Microheat exchanger for laser diode cooling
View Patent ↗A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.
1. A device comprising:
a. a heat exchanging device comprising a thermally conductive material, wherein the heat exchanging device is configured to transfer heat from the thermally conductive material to a fluid flowing therethrough; and
b. a thermally conductive ceramic assembly thermally coupled to the heat exchanging device, wherein the ceramic assembly comprises:
i. a conductive layer;
ii. a ceramic layer; and
iii. an active brazing alloy bonded between the conductive layer and the ceramic layer to form a joining layer, wherein the conductive layer and the joining layer are configured to form one or more electrically isolated conductive pads.
2. The device of claim 1 wherein the conductive layer and the joining layer are patterned to form a plurality of electrically isolated pads, further wherein each of the plurality of electrically isolated pads are electrically isolated from each other by the ceramic layer.
3. The device of claim 1 wherein the ceramic assembly further comprises a second conducive layer and a second active brazing alloy layer bonded between the second conductive layer and the ceramic layer to form a second joining layer.
4. The device of claim 3 further comprising a metal-to-metal joining layer bonded between the second conductive layer of the ceramic assembly and the heat exchanging device.
5. The device of claim 1 wherein the conductive layer and the heat exchanging device are copper-based.
6. The device of claim 1 wherein the ceramic layer comprises beryllium oxide, aluminum oxide, or aluminum nitride.
7. The device of claim 1 wherein the active brazing alloy comprises a copper-based active brazing alloy, a copper-silver-based active brazing alloy, or an indium-copper-silver-based active brazing alloy.
8. The device of claim 1 wherein the active brazing alloy layer is comprised of an active joining material paste or an active joining material foil.
9. The device of claim 1 further comprising a second thermally conductive ceramic assembly thermally coupled to an opposite side of the heat exchanging device than the ceramic assembly.
10. A device comprising:
a. a heat exchanging device comprising a thermally conductive material, wherein the heat exchanging device is configured to transfer heat from the thermally conductive material to a fluid flowing therethrough; and
b. a thermally conductive ceramic assembly thermally coupled to the heat exchanging device, wherein the ceramic assembly comprises:
i. a conductive layer;
ii. a ceramic layer including a metallized first surface; and
iii. a joining material bonded between the conductive layer and the metallized first surface of the ceramic layer to form a joining layer, wherein the conductive layer, the joining layer, and the metallized first surface are configured to form one or more electrically isolated conductive pads.
11. The device of claim 10 wherein the conductive layer and the joining layer are patterned to form a plurality of electrically isolated pads, further wherein each of the plurality of electrically isolated pads are electrically isolated from each other by the ceramic layer.
12. The device of claim 10 wherein the ceramic layer further comprises a metallized second surface, and the ceramic assembly further comprises a second conducive layer and a second joining material bonded between the second conductive layer and the metallized second surface of the ceramic layer to form a second joining layer.
13. The device of claim 12 further comprising a metal-to-metal joining layer bonded between the second conductive layer of the ceramic assembly and the heat exchanging device.
14. The device of claim 10 wherein the conductive layer and the heat exchanging device are copper-based.
15. The device of claim 10 wherein the ceramic layer comprises beryllium oxide, aluminum oxide, or aluminum nitride.
16. The device of claim 10 wherein the metallized first surface comprises molybdenum manganese and nickel.
17. The device of claim 10 further comprising a second thermally conductive ceramic assembly thermally coupled to an opposite side of the heat exchanging device than the ceramic assembly.
18. The device of claim 10 wherein the joining material comprise a copper-silver paste, a copper-gold paste, a copper-silver foil, or a copper-gold foil.
19. The device of claim 10 wherein the joining material and the conductive layer comprise a silver plated copper sheet.
20. A device comprising:
a. a heat exchanging device comprising a thermally conductive material, wherein the heat exchanging device is configured to transfer heat from the thermally conductive material to a fluid flowing therethrough; and
b. a thermally conductive ceramic assembly thermally coupled to the heat exchanging device, wherein the ceramic assembly comprises:
i. a ceramic layer including a metallized first surface; and
ii. a conductive layer plated to the metallized first surface, wherein the conductive layer and the metallized first surface are configured to form one or more electrically isolated conductive pads.
21. The device of claim 20 wherein the conductive layer and the metallized first surface are patterned to form a plurality of electrically isolated pads, further wherein each of the plurality of electrically isolated pads are electrically isolated from each other by the ceramic layer.
22. The device of claim 20 wherein the ceramic layer further comprises a metallized second surface, and the ceramic assembly further comprises a second conductive layer plated to the metallized second surface.
23. The device of claim 22 further comprising a metal-to-metal joining layer bonded between the second conductive layer of the ceramic assembly and the heat exchanging device.
24. The device of claim 20 wherein the conductive layer and the heat exchanging device are copper-based.
25. The device of claim 20 wherein the ceramic layer comprises beryllium oxide, aluminum oxide, or aluminum nitride.
26. The device of claim 20 wherein the metallized first surface comprises molybdenum manganese and nickel.
27. The device of claim 20 further comprising a second thermally conductive ceramic assembly thermally coupled to an opposite side of the heat exchanging device than the ceramic assembly.