Plasma spraying for joining silicon parts
View Patent ↗A method of joining two silicon members and the bonded assembly in which the members are assembled to place them into alignment across a seam. Silicon derived from silicon powder is plasma sprayed across the seam and forms a silicon coating that bonds to the silicon members on each side of the seam to thereby bond together the members. The plasma sprayed silicon may seal an underlying bond of spin-on glass or may act as the primary bond, in which case through mortise holes are preferred so that two layers of silicon are plasma sprayed on opposing ends of the mortise holes. A silicon wafer tower or boat may be the final product. The method may be used to form a ring or a tube from segments or staves arranged in a circle. Plasma spraying silicon may repair a crack or chip formed in a silicon member.
1. A method of joining two silicon parts, comprising plasma spraying silicon across a seam separating said two silicon parts to form a coating on adjacent surface areas of said two silicon parts, wherein the silicon parts are juxtaposed during the plasma spraying step with the seam separating them and wherein the plasma spraying coats silicon onto both of the silicon parts.
2. The method of claim 1 , wherein the parts are subjected to atmospheric pressure during said plasma spraying.
3. The method of claim 1 , wherein portions of the parts adjacent the seam are held at a temperature of no more than 500° C.
4. The method of claim 3 , wherein said temperature is no more than 200° C.
5. The method of claim 1 , wherein said plasma spraying includes injecting silicon powder into a plasma of a gas.
6. The, method of claim 5 , wherein said powder comprises particles having diameters in a range of 15 to 45 μm.
7. The method of claim 5 , wherein said powder comprises particles of virgin polysilicon.
8. The method of claim 1 , wherein at least one of said parts is preformed with a bevel adjacent to said seam.
9. The method of claim 1 , wherein prior to the plasma spraying the two parts were juxtaposed but not fixed together and after the plasma spraying the coating fixes the parts together.
10. A method of joining two silicon parts, comprising plasma spraying silicon across a seam separating said two silicon parts to form a coating on adjacent surface areas of said two silicon parts, wherein principal surfaces of said two parts are perpendicular to each other at said seam.
11. A method of joining two silicon parts, comprising plasma spraying silicon across a seam separating said two silicon parts to form a coating on adjacent surface areas of said two silicon parts, wherein at least one of said parts is preformed with a bevel adjacent to said seam.
12. The method of claim 11 , wherein a first one of the parts is preformed with said bevel and a second one of the parts does not have a bevel adjacent to said seam.
13. A method of joining two silicon parts, comprising plasma spraying silicon across a seam separating said two silicon parts to form a coating on adjacent surface areas of said two silicon parts, wherein a first one of said parts includes a hole and a second one of said parts is disposed within said hole and wherein said plasma spraying forms respective silicon layers contacting said first and second parts on opposite ends of said hole.
14. A method of joining the parts of a silicon substrate support fixture comprising (a) first and second silicon bases each having mortise holes formed therein and (b) a plurality of legs comprising silicon, having teeth cut therein for supporting a plurality of substrates in parallel relationship, and inserted into said mortise holes to form respective seams between respective pairs of said bases and said legs, said method comprising the steps of:
assembling together the legs and bases, wherein the legs and bases are not fixed together at a beginning of the plasma spraying step but are fixed together at an end of the plasma spraying step; and
then plasma spraying silicon across said seams to form layers of silicon bonded to said legs and bases across said seams.
15. The method of claim 14 , performed in atmospheric pressure.
16. The method of claim 14 , wherein portions of the parts adjacent the seams during said plasma spraying are held at a temperature of no more than 500° C.
17. A method of joining two silicon parts, comprising:
juxtaposing the two silicon parts to form a seam separating the silicon parts; and
plasma spraying a silicon layer onto adjacent areas of the juxtaposed silicon parts and across the seam, whereby the silicon layers fixes the two silicon parts together.
18. The method of claim 17 , wherein the parts are subjected to atmospheric pressure during the plasma spraying.
19. The method of claim 18 , wherein portions of the parts adjacent the seam are held at a temperature of no more than 500° C.