IP Library › Assignment 064070/0001
Patent Assignment
Reel/Frame 064070/0001

RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087

Recorded: 2023-06-22 Received: 2023-06-22 Pages: 510
Assignor
Assignees
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, AZ, 85008, UNITED STATES
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, AZ, 85008, UNITED STATES
Covered Applications (100)
AREA-FRIENDLY METHOD FOR PROVIDING DUTY CYCLE INVERSE TO SUPPLY VOLTAGE
App. No. 15/092,904
→
CONTROLLING AN OUTPUT SIGNAL INDEPENDENTLY OF THE FIRST HARMONIC
App. No. 15/092,982
→
WIRE BONDING SYSTEMS AND RELATED METHODS
App. No. 15/091,436
→
ULTRASONIC CONTROL SYSTEM AND METHOD FOR A BUCK-BOOST POWER CONVERTER
App. No. 15/084,345
→
LOW VOLTAGE SWITCH CONTROL
App. No. 15/079,291
→
METHOD TO IMPROVE ANALOG FAULT COVERAGE USING TEST DIODES
App. No. 15/073,009
→
TUNABLE RESONANT INDUCTIVE COIL SYSTEMS FOR WIRELESS POWER TRANSFER AND NEAR FIELD COMMUNICATIONS
App. No. 15/073,106
→
FUSE ELEMENT PROGRAMMING CIRCUIT AND METHOD
App. No. 15/073,121
→
SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 15/063,011
→
HYBRID CIRCUIT DEVICE
App. No. 15/054,233
→
IMAGE SENSOR WITH BURIED-CHANNEL DRAIN (BCD) TRANSISTORS
App. No. 15/052,574
→
METHOD OF FORMING A SEMICONDUCTOR DEVICE INCLUDING TRENCH TERMINATION
App. No. 15/047,874
→
OVER POWER PROTECTION FOR POWER CONVERTER
App. No. 15/042,357
→
SCHOTTKY DEVICE AND METHOD OF MANUFACTURE
App. No. 15/040,650
→
POWER CONVERTER WITH HYSTERETIC BUCK-BOOST ARCHITECTURE AND METHOD THEREFOR
App. No. 15/019,288
→
SEMICONDUCTOR DEVICE HAVING LOCALIZED CHARGE BALANCE STRUCTURE AND METHOD
App. No. 15/009,380
→
METHOD OF MANUFACTURING A CIRCUIT DEVICE
App. No. 15/003,958
→
IMAGING SYSTEMS WITH BACKSIDE ISOLATION TRENCHES
App. No. 14/994,534
→
INSULATED GATE SEMICONDUCTOR DEVICE HAVING A SHIELD ELECTRODE STRUCTURE AND METHOD
App. No. 14/992,106
→
METHOD OF FORMING A HIGH ELECTRON MOBILITY SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
App. No. 14/989,370
→
SEMICONDUCTOR LEADFRAMES AND PACKAGES WITH SOLDER DAMS AND RELATED METHODS
App. No. 14/983,863
→
METHOD OF FORMING A SEMICONDUCTOR DEVICE
App. No. 14/971,732
→
TRIMMING METHOD FOR CURRENT SENSE AMPLIFIERS
App. No. 14/967,529
→
SEMICONDUCTOR WAFER INCLUDING A MONOCRYSTALLINE SEMICONDUCTOR LAYER SPACED APART FROM A POLY TEMPLATE LAYER
App. No. 14/966,649
→
IMAGERS WITH DEPTH SENSING CAPABILITIES
App. No. 14/966,045
→
VBUS POWER SWITCH
App. No. 14/960,908
→
CONTROL CIRCUIT AND METHOD
App. No. 14/951,744
→
ELECTRONIC DEVICE INCLUDING A DIODE
App. No. 14/945,735
→
REMOTE GROUND SENSING FOR REDUCED CROSSTALK OF HEADSET AND MICROPHONE AUDIO SIGNALS
App. No. 14/944,702
→
SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
App. No. 14/939,873
→
METHOD AND APPARATUS FOR ZERO CURRENT DETECTION
App. No. 14/937,667
→
DIGITAL-TO-ANALOG CONVERTER
App. No. 14/937,175
→
TEMPERATURE STABLE REFERENCE CURRENT
App. No. 14/936,927
→
SEMICONDUCTOR DEVICE HAVING LOCALIZED CHARGE BALANCE STRUCTURE AND METHOD
App. No. 14/930,060
→
AUDIO CROSSTALK CALIBRATION SWITCH
App. No. 14/928,157
→
AN IMPROVED PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT
App. No. 14/927,871
→
TRANSDUCER CONTROLLER AND METHOD THEREFOR
App. No. 14/919,030
→
METHOD OF FORMING A SEMICONDUCTOR DIE CUTTING TOOL
App. No. 14/885,804
→
DETECTING TRANSIENT SIGNALS USING STACKED-CHIP IMAGING SYSTEMS
App. No. 14/881,452
→
PIXELS WITH A GLOBAL SHUTTER AND HIGH DYNAMIC RANGE
App. No. 14/877,722
→
MOTOR CONTROLLER WITH FLEXIBLE PROTECTION MODES
App. No. 14/875,884
→
EFFICIENT MULTI-MODE DC-DC CONVERTER
App. No. 14/873,406
→
IMAGING SYSTEMS WITH CLEAR FILTER PIXELS
App. No. 14/871,520
→
PIXELS WITH MULTIPLE CHARGE STORAGE REGIONS
App. No. 14/870,522
→
IMAGING SYSTEMS WITH FLICKER MITIGATION AND HIGH DYNAMIC RANGE
App. No. 14/870,578
→
PLASMA ETCH SINGULATED SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 14/870,440
→
METHOD FOR FORMING A SEMICONDUCTOR IMAGE SENSOR DEVICE
App. No. 14/869,490
→
SEMICONDUCTOR STRUCTURE INCLUDING A DOPED BUFFER LAYER AND A CHANNEL LAYER AND A PROCESS OF FORMING THE SAME
App. No. 14/867,131
→
CALIBRATION FOR SPREAD SPECTRUM CLOCK GENERATOR AND METHOD THEREFOR
App. No. 14/864,135
→
SPREAD SPECTRUM CLOCK GENERATOR AND METHOD THEREFOR
App. No. 14/864,060
→
PIXELS WITH AN ACTIVE RESET CIRCUIT IN CMOS IMAGE SENSORS
App. No. 14/862,830
→
HIGH DYNAMIC RANGE AND GLOBAL SHUTTER IMAGE SENSOR PIXELS HAVING CHARGE OVERFLOW SIGNAL DETECTING STRUCTURES
App. No. 14/862,859
→
METHOD OF FORMING A SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
App. No. 14/856,070
→
METHOD OF FORMING A SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
App. No. 14/856,040
→
FAST AND STABLE ULTRA LOW DROP-OUT (LDO) VOLTAGE CLAMP DEVICE
App. No. 14/855,033
→
ELECTROSTATIC DISCHARGE (ESD) ROBUST TRANSISTORS AND RELATED METHODS
App. No. 14/852,912
→
TRIGGERED-EVENT SIGNALING WITH DIGITAL ERROR REPORTING
App. No. 14/853,307
→
HETEROJUNCTION SEMICONDUCTOR DEVICE HAVING INTEGRATED CLAMPING DEVICE
App. No. 14/853,720
→
CASCODE SEMICONDUCTOR DEVICE STRUCTURE AND METHOD THEREFOR
App. No. 14/853,729
→
HIGH EFFICIENCY IMAGE SENSOR PIXELS WITH DEEP TRENCH ISOLATION STRUCTURES AND EMBEDDED REFLECTORS
App. No. 14/852,194
→
ELECTRICAL SAFETY DEVICE MISWIRE DETECTION
App. No. 14/850,271
→
METHOD OF FORMING A SEMICONDUCTOR DIE
App. No. 14/849,779
→
POWER-DOWN DISCHARGER
App. No. 14/844,927
→
RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND LEAD FRAME
App. No. 14/844,427
→
FIELD-EFFECT TRANSISTOR WITH INTEGRATED SCHOTTKY CONTACT
App. No. 14/843,852
→
