Patent Assignment
Reel/Frame 024697/0371
Release of Security Interest
Recorded: 2010-07-16
Pages: 5
Assignor
SILICON VALLEY BANK
Executed: 2010-07-13
Assignee
INTEGRATED MATERIALS INC
1169 BORREGAS AVE, SUNNYVALE, CALIFORNIA, 94089
Covered Properties
(29)
Method and Apparatus for Securing Components of Wafer Processing Fixtures
Patent:
6,225,594 →
Application:
09/292,491 →
Support Members for Wafer Processing Fixtures
Patent:
6,196,211 →
Application:
09/292,495 →
Method and Apparatus for Fabricating Elongate Crystalline Members
Patent:
6,205,993 →
Application:
09/292,496 →
Method of Fabricating Silicon Structures Including Fixtures for Supporting Wafers
Patent:
6,455,395 →
Application:
09/608,291 →
Silicon Fixtures for Supporting Wafers During Thermal Processing
Patent:
6,450,346 →
Application:
09/608,557 →
Crack free welding of silicon
Patent:
6,284,997 →
Application:
09/708,807 →
Silicon support members for wafer processing fixtures
Wafer Support Fixture Composed of Silicon
High Temperature Hydrogen Anneal of Silicon Wafers Supported on a Silicon Fixture
Silicon Fixture with Roughened Surface Supporting Wafers in Chemical Vapor Deposition
Method for Welding Silicon Workpieces
Welded Silicon Member
Method of Machining Silicon
Two Heat Sources for Welding Silicon
Plasma Spraying for Joining Silicon Parts
Silicon Tube Formed of Bonded Staves
Adhesive of a Silicon and Silica Composite Particularly Useful for Joining Silicon Parts
Silicon Fixture Supporting Silicon Wafers During High Temperature Processing
Baffle Wafers and Randomly Oriented Polycrystalline Silicon Used Therefor
Detachable Edge Ring for Thermal Processing Support Towers
Silicon Shelf Towers
Adhesive of a Silicon and Silica Composite for Bonding Together Silicon Parts
Silicon Parts Joined by a Silicon Layer Preferably Plasma Sprayed
Tube Formed of Bonded Silicon Staves
Tubular or Other Member Formed of Staves Bonded at Keyway Interlocks
Application:
11/536,352 →
Publication:
US 2007/0169701
Baffled Liner Cover
Polysilicon Dummy Wafers and Process Used Therewith
Czochralski Growth of Randomly Oriented Polysilicon and Use of Randomly Oriented Polysilicon Dummy Wafers
Assembly of Silicon Parts Bonded Together with a Silicon and Silica Composite
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 26, 2003
From: BOYLE, JAMES E.; DELANEY, LAURENCE D.
To: INTEGRATED MATERIALS, INC.
Reel/Frame 014522/0478 →
Assignment of Assignor's Interest
Feb 18, 2004
From: BOYLE, JAMES E.; ZEHAVI, RAANAN; CHALZEL, AMNON
To: INTEGRATED MATERIALS, INC.
Reel/Frame 014994/0940 →
Security Agreement
May 23, 2005
From: INTEGRATED MATERIALS, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 016580/0308 →
Assignment of Assignor's Interest
Mar 1, 2006
From: BOYLE, JAMES E.; REYNOLDS, REESE; ZEHAVI, RANAAN Y.; MYTTON, ROBERT W.
To: INTEGRATED MATERIALS, INC.
Reel/Frame 017747/0590 →
Security Agreement
May 11, 2007
From: INTEGRATED MATERIALS, INC.
To: VENTURE LENDING & LEASING IV, INC.; VENTURE LENDING & LEASING V, INC.
Reel/Frame 019304/0285 →
Release
Mar 29, 2010
From: VENTURE LENDING & LEASING IV, INC.; VENTURE LENDING & LEASING V, INC.
To: INTEGRATED MATERIALS, INC.
Reel/Frame 024160/0454 →
Release of Security Interest
Mar 29, 2010
From: VENTURE LENDING & LEASING IV, INC.
To: INTEGRATED MATERIALS, INC.
Reel/Frame 024160/0490 →
Security Agreement
Jun 3, 2010
From: INTEGRATED MATERIALS, INC.
To: SILICON VALLEY BANK
Reel/Frame 024483/0061 →
Security Agreement
Jun 11, 2010
From: INTEGRATED MATERIALS, INC.
To: FERROTEC (USA) CORPORATION
Reel/Frame 024523/0637 →
Merger
Dec 20, 2011
From: INTEGRATED MATERIALS, INC.
To: FERROTEC (USA) CORPORATION
Reel/Frame 027417/0809 →
Corrective Assignment to Correct the 8TH to Last Patent Number Listed in Exhibit B from 10642103 to 10642013 Previously Recorded on Reel 016580 Frame 0308. Assignor(S) Hereby Confirms the Security Agreement.
Jul 6, 2015
From: INTEGRATED MATERIALS, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 036074/0185 →
Corrective Assignment to Correct the Incorrect Patent No. 7409392 Previously Recorded at Reel: 024160 Frame: 0490. Assignor(S) Hereby Confirms the Release.
Jul 6, 2015
From: VENTURE LENDING & LEASING IV, INC.
To: INTEGRATED MATERIALS, INC.
Reel/Frame 036066/0114 →
Assignment of Assignor's Interest
Dec 9, 2021
From: FERROTEC (USA) CORPORATION
To: HANGZHOU DUNYUANJUXIN SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 058344/0034 →