Wire bonding systems and related methods
A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.
1. A wire bond system comprising:
a bond wire comprising Cu;
a bond pad comprising an aluminum alloy; and
a sacrificial anode electrically coupled with the bond pad;
wherein the sacrificial anode does not physically contact the bond pad.
2. The system of claim 1 , wherein the sacrificial anode comprises one of Mg, Hf, Be, or any combination thereof.
3. A wire bond system comprising:
a bond wire comprising Cu;
a bond pad comprising an aluminum alloy;
a sacrificial anode physically and electrically coupled over at least a portion of the bond pad; and
one of an alloy stack or an intermetallic layer formed through bonding the bond wire through the sacrificial anode with the bond pad.
4. The system of claim 3 , wherein the sacrificial anode comprises one of Mg, Hf, Be, or any combination thereof.
5. A wire bond system comprising:
a bond wire comprising Cu;
a bond pad coupled to the bond wire, the bond pad comprising an aluminum alloy;
a layer forming a sacrificial anode coupled to the bond pad between the bond wire and the bond pad; and
one of an alloy stack or an intermetallic layer formed through bonding the bond wire through the layer with the bond pad.
6. The system of claim 5 , wherein the layer comprises W.
7. The system of claim 5 , wherein the layer comprises Zn.
8. The system of claim 5 , wherein the layer comprises Cr.
9. The system of claim 5 , wherein the layer comprises Sn.
10. The system of claim 5 , wherein the layer comprises one or more elements selected from the group consisting of Mo, Cd, Co, Ni, Fe, Cu, and any combination thereof.