IP Library › Granted Patent US 6,870,257
Granted Patent B2
US 6,870,257 · App. 10/455,907 · Granted Mar 22, 2005

Power delivery through a flex tape in decoupled I/O-power hybrid substrate

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,870,257
App. No.
10/455,907
Granted
Mar 22, 2005
Kind
B2
Abstract

A apparatus is disclosed for use as part of the packaging of an integrated circuit. The apparatus includes one or more flex tapes coupled to the integrated circuit. These flex tapes are utilized to deliver power to the integrated circuit.

Claims (40)

1. An apparatus comprising:

a core substrate;

a flexible I/O (input/output) signal routing substrate coupled to said core substrate;

a flexible power delivery substrate coupled to said core substrate; and

an integrated circuit coupled to at least one of said flexible I/O signal routing substrate and said flexible power delivery substrate.

2. The apparatus of claim 1 wherein said integrated circuit is electrically coupled to said core substrate through said flexible power delivery substrate.

3. The apparatus of claim 1 wherein said integrated circuit is electrically coupled to said core substrate through said flexible I/O signal routing substrate.

4. The apparatus of claim 1 wherein said flexible power delivery substrate comprises I/O signal traces.

5. The apparatus of claim 1 wherein said flexible I/O signal routing substrate comprises power layers.

6. The apparatus of claim 1 wherein said flexible power delivery substrate comprises I/O signal routing traces and said flexible I/O signal routing substrate comprises power layers.

7. The apparatus of claim 1 wherein said flexible I/O signal routing substrate is coupled to said integrated circuit at a periphery of said integrated circuit.

8. The apparatus of claim 1 wherein said flexible I/O signal routing substrate comprises a pair of signal traces, said pair of signal traces disposed in proximity to each other to facilitate differential pair signaling.

9. The apparatus of claim 1 wherein said flexible power delivery substrate comprises a power layer and at least one ground layer.

10. The apparatus of claim 1 wherein said flexible I/O signal routing substrate comprises an optical transmission material.

11. The apparatus of claim 1 wherein said flexible I/O signal routing substrate comprises an electromagnetic transmission material.

12. The apparatus of claim 1 wherein said core substrate comprises power paths.

13. The apparatus of claim 1 wherein said flexible I/O signal routing substrate comprises a polyimide.

14. The apparatus of claim 1 wherein said flexible I/O signal routing substrate comprises a dielectric material, said dielectric material comprising a loss tangent less than 0.01 including a dielectric constant less than 3.

15. The apparatus of claim 1 wherein said flexible power delivery substrate is connected to a motherboard.

16. The apparatus of claim 1 wherein said flexible power delivery substrate comprises a dielectric material and wherein said dielectric material comprises a dielectric constant greater than 100.

17. An apparatus comprising:

a core substrate;

a flexible I/O (input/output) signal routing substrate upon said core substrate;

a flexible power delivery substrate upon said core substrate; and

an integrated circuit coupled to at least one of said flexible I/O signal routing substrate and said flexible power delivery substrate.

18. The apparatus of claim 17 wherein said integrated circuit is electrically coupled to said core substrate through said flexible power delivery substrate.

19. The apparatus of claim 17 wherein said flexible power delivery substrate comprises I/O signal routing traces and said flexible I/O signal routing substrate comprises power layers.

20. The apparatus of claim 17 wherein said flexible I/O signal routing substrate is coupled to said integrated circuit at a periphery of said integrated circuit.

21. The apparatus of claim 17 wherein said flexible I/O signal routing substrate comprises one or more pairs of signal traces, said pair of signal traces disposed in proximity to each other to facilitate differential pair signaling.

22. The apparatus of claim 17 wherein said flexible power delivery substrate comprises a power layer and at least one ground layer.

23. The apparatus of claim 17 wherein said flexible power delivery substrate is connected to a motherboard.

24. The apparatus of claim 17 wherein said flexible power delivery substrate comprises a dielectric material and wherein said dielectric material comprises a dielectric constant greater than 100.

25. An apparatus comprising:

a core substrate;

a flexible power delivery substrate upon said core substrate; and

an integrated circuit upon said flexible power delivery substrate.

26. The apparatus of claim 25 wherein said flexible power delivery substrate is connected to a motherboard.

27. The apparatus of claim 25 wherein said flexible power delivery substrate comprises a dielectric material and wherein said dielectric material comprises a dielectric constant greater than 100.

28. The apparatus of claim 25 wherein said flexible power delivery substrate comprises a power layer and at least one ground layer.

29. The apparatus of claim 25 wherein said integrated circuit is electrically coupled to said core substrate through said flexible power delivery substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →