Patent Assignment
Reel/Frame 023419/0185
Change of Name
Recorded: 2009-10-26
Pages: 20
Assignor
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
Executed: 1984-01-16
Assignee
IMEC
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Properties
(14)
Device and Circuit for Electrostatic Discharge and Overvoltage Protection Applications
Patent:
6,570,226 →
Application:
09/586,699 →
Layout Configurable Electrostatic Discharge Device for Integrated Circuits
High Dielectric Constant Device
Method for Coating Substrates
Methods for Selective Integration of Airgaps and Devices Made by Such Methods
Method of Producing Microcrystalline Silicon Germanium Suitable for Micromachining
Method for Forming a Fully Silicided Gate and Devices Obtained Thereof
Methods and Systems for Improved Optical Lithographic Processing
Method for Creating Narrow Trenches in Dielectric Materials
Voltage Controlled Oscillator (Vco) with Simultaneous Switching of Frequency Band, Oscillation Core and Varactor Size
Polymer Replicated Interdigitated Electrode Array for (Bio) Sensing Applications
A/D Converter Comprising a Voltage Comparator Device
Mosfet Devices and Methods for Making Them
Method for Reducing Substrate Charging
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 2, 2003
From: CARTIER, EDUARD; CHEN, JERRY; ZHAO, CHAO
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC VZW)
Reel/Frame 014439/0776 →
Security Interest
Oct 15, 2003
From: AMI SEMICONDUCTOR, INC.
To: CREDIT SUISSE FIRST BOSTON, AS COLLATERAL AGENT
Reel/Frame 014546/0868 →
Document Previously Recorded at Reel 014439 Frame 0776 Contained an Error in Serial Number 10/449360. Document Re-Recorded to Correct Error on Stated Reel
Apr 8, 2004
From: CARTIER, EDUARD; CHEN, JERRY; ZHAO, CHAO
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
Reel/Frame 015186/0114 →
Assignment of Assignor's Interest
Oct 22, 2004
From: FYEN, WIM; MERTENS, PAUL W.
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
Reel/Frame 015911/0680 →
Assignment of Assignor's Interest
Dec 10, 2004
From: DE MUSSY, JEAN PAUL GUENEAU; BEYER, GERALD; MAEX, KAREN
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
Reel/Frame 016060/0831 →
Security Interest
Jun 1, 2005
From: AMI SEMICONDUCTOR, INC.
To: CREDIT SUISSE (F/K/A CREDIT SUISEE FIRST BOSTON), AS COLLATERAL AGENT
Reel/Frame 016290/0206 →
Assignment of Assignor's Interest
Apr 12, 2006
From: WITVROUW, ANN; GROMOVA, MARIA; SCHAEKERS, MARC; VANHAELEMEERSCH, SERGE
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
Reel/Frame 017462/0131 →
Assignment of Assignor's Interest
Sep 29, 2006
From: KITTL, JORGE ADRIAN; LAUWERS, ANNE; VELOSO, ANABELA; KOTTANTHARYIL, ANIL
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM; TEXAS INSTRUMENTS INCORPORATED; KONINKLIJKE PHILIPS ELECTRONICS
Reel/Frame 018328/0019 →
Assignment of Assignor's Interest
Oct 2, 2006
From: OP DE BEECK, MARIA
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
Reel/Frame 018334/0540 →
Assignment of Assignor's Interest
Nov 17, 2006
From: BEYER, GERALD, MR.
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
Reel/Frame 018533/0383 →
Patent Release
Mar 21, 2008
From: CREDIT SUISSE
To: AMI SEMICONDUCTOR, INC.
Reel/Frame 020679/0505 →
Assignment of Assignor's Interest
Nov 4, 2008
From: VAN DER PLAS, GEERT; NUZZO, PIERLUIGI; DE BERNARDINIS, FERNANDO
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM
Reel/Frame 021783/0059 →
Assignment of Assignor's Interest
Nov 18, 2008
From: LAUREYN, WIM; SULS, JAN; JACOBS, PAUL
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM; INNOGENETICS
Reel/Frame 021853/0289 →
Assignment of Assignor's Interest
Dec 15, 2008
From: CHANG, SHIH-HSUN; RAGNARSSON, LARS-AKE
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM; TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 021980/0320 →
Assignment of Assignor's Interest
Jan 13, 2009
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 022092/0572 →
Assignment of Assignor's Interest
Jan 15, 2009
From: CRANINCKX, JAN; HAUSPIE, DRIES; KUHNERT, HOLGER
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM; SAMSUNG ELECTRONICS CO. LTD.
Reel/Frame 022112/0662 →
Corrective Assignment to Correct the Assignee, Samsung Electronics Co. Ltd.'S Address Previously Recorded on Reel 022112 Frame 0662. Assignor(S) Hereby Confirms the Assignee, Samsung Electronics Co. Ltd., Is Located in the Republic of Korea.
Feb 25, 2009
From: CRANINCKX, JAN; HAUSPIE, DRIES; KUHNERT, HOLGER
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM; SAMSUNG ELECTRONICS CO. LTD.
Reel/Frame 022312/0672 →
Assignment of Assignor's Interest
Jun 18, 2009
From: DE WOLF, INGRID; ROTTENBERG, XAVIER; CZARNECKI, PIOTR; SOUSSAN, PHILIPPE
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM; KATHOLIEKE UNIVERSITEIT LEUVEN, K.U. LEUVEN R&D
Reel/Frame 022842/0947 →
Release of Security Interest
Apr 5, 2016
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH (F/K/A CREDIT SUISSE FIRST BOSTON)
To: AMI SEMICONDUCTOR, INC.; AMI SPINCO, INC.
Reel/Frame 038355/0131 →
Security Interest
Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest.
Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →