IP Library Granted Patent US 6,838,636
Granted Patent B2
US 6,838,636 · App. 10/464,594 · Granted Jan 4, 2005

Two heat sources for welding silicon

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,838,636
App. No.
10/464,594
Granted
Jan 4, 2005
Kind
B2
Abstract

A method of welding two silicon workpieces ( 20, 22 ) together into one member without the formation of cracks along the weld. A first method passes current ( 34, 36 ) through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder ( 38, 40 ) passes along the seam ( 24 ) between the workpieces to weld them together. A second method passing current ( 34 ) through a plate ( 60 ), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.

Claims (26)

1. A method of welding together two silicon workpieces, comprising the steps of:

juxtaposing two silicon workpieces along a seam to be welded;

heating from a first heat source at least large areas of said workpieces, to a heating temperature of at least 600°; and

applying heat from a second heat source to a localized area of at least one of said workpieces adjacent to said seam and included within said large areas to a welding temperature above 1416° C. to weld said workpieces together.

2. The method of claim 1 , wherein said heating temperature is no more than 900° C.

3. The method of claim 1 , wherein heating step heats localized areas of both of said workpieces adjacent said seam.

4. The method of claim 1 , wherein said applying step includes passing a current from a welding tip to said localized area.

5. The method of claim 1 , wherein said applying step includes irradiating said localized area with a laser beam.

6. The method of claim 1 , wherein said applying step includes applying a plasma arc to said localized area.

7. The method of claim 1 , wherein at least one of said workpieces comprises virgin polysilicon.

8. The method of claim 7 , wherein both of said workpieces comprises virgin polysilicon.

9. A method of welding together two silicon workpieces, comprising the steps of:

juxtaposing said two silicon workpieces along a seam to be welded;

contacting at least one of said workpieces to a heating element;

passing a current through said heating element to thereby heat said two juxtaposed workpieces to a temperature of at least 600° C.; and

applying heat from a heat source other than said heating element to a portion of said workpieces adjacent to a localized portion of said seam to weld said workpieces together.

10. The method of claim 9 , wherein said temperature is no more than 900° C.

11. The method of claim 9 , wherein said applying step includes passing electrical current from a welding tip through at least one of said workpieces.

12. The method of claim 9 , wherein said applying step includes plasma welding.

13. The method of claim 9 , wherein said heating element supports both of said two silicon workpieces.

14. The method of claim 9 , wherein said heating element comprises a silicon body.

15. The method of claim 14 , wherein said silicon body has portions having a level of impurities other than oxygen, nitrogen, and carbon of less than 1 ppm.

16. The method of claim 14 , wherein said silicon body has a flat surface capable of supporting both of said workpieces.

17. The method of claim 9 , wherein said heating element can be wrapped around one of said workpieces while contacting the other of said workpieces.

18. The method of claim 9 , wherein at least one of said workpieces comprises virgin polysilicon.

19. The method of claim 18 , wherein both of said workpieces comprise virgin polysilicon.

Assignments (9)
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NO. 7409392 PREVIOUSLY RECORDED AT REEL: 024160 FRAME: 0490. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE. Recorded Jul 6, 2015
From: VENTURE LENDING & LEASING IV, INC.
To: INTEGRATED MATERIALS, INC.
Reel/Frame 036066/0114 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8TH TO LAST PATENT NUMBER LISTED IN EXHIBIT B FROM 10642103 TO 10642013 PREVIOUSLY RECORDED ON REEL 016580 FRAME 0308. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT. Recorded Jul 6, 2015
From: INTEGRATED MATERIALS, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 036074/0185 →
RELEASE OF SECURITY INTEREST Recorded Jul 16, 2010
From: SILICON VALLEY BANK
To: INTEGRATED MATERIALS INC
Reel/Frame 024697/0371 →
SECURITY AGREEMENT Recorded Jun 11, 2010
From: INTEGRATED MATERIALS, INC.
To: FERROTEC (USA) CORPORATION
Reel/Frame 024523/0637 →
SECURITY AGREEMENT Recorded Jun 3, 2010
From: INTEGRATED MATERIALS, INC.
To: SILICON VALLEY BANK
Reel/Frame 024483/0061 →
RELEASE OF SECURITY INTEREST Recorded Mar 29, 2010
From: VENTURE LENDING & LEASING IV, INC.
To: INTEGRATED MATERIALS, INC.
Reel/Frame 024160/0490 →
RELEASE Recorded Mar 29, 2010
From: VENTURE LENDING & LEASING IV, INC.; VENTURE LENDING & LEASING V, INC.
To: INTEGRATED MATERIALS, INC.
Reel/Frame 024160/0454 →
SECURITY AGREEMENT Recorded May 11, 2007
From: INTEGRATED MATERIALS, INC.
To: VENTURE LENDING & LEASING IV, INC.; VENTURE LENDING & LEASING V, INC.
Reel/Frame 019304/0285 →
SECURITY AGREEMENT Recorded May 23, 2005
From: INTEGRATED MATERIALS, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 016580/0308 →