circuit via a thermal interface.
14. The joining system of claim 13 wherein the spring means is configured to enable the retaining force to be applied through the gimbal joint to the heat exchanger, thereby forcing the heat exchanger toward the integrated circuit to form the thermal interface.
15. The joining system of claim 14 wherein a center of rotation of the gimbal joint is collinear with a face-centered normal vector of the integrated circuit.
16. The joining system of claim 15 wherein the gimbal joint, upon application of the retaining force a first mating surface of the heat exchanger is substantially parallel with a second mating surface of the integrated circuit.
17. The joining system of claim 14 wherein the spring means is configured to regulate the retaining force applied to the integrated circuit by the heat exchanger.
18. The joining system of claim 1 wherein the spring means includes three or more sets of screws and springs.
19. The joining system of claim 1 wherein the spring means includes three or more spring plates.
20. A joining system comprising:
a. a heat generating device mounted to a mounting apparatus;
b. a heat exchanger coupled to the heat generating device; and
c. a gimbal plate including a gimbal joint and a plurality of spring means, wherein the gimbal joint couples the gimbal plate to the heat exchanger and the gimbal joint is configured to be rotationally-compliant such that an application vector of a retaining force applied by the plurality of spring means is adaptively directed to a thermal interface surface of the heat generating device, and the plurality of spring means couples the gimbal plate to the mounting apparatus thereby coupling the heat exchanger to the heat generating device.
21. The joining system of claim 20 further comprising a flexible fluid line coupled to the heat exchanger.
22. The joining system of claim 21 further comprising a mounting plate coupled to the gimbal plate.
23. The joining system of claim 22 further comprising a heat rejector and a fluid pump each coupled to the mounting plate and the flexible fluid line, thereby coupling the heat exchanger, the heat rejector, and the pump as an integrated cooling apparatus.
24. The joining system of claim 21 further comprising a heat rejector and a pump each remotely coupled to the heat exchanger via the flexible fluid line.
25. The joining system of claim 20 wherein the spring means is configured to enable the retaining force to be applied through the gimbal joint to the heat exchanger, thereby forcing the heat exchanger toward the heat generating device to form a thermal interface.
26. The joining system of claim 25 wherein the application vector is adaptively directed such that upon application of the retaining force a first mating surface of the heat exchanger is substantially parallel with a second mating surface of the heat generating device.
27. A joining apparatus comprising:
a. a plurality of spring means; and
b. a gimbal plate coupled to the plurality of spring means, the gimbal plate including a gimbal joint to provide a single-point contact element, wherein the gimbal joint is coupled to a first device and the plurality of spring means are coupled to a second device thereby maintaining an interface between the first device and the second device, further wherein the gimbal joint is configured to be rotationally-compliant such that an application vector of a retaining force applied by the plurality of spring means is adaptively directed to the first device.
28. The joining apparatus of claim 27 wherein the gimbal plate further comprises a first surface including a recessed area.
29. The joining apparatus of claim 28 wherein the gimbal joint is configured within the recessed area.
30. The joining apparatus of claim 29 wherein a shape of the recessed area is configured to allow a second surface of the first device to fit within the recessed area and to inhibit the first device from moving laterally in relation to the gimbal plate.
31. The joining apparatus of claim 27 wherein the spring means is configured to regulate the retaining force applied by the gimbal joint.
32. The joining apparatus of claim 27 wherein the spring means includes three or more sets of screws and springs.
33. The joining apparatus of claim 27 wherein the spring means includes a plurality of spring plates.