Apparatus and method of efficient fluid delivery for cooling a heat producing device
View Patent ↗A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.
1. A heat exchanger comprising:
a. an interface layer in which heat is transferred from a heat source having a surface to a fluid; and
b. a manifold layer coupled to the interface layer, the manifold layer further comprising:
i. a first set of fluid paths substantially perpendicular to the surface for directing the fluid to the interface layer; and
ii. a second set of fluid paths substantially parallel to the surface and perpendicular to the first set of fluid paths for removing the fluid from the interface layer.
2. The heat exchanger of claim 1 further including an upper layer for circulating the fluid to and from the manifold layer.
3. The heat exchanger of claim 2 wherein the upper layer includes a plurality of protruding features.
4. The heat exchanger of claim 2 wherein the upper layer includes a porous structure.
5. The heat exchanger of claim 2 wherein the upper layer includes a central reservoir in which the fluid is delivered from an inlet port of the heat exchanger.
6. The heat exchanger of claim 1 wherein the fluid is in single phase flow conditions.
7. The heat exchanger of claim 6 wherein at least a portion of the fluid is in two phase flow conditions.
8. The heat exchanger of claim 7 wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the heat exchanger.
9. The heat exchanger of claim 1 wherein each fluid path is positioned to cool at least one interface hot spot region in the heat source.
10. The heat exchanger of claim 1 wherein the interface layer is coupled to the heat source.
11. The heat exchanger of claim 1 wherein the interface layer is integrally formed to the heat source.
12. The heat exchanger of claim 1 wherein the heat source is an integrated circuit.
13. The heat exchanger of claim 1 further including a porous structure disposed along the interface layer.
14. The heat exchanger of claim 1 further including a plurality of microchannels formed to channel fluid flow and promote heat transfer.
15. The heat exchanger of claim 1 further including a plurality of micropins disposed along the interface layer.
16. A heat exchanger comprising:
a. an interface layer in which heat is transferred from a heat source having a surface to a fluid;
b. a manifold layer coupled to the interface layer, the manifold layer further comprising:
i. a first set of fluid paths substantially perpendicular to the surface for directing the fluid to the interface layer; and
ii. a second set of fluid paths substantially parallel to the surface and perpendicular to the first set of fluid paths for removing the fluid from the interface layer; and
c. an upper layer for circulating the fluid to and from the manifold layer.
17. The heat exchanger of claim 16 wherein the upper layer includes a plurality of protruding features.
18. The heat exchanger of claim 16 wherein the upper layer includes a porous structure.
19. The heat exchanger of claim 16 wherein the upper layer includes a central reservoir in which the fluid is delivered from an inlet port of the heat exchanger.
20. The heat exchanger of claim 16 wherein the fluid is in single phase flow conditions.
21. The heat exchanger of claim 20 wherein at least a portion of the fluid is in two phase flow conditions.
22. The heat exchanger of claim 21 wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the heat exchanger.
23. The heat exchanger of claim 16 wherein each fluid path is positioned to cool at least one interface hot spot regions in the heat source.
24. The heat exchanger of claim 16 wherein the interface layer is coupled to the heat source.
25. The heat exchanger of claim 16 wherein the interface layer is integrally formed to the heat source.
26. The heat exchanger of claim 16 wherein the heat source is an integrated circuit.
27. The heat exchanger of claim 16 further including a porous structure disposed along the interface layer.
28. The heat exchanger of claim 16 further including a plurality of microchannels formed to channel fluid flow and promote heat transfer.
29. The heat exchanger of claim 16 further including a plurality of micropins disposed along the interface layer.
30. A manifold layer configured to direct fluid to and from an interface layer within a heat exchanger, the manifold layer comprising:
a. a first set of fluid paths substantially perpendicular to the interface layer for directing the fluid to the interface layer; and
b. a second set of fluid paths substantially parallel to the interface layer and perpendicular to the first set of fluid paths for removing the fluid from the interface layer.
31. The manifold layer of claim 30 wherein the manifold layer is coupled to an upper layer which circulates the fluid to and from the manifold layer, the upper layer including a central reservoir in which the fluid is delivered from an inlet port of the heat exchanger.
32. The manifold layer of claim 30 wherein the interface layer is coupled to a heat source.
33. The manifold layer of claim 30 wherein the fluid is in single phase flow conditions.
34. The manifold layer of claim 33 wherein at least a portion of the fluid is in two phase flow conditions.
35. The manifold layer of claim 34 wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the heat exchanger.
36. The manifold layer of claim 32 wherein each fluid path is positioned to cool at least one interface hot spot region in the heat source.
37. The manifold layer of claim 32 wherein the interface layer is integrally formed to the heat source.
38. The manifold layer of claim 32 wherein the heat source is an integrated circuit.
39. The manifold layer of claim 30 further including a porous structure disposed along the interface layer.
40. The manifold layer of claim 30 further including a plurality of microchannels formed to channel fluid flow and promote heat transfer.
41. A method of cooling a heat source coupled to an interface layer of a heat exchanger, the method comprising the steps of:
a. circulating a fluid into a central reservoir;
b. directing the fluid through a first set of fluid paths substantially perpendicular to the interface layer; and
c. removing the fluid from the interface layer through a second set of fluid paths substantially parallel to the interface layer and perpendicular to the first set of fluid paths.
42. The method of claim 41 further including the step of providing an upper layer to circulate the fluid to and from each fluid path.
43. The method of claim 42 further including the step of coupling a plurality of protruding features to the upper layer.
44. The method of claim 42 further including the step of coupling a porous structure to the upper layer.
45. The method of claim 43 wherein the upper layer includes a central reservoir in which the fluid is delivered from an inlet port of the heat exchanger.
46. The method of claim 41 wherein the fluid is in single phase flow conditions.
47. The method of claim 46 wherein at least a portion of the fluid is in two phase flow conditions.
48. The method of claim 47 wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the heat exchanger.
49. The method of claim 41 wherein each fluid path is positioned to cool at least one interface hot spot region in the heat source.
50. The method of claim 41 wherein the interface layer is integrally formed to the heat source.
51. The method of claim 41 wherein the heat source is an integrated circuit.
52. The method of claim 41 wherein the interface layer includes a porous copper foam disposed along the interface layer.
53. The method of claim 41 wherein the interface layer includes a plurality of microchannels formed to channel fluid flow and promote heat transfer.
54. The method of claim 41 wherein the interface layer includes a plurality of micropins disposed along the interface layer.