TUNABLE/DE-TUNABLE WIRELESS POWER RESONATOR SYSTEM AND RELATED METHODS
App. No. 14/843,819
→
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
App. No. 14/842,571
→
CIRCUIT INCLUDING A RECTIFYING ELEMENT
App. No. 14/841,530
→
SENSOR-LESS CIRCUIT AND METHOD FOR DETECTING A ROTOR POSITION
App. No. 14/838,834
→
SENSOR-LESS CIRCUIT AND METHOD FOR DETECTING A ROTOR POSITION
App. No. 14/838,782
→
AUTOMATIC ZEROING AND DETECTION CIRCUIT AND METHOD
App. No. 14/838,897
→
PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A DRIFT REGION, A SINKER REGION, AND A RESURF REGION
App. No. 14/837,228
→
BACK-SIDE ILLUMINATED PIXELS WITH INTERCONNECT LAYERS
App. No. 14/836,599
→
AUXILIARY SELF-PROTECTING TRANSISTOR STRUCTURE
App. No. 14/834,772
→
BIASED ESD CIRCUIT
App. No. 14/834,554
→
OPTIMIZED CURRENT PULSE CHARGING APPARATUS AND METHOD EMPLOYING INCREASING CLAMP REFERENCE VOLTAGES AND DECREASING CURRENT PULSES
App. No. 14/834,577
→
BULK CURRENT REGULATION LOOP
App. No. 14/833,229
→
SYSTEMS AND METHODS FOR WEIGHTED IMAGE SIGNAL READOUT
App. No. 14/831,437
→
SEMICONDUCTOR DIE BACK LAYER SEPARATION METHOD
App. No. 14/827,110
→
INTEGRATED CIRCUIT CONTROL OF ANTI-SERIES SWITCHES
App. No. 14/820,597
→
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
App. No. 14/816,520
→
BATTERY SYSTEM RESET SYSTEMS AND RELATED METHODS
App. No. 14/814,662
→
BATTERY PROTECTION SYSTEM WITH REFERENCE VOLTAGE CONTROL SYSTEM
App. No. 14/814,305
→
AUTOMATICALLY PROGRAMMABLE BATTERY PROTECTION SYSTEM AND RELATED METHODS
App. No. 14/813,314
→
HIGH ELECTRON MOBILITY SEMICONDUCTOR DEVICE AND METHOD THEREFOR
App. No. 14/814,106
→
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
App. No. 14/812,200
→
DIE BONDING TO A BOARD
App. No. 14/812,846
→
FLIP CHIP BONDING ALLOYS
App. No. 14/812,861
→
AUTOMATICALLY PROGRAMMABLE BATTERY PROTECTION SYSTEM AND RELATED METHODS
App. No. 14/811,973
→
PROGRAMMABLE BATTERY PROTECTION SYSTEM AND RELATED METHODS
App. No. 14/809,425
→
SEMICONDUCTOR DEVICES HAVING SUPER-JUNCTION TRENCHES WITH CONDUCTIVE REGIONS AND METHOD OF MAKING THE SAME
App. No. 14/809,749
→
INDUCTIVE-ENERGY-BASED AUTO-TUNING DC-TO-DC CONTROLLER
App. No. 14/808,708
→
METHOD OF SINGULATING SEMICONDUCTOR WAFER HAVING BACK LAYER
App. No. 14/808,729
→
Circuit And An Integrated Circuit Including A Transistor And Another Component Coupled Thereto
App. No. 14/808,627
→
HIGH DYNAMIC RANGE IMAGING PIXELS WITH LOGARITHMIC RESPONSE
App. No. 14/806,249
→
OPTICAL TOUCH SCREEN SYSTEM USING RADIATION PATTERN SENSING AND METHOD THEREFOR
App. No. 14/806,388
→
MULTI-DIE MEMS PACKAGE
App. No. 14/804,691
→
SEMICONDUCTOR DIODE AND METHOD OF MANUFACTURE
App. No. 14/803,365
→
METHOD OF FORMING A SEQUENCING SYSTEM AND STRUCTURE THEREFOR
App. No. 14/804,166
→
RECESSED LEAD LEADFRAME PACKAGES
App. No. 14/800,881
→