IP Library Granted Patent US 7,183,604
Granted Patent B2
US 7,183,604 · App. 10/459,360 · Granted Feb 27, 2007

High dielectric constant device

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Quick Facts
Patent No.
US 7,183,604
App. No.
10/459,360
Granted
Feb 27, 2007
Kind
B2
Abstract

Dielectric material compositions comprising HfO 2 and a second compound are disclosed. The compositions are characterized by at least a part of the compositions being in a cubic crystallographic phase. Further, semiconductor based devices comprising such dielectric material compound and method for forming such compounds are disclosed.

Claims (16)

1. A device comprising:

a gate electrode,

a substrate having a top surface underlying the gate electrode, and

a dielectric layer interposed between the gate electrode and the top surface, the dielectric layer comprising a composition including HfO 2 and a second compound, wherein at least a portion of the composition is in a cubic crystallographic phase.

2. The device of claim 1 , further comprising a channel region,

the channel region underlying the dielectric layer.

3. The device of claim 1 , further comprising a second electrode,

the second electrode underlying the dielectric layer.

4. The device of claim 1 , wherein a dielectric constant of the dielectric layer is higher than a dielectric constant of pure HfO 2 .

5. The device of claim 1 , wherein the composition is stable at temperatures below 1200 degrees C.

6. The device of claim 1 , wherein the second compound comprises one of a metal oxide or a metal oxynitride.

7. The device of claim 1 , wherein the second compound comprises Al 2 O 3 .

8. The device of claim 1 , wherein the amount of the second compound is between 1 [mol]% and 50 [mol]%.

9. The device of claim 1 , wherein the dielectric layer has a thickness between 5 and 100 angstroms.

10. The device of claim 1 , wherein the dielectric layer has an equivalent oxide thickness between 0.5 and 15 angstroms.

11. The device of claim 1 , further comprising an interfacial layer between the dielectric layer and the substrate.

Assignments (3)
CHANGE OF NAME Recorded Oct 26, 2009
From: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
To: IMEC
Reel/Frame 023419/0185 →
DOCUMENT PREVIOUSLY RECORDED AT REEL 014439 FRAME 0776 CONTAINED AN ERROR IN SERIAL NUMBER 10/449360. DOCUMENT RE-RECORDED TO CORRECT ERROR ON STATED REEL Recorded Apr 8, 2004
From: CARTIER, EDUARD; CHEN, JERRY; ZHAO, CHAO
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
Reel/Frame 015186/0114 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2003
From: CARTIER, EDUARD; CHEN, JERRY; ZHAO, CHAO
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW)
Reel/Frame 014439/0776 →