IP Library › Granted Patent US 7,025,853
Granted Patent B2
US 7,025,853 · App. 10/460,464 · Granted Apr 11, 2006

Reactive hot-melt adhesive compositions with improved green strength

Assignee: Rohm and Haas Company
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Quick Facts
Patent No.
US 7,025,853
App. No.
10/460,464
Granted
Apr 11, 2006
Kind
B2
Abstract

A moisture-reactive hot-melt composition, useful as an adhesive, is provided that has improved balance of open time and green strength. In particular, the composition is made from a polyol, a polyisocyante, and an acrylic polymer. Also provided are a method for making such compositions and a method for using such compositions for bonding substrates.

Claims (16)

1. A moisture-reactive hot-melt polymer composition formed by admixing components comprising at least one polyol, at least one polyisocyanate, and at least one acrylic polymer having tertiary-alkyl amide functionality, wherein said acrylic polymer having tertiary alkyl amide functionality has glass transition temperature of 20° C. to 120° C., and wherein said acrylic polymer having tertiary alkyl amide functionality has no hydroxyl functionality.

2. The composition of claim 1 , wherein said acrylic polymer is 1 to 90 weight percent of said composition, based on the total weight of said composition.

3. The composition of claim 1 , wherein said acrylic polymer includes at least one tertiary-alkyl amide functional monomer selected from the group consisting of N-tert-butylacrylamide, N-tert-butylmethacrylamide, 2-acrylamido 2-methylpropane sulfonic acid, diacetone acrylamide, diacetone methacrylamide, N-tert-octyl acrylamide, N-tert-octyl methacrylamide, and mixtures thereof.

4. The composition of claim 1 , wherein said polyol comprises at least one polyester polyol and at least one polyether polyol.

5. The composition of claim 1 , wherein said acrylic polymer is 1 to 90 weight percent of said composition, based on the total weight of said composition; wherein said acrylic polymer includes at least one tertiary-alkyl amide functional monomer selected from the group consisting of N-tert-butylacrylamide, N-tert-butylmethacrylamide, 2-acrylamido 2-methylpropane sulfonic acid, diacetone acrylamide, diacetone methacrylamide, N-tert-octyl acrylamide, N-tert-octyl methacrylamide, and mixtures thereof; and wherein said polyol comprises at least one polyester polyol and at least one polyether polyol.

6. A method of making a moisture-reactive hot-melt composition comprising admixing components comprising at least one polyol, at least one polyisocyanate, and at least one acrylic polymer having tertiary-alkyl amide functionality, wherein said acrylic polymer having tertiary alkyl amide functionality has glass transition temperature of 20° C. to 120° C., and wherein said acrylic polymer having tertiary alkyl amide functionality has no hydroxyl functionality.

7. The method of claim 6 , wherein said acrylic polymer is 1 to 90 weight percent of said composition, based on the total weight of said composition; wherein said acrylic polymer includes at least one tertiary-alkyl amide functional monomer selected from the group consisting of N-tert-butylacrylamide, N-tert-butylmethacrylamide, 2-acrylamido 2-methylpropane sulfonic acid, diacetone acrylamide, diacetone methacrylamide, N-tert-octyl acrylamide, N-tert-octyl methacrylamide, and mixtures thereof; and wherein said polyol comprises at least one polyester polyol and at least one polyether polyol.

8. A method for bonding substrates comprising

(a) making a moisture-reactive hot-melt composition comprising admixing components comprising at least one polyol, at least one polyisocyanate, and at least one acrylic polymer having tertiary-alkyl amide functionality, wherein said acrylic polymer having tertiary alkyl amide functionality has glass transition temperature of 20° C. to 120° C., and wherein said acrylic polymer having tertiary alkyl amide functionality has no hydroxyl functionality;

(b) heating said hot-melt composition;

(c) applying said heated hot-melt composition to a first substrate;

(d) contacting said applied heated hot-melt composition with a second substrate; and

(e) cooling, or allowing to cool, said hot-melt composition.

9. The method of claim 8 , wherein said acrylic polymer is 1 to 90 weight percent of said composition, based on the total weight of said composition; wherein said acrylic polymer includes at least one tertiary-alkyl amide functional monomer selected from the group consisting of N-tert-butylacrylamide, N-tert-butylmethacrylamide, 2-acrylamido 2-methylpropane sulfonic acid, diacetone acrylamide, diacetone methacrylamide, N-tert-octyl acrylamide, N-tert-octyl methacrylamide, and mixtures thereof; and wherein said polyol comprises at least one polyester polyol and at least one polyether polyol.

10. The moisture-reactive hot-melt polymer composition of claim 1 , wherein said acrylic polymer having tertiary alkyl amide functionality has glass transition temperature of 30° C. to 120° C.

11. The method of claim 8 , wherein said acrylic polymer having tertiary alkyl amide functionality has glass transition temperature of 30° C. to 120° C.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2005
From: KESSELMAYER, MARK ALAN
To: ROHM AND HAAS COMPANY
Reel/Frame 017128/0978 →
Continuity (2)
Provisional Application 6039360200 · Jul 3, 2002
Related Publication 20040010095A1 · Jan 15, 2004