Apparatus for cleaning the edges of wafers
The invention concerns an apparatus for cleaning the edge of a wafer that may be relatively simply constructed with low cost, and prevent the wafer from being re-contaminated by the edge cleaning, thus resulting in increase of the yield rate of wafers. The apparatus includes a cleaning agent ejection nozzle body provided on a side part of a chuck for ejecting a particulate cleaning agent (CO 2 particles) towards the side and the edge portions of the wafer held and rotated by the chuck, and a nozzle body carriage for moving the nozzle body between rest and cleaning positions.
1. An apparatus for cleaning the edge of a wafer, comprising:
a cleaning agent storage tank for storing a highly pressurized cleaning agent;
a cleaning agent ejection nozzle body connected through a first line with said cleaning agent storage tank and disposed on a side part of a chuck for ejecting a particulate cleaning agent towards the side and the edge portions of said wafer held and rotated by said chuck;
a carrier gas storage tank connected with a second line connected to said first line for storing a carrier gas to carry the particulate cleaning agent to said nozzle body; and
a nozzle body carriage for moving said nozzle body between rest and cleaning positions,
wherein said nozzle body includes a wafer receiver provided on its front side configured to receive an edge portion of said wafer, a first nozzle provided on the wafer receiver substantially on the same plane as the wafer for ejecting said particulate cleaning agent directly on the edge of said wafer, a second nozzle provided in the upper part of said wafer receiver for ejecting said particulate cleaning agent towards the upper surface of said wafer, and a third nozzle provided below said second nozzle for ejecting said particulate cleaning agent towards the lower surface of said wafer, and
wherein a line connector connecting said first and second line comprises a base block for connecting said first and second lines, and an orifice and venturi assembly provided between said base block and the nozzle body.
2. An apparatus for cleaning the edge of a wafer as defined in claim 1 , wherein said ejection nozzle body further comprises a gas sucker for sucking and treating the gas vaporized from the ejected particulate cleaning agent.
3. An apparatus for cleaning the edge of a wafer as defined in claim 1 , wherein said particulate cleaning agent comprises dry ice (CO 2 ) particles.
4. An apparatus for cleaning the edge of a wafer as defined in claim 1 , wherein said nozzles have a diameter of 0.5 to 2 mm.
5. An apparatus for cleaning the edge of a wafer as defined in claim 1 , wherein the number of each kind of said first, second and third nozzles provided in said nozzle body is two or more.
6. An apparatus for cleaning the edge of a wafer as defined in claim 1 , wherein said nozzle body carriage comprises a pneumatic cylinder.
7. An apparatus for cleaning the edge of a wafer as defined in claim 1 , wherein said nozzle body carriage comprises a stepper motor.
8. An apparatus for cleaning the edge of a wafer as defined in claim 1 , wherein said carrier gas consists of N 2 .
9. An apparatus for cleaning the edge of a wafer, comprising:
a cleaning agent storage tank for storing a highly pressurized cleaning agent;
a nozzle body connected through a first line with said cleaning agent storage tank and disposed on a side part of a spin chuck for holding and rotating said wafer so as to eject said cleaning agent converted into particles, said cleaning agent being depressurized during passing said first line;
wherein said nozzle body includes a wafer receiver provided on its front side configured to receive an edge portion of said wafer, a first nozzle provided on the wafer receiver substantially on the same plane as the wafer for ejecting said particulate cleaning agent directly on the edge of said wafer, a second nozzle provided in the upper part of said wafer receiver for ejecting said particulate cleaning agent towards the upper surface of said wafer, and a third nozzle provided below said second nozzle for ejecting said particulate cleaning agent towards the lower surface of said wafer,
a carrier gas storage tank connected with a second line connected to said first line for storing a carrier gas to carry the particulate cleaning agent to said nozzle body;
a nozzle body carriage for moving said nozzle body between rest and cleaning positions; and
a gas sucker for sucking and treating the gas vaporized from the cleaning agent ejected from said nozzle body, wherein
a line connector connecting said first and second line comprises a base block for connecting said first and second lines, and an orifice and venturi assembly provided between said base block and said nozzle body.