IP Library Granted Patent US 6,929,534
Granted Patent B2
US 6,929,534 · App. 10/451,381 · Granted Aug 16, 2005

Polisher and polishing method

Assignee: Seiko Epson Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,929,534
App. No.
10/451,381
Granted
Aug 16, 2005
Kind
B2
Abstract

A polisher for polishing a curved surface such as a concave surface of a spectacle lens has a structure in which a polishing pad 3 comprising water passing grooves 5 having a width W of 0.1 to 5 mm is adhered to a dome-shaped elastic base member 2 . The polishing pad 3 is composed of a plurality of pads 31 , and the water passing grooves 5 are formed at the gaps between the pads 31 , whereby the width W of the water passing grooves 5 are made small. It is effective to make the pads 31 polygonal in shape. The polishing pad 3 covers the moving region 6 of the work 8 to be polished. The polishing pad 3 is adhered through a high-tack adhesive layer 4 . A polishing method is adopted in which such a polisher 1 is used and the work 8 is polished by pressing the polishing pad 3 against the work 8 , whereby the polishing pad 3 adhered to the elastic base member 2 can be prevented from being stripped by an end edge of the work 8 , and generation of defective polish can be prevented.

Claims (30)

1. A polisher comprising:

a polishing pad which is adhered to a surface of an elastic base member through a high-tack adhesive layer having a 180° peel strength of equal to or more than 1000 g/25 mm,

the polishing pad comprising water passing grooves having a width of 0.1 to 5 mm.

2. A polisher as set forth in claim 1 ,

wherein said polishing pad is provided with a plurality of pads, and

said water passing grooves are formed between said plurality of pads.

3. A polisher as set forth in claim 2 , wherein said pads are polygonal in shape.

4. A polisher as set forth in claim 2 , wherein said polishing pad is comprised of a pad having notch portions and pads disposed in said notch portions.

5. A polisher as set forth in claim 1 , wherein said polishing pad is provided on said elastic base member so as to cover at least the region where a work to be polished is brought into a rubbing motion during polishing of said work.

6. A polisher as set forth in claim 1 , wherein

a primer layer and/or a low-tack adhesive layer is intermediately provided between said high-tack adhesive layer and said polishing pad.

7. A polisher as set forth in claim 1 , wherein

said high-tack adhesive layer is a double-faced adhesive tape.

8. A polisher as set forth in claim 1 , wherein said elastic base member has a curved surface shape.

9. A polisher as set forth in claim 1 , wherein said elastic base member is provided with an elastic sheet.

10. A polisher wherein a polishing pad is adhered to a surface of an elastic base member through a high-tack adhesive layer having a 180° peel strength according to JIS Z 0237 of equal to or more than 1000 g/25 mm.

11. A polisher as set forth in claim 10 , wherein said polishing pad is adhered so as to cover at least the region where a work to be polished is brought into a rubbing motion during polishing of said work.

12. A polisher as set forth in claim 10 , wherein said elastic base member is comprised of an elastic sheet having a curved surface shape.

13. A polishing method comprising:

polishing a work to be polished by pressing a polishing pad of a polisher against a work surface of said work,

said polisher having said polishing pad adhered to a surface of an elastic base member through a high-tack adhesive layer having a 180° peel strength of equal to or more than 1000 g/25 mm, and

said polishing pad comprising water passing grooves having a width of 0.1 to 5 mm.

14. A polishing method as set forth in claim 13 , wherein polishing is conducted while pressing an inside surface of said elastic base member which is comprised of an elastic sheet and dome-shaped by a pressure fluid.

15. A polishing method as set forth in claim 13 , wherein said work is oscillated while said polisher and said work are rotated respectively about their axes.

16. A polishing method as set forth in claim 13 ,

wherein said polishing pad is provided with a plurality of pads, and

said water passing grooves are formed between said plurality of pads.

17. A polishing method as set forth in claim 16 , wherein said pads are polygonal in shape.

18. A polishing method as set forth in claim 16 , wherein said polishing pad is provided with a pad having notch portions and pads disposed in said notch portions.

19. A polishing method as set forth in claim 13 , wherein said polishing pad is provided on said elastic base member so as to cover at least the region where said work is brought into a rubbing motion during polishing of said work.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2013
From: SEIKO EPSON CORPORATION
To: HOYA LENS MANUFACTURING PHILIPPINES INC.
Reel/Frame 030822/0408 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2003
From: MIYAZAWA, MAKOTO
To: SEIKO EPSON CORPORATION
Reel/Frame 014549/0371 →
Priority Claims (1)
JP 2001-000677 · Jan 5, 2001 · national
Continuity (1)
Related Publication 20040043710A1 · Mar 4, 2004