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App. No. 10/448,982 · Confirmation No. 1977

Apparatus and method for electrolytically depositing copper on a semiconductor workpiece

Expressly Abandoned -- During Examination View Publication ↗
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 Code Description Pages PDF
2004-06-21 ABN Abandonment 2 View
2004-03-29 EABN Letter Express Abandonment of the application 5 View
2004-03-16 CTNF Non-Final Rejection 8 View
2004-03-16 1449 List of References cited by applicant and considered by examiner 6 View
2004-03-16 892 List of references cited by examiner 1 View
2004-03-16 FOR Foreign Reference 5 View
2004-03-16 SRFW Search information including classification, databases and other search related notes 1 View
2004-03-16 FWCLM Index of Claims 1 View
2003-11-24 EABN Letter Express Abandonment of the application 2 View
2003-09-12 OATH Oath or Declaration filed 6 View
2003-09-11 IDS Information Disclosure Statement (IDS) Form (SB08) 11 View
2003-08-22 C.AD Change of Address 2 View
2003-07-31 PEFN Pre-Exam Formalities Notice 2 View
2003-05-31 TRNA Transmittal of New Application 5 View
2003-05-31 ADS Application Data Sheet 3 View
2003-05-31 A.PE Preliminary Amendment 14 View
2003-05-31 SPEC Specification 21 View
2003-05-31 CLM Claims 10 View
2003-05-31 ABST Abstract 1 View
2003-05-31 DRW Drawings-only black and white line drawings 8 View
2003-05-31 OATH Oath or Declaration filed 4 View
2003-05-31 LET. Miscellaneous Incoming Letter 1 View
2003-05-31 WFEE Fee Worksheet (SB06) 1 View
2003-05-31 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/448,982
Filed
2003-05-31
Pub. No.
US20040040857A1
Art Unit
1745