Method for stripping sacrificial layer in MEMS assembly
The present invention provides methods of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate, where the MEMS device has a sacrificial layer over components formed therein. The method also includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes removing the sacrificial layer through the opening. A MEMS assembly constructed according to a process of the present invention is also disclosed.
1. A method of manufacturing a MEMS assembly, comprising:
mounting a MEMS device on an assembly substrate, the MEMS device having a sacrificial layer;
coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, the coupling maintaining an opening to the interior of the MEMS assembly; and
removing the sacrificial layer through the opening.
2. A method according to claim 1 , wherein the sacrificial layer is a protective photoresist.
3. A method according to claim 1 , wherein the coupling comprises tack-welding.
4. A method according to claim 3 , wherein the opening comprises spaces between tack-welding beads formed during the tack-welding.
5. A method according to claim 1 , wherein the opening comprises a vent in the assembly substrate.
6. A method according to claim 1 , wherein the removing comprises removing the sacrificial layer using a supercritical compound introduced through the opening.
7. A method according to claim 6 , wherein the supercritical compound is compressed CO 2 .
8. A method according to claim 1 , further comprising lubricating components formed on the MEMS device by introducing a lubricant through the opening.
9. A method according to claim 1 , further comprising sealing the opening after removing the protective layer.
10. A method according to claim 1 , wherein the mounting includes mounting a MEMS device on an assembly substrate by removing portions of the sacrificial layer covering bond pads on the MEMS device, and wire-bonding to the exposed bond pads and to bond pads on the assembly substrate